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    • 1. 发明授权
    • Method for controlling timing of backhaul link and relay system for the same
    • 用于控制回程链路和中继系统的定时的方法
    • US08848596B2
    • 2014-09-30
    • US13016159
    • 2011-01-28
    • Hong Sup ShinYoung Jun KimSang Ha KimIl Doo ChangHee Bong Lee
    • Hong Sup ShinYoung Jun KimSang Ha KimIl Doo ChangHee Bong Lee
    • H04B7/14H04B3/36H04B7/155H04W56/00
    • H04B7/15528H04W56/001
    • Embodiments for providing a method of controlling timing of a downlink backhaul sub-frame and a relay system for the same are disclosed. According to the present invention, a control signal is transmitted to user equipment during a control symbol period of a sub-frame and a data starting point of the sub-frame is set after a time (SG1) for switching from a transmission mode to a reception mode to receive backhaul data of a base station during a backhaul symbol period. Timing of a transmission sub-frame and a reception sub-frame is delayed by the SG1. A sum of a length of the SG1 and a time (SG2) for switching from the reception mode to the transmission mode is shorter than a length of a symbol having a normal CP. At this time, the lengths of the SG1 and the SG2 are identical to each other or the length of the SG2 is shorter than the length of the SG1. In such a case, the backhaul data are received up to a last symbol period of backhaul symbols of the reception sub-frame.
    • 公开了一种用于提供控制下行链路回程子帧的定时的方法和用于其的中继系统的实施例。 根据本发明,在子帧的控制符号周期期间,向用户设备发送控制信号,并且在从发送模式切换到发送模式的时间(SG1)之后设置子帧的数据起始点 在回程符号周期期间接收基站的回程数据的接收模式。 发送子帧和接收子帧​​的定时被SG1延迟。 SG1的长度和从接收模式切换到发送模式的时间(SG2)之和小于具有通常CP的符号的长度。 此时,SG1和SG2的长度彼此相同或者SG2的长度短于SG1的长度。 在这种情况下,回传数据被接收到接收子帧的回程符号的最后符号周期。
    • 5. 发明申请
    • METHOD FOR CONTROLLING TIMING OF BACKHAUL LINK AND RELAY SYSTEM FOR THE SAME
    • 用于控制回传链路和继电器系统的时序的方法
    • US20110243057A1
    • 2011-10-06
    • US13016159
    • 2011-01-28
    • Hong Sup SHINYoung Jun KimSang Ha KimIl Doo ChangHee Bong Lee
    • Hong Sup SHINYoung Jun KimSang Ha KimIl Doo ChangHee Bong Lee
    • H04B7/14
    • H04B7/15528H04W56/001
    • Embodiments for providing a method of controlling timing of a downlink backhaul sub-frame and a relay system for the same are disclosed. According to the present invention, a control signal is transmitted to user equipment during a control symbol period of a sub-frame and a data starting point of the sub-frame is set after a time (SG1) for switching from a transmission mode to a reception mode to receive backhaul data of a base station during a backhaul symbol period. Timing of a transmission sub-frame and a reception sub-frame is delayed by the SG1. A sum of a length of the SG1 and a time (SG2) for switching from the reception mode to the transmission mode is shorter than a length of a symbol having a normal CP. At this time, the lengths of the SG1 and the SG2 are identical to each other or the length of the SG2 is shorter than the length of the SG1. In such a case, the backhaul data are received up to a last symbol period of backhaul symbols of the reception sub-frame.
