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    • 2. 发明授权
    • Method of fabricating a gate array semiconductor integrated circuit
device
    • 制造栅阵列半导体集成电路器件的方法
    • US5891765A
    • 1999-04-06
    • US782944
    • 1997-01-13
    • Kimio UedaHiroyuki MorinakaKoichiro Mashiko
    • Kimio UedaHiroyuki MorinakaKoichiro Mashiko
    • H01L21/82H01L21/84H01L27/118H01L27/12H01L29/786H01L27/01H01L27/10H01L29/76
    • H01