    • 公开了一种用于提供控制下行链路回程子帧的定时的方法和用于其的中继系统的实施例。 根据本发明,在子帧的控制符号周期期间,向用户设备发送控制信号,并且在从发送模式切换到发送模式的时间(SG1)之后设置子帧的数据起始点 在回程符号周期期间接收基站的回程数据的接收模式。 发送子帧和接收子帧​​的定时被SG1延迟。 SG1的长度和从接收模式切换到发送模式的时间(SG2)之和小于具有通常CP的符号的长度。 此时,SG1和SG2的长度彼此相同或者SG2的长度短于SG1的长度。 在这种情况下,回传数据被接收到接收子帧的回程符号的最后符号周期。
    • 6. 发明申请
    • Home network system and method for remotely installing home services in the same
    • 家庭网络系统和远程安装家庭服务的方法相同
    • US20070275715A1
    • 2007-11-29
    • US11603494
    • 2006-11-22
    • Il Woo LeeHo Jin ParkChan Mi JungSang Ha Kim
    • Il Woo LeeHo Jin ParkChan Mi JungSang Ha Kim
    • H04Q7/20
    • H04L12/2814H04L12/2818H04L63/10H04L67/02
    • A home network system and a method for installing home services in the home network system are provided. The home network system includes a service distribution management system that remotely manages a plurality of home gateways installed in homes of service users and services installed on the plurality of home gateways. The method includes performing user registration of a service user who desires to receive a service, registering a service to be provided to the service user, performing initial registration of a home gateway which a system manager has installed in a home of the service user according to the user registration, managing at least one home gateway group set by the system manager, and performing management of a task for remotely installing a service on a home gateway group that is an installation target of the service.
    • 提供家庭网络系统和在家庭网络系统中安装家庭服务的方法。 家庭网络系统包括远程管理安装在服务用户的家庭中的多个家庭网关和安装在多个家庭网关上的服务的服务分发管理系统。 该方法包括执行希望接收服务的服务用户的用户注册,注册要提供给服务用户的服务,根据服务用户的家庭中的系统管理器已安装的家庭网关进行初始注册 所述用户注册,管理由所述系统管理器设置的至少一个家庭网关组,以及执行用于在作为所述服务的安装目标的家庭网关组上远程安装服务的任务的管理。
    • 9. 发明授权
    • Semiconductor package and method for fabricating the same
    • 半导体封装及其制造方法
    • US06486005B1
    • 2002-11-26
    • US09723246
    • 2000-11-28
    • Sang Ha Kim
    • Sang Ha Kim
    • H01L2148
    • H01L21/568H01L23/3114H01L23/3185H01L24/19H01L24/20H01L24/97H01L2224/04105H01L2224/12105H01L2224/20H01L2224/97H01L2924/01006H01L2924/01027H01L2924/01033H01L2924/14H01L2924/15311H01L2924/18162
    • A semiconductor package and fabricating method are described, in which solder balls can be easily arrayed in a fan-out type arrangement and the package fabricating process is simplified. The semiconductor package includes a unit semiconductor chip and a first stress buffer layer contacting the unit semiconductor chip on two sides of the unit semiconductor chip Bonding pads are separately arrayed on an upper part the unit semiconductor chip, and a second stress buffer layer formed on the first stress buffer layer and on the unit semiconductor chip, but not on an upper surface of each bonding pad. A plurality of conducting lines are formed on the second stress buffer layer, each conducting line contacting the upper surface of a respective bonding pad. A solder mask layer, which having a plurality of holes therein to expose at least one region of each conducting line, is formed over the conducting lines and the second stress buffer layer. A plurality of solder balls are then formed in the holes to contact the conducting lines.
    • 描述了一种半导体封装和制造方法,其中可以容易地以扇出型布置排列焊球,并且简化了封装制造工艺。 半导体封装包括单元半导体芯片和与单元半导体芯片的两侧接触单元半导体芯片的第一应力缓冲层。接合焊盘分别排列在单元半导体芯片的上部,并且形成在第二应力缓冲层上 第一应力缓冲层和单元半导体芯片上,但不在每个焊盘的上表面上。 在第二应力缓冲层上形成多条导线,每条导线与相应焊盘的上表面接触。 在导线和第二应力缓冲层之上形成有在其中具有多个孔以暴露每根导线的至少一个区域的焊料掩模层。 然后在孔中形成多个焊球以接触导线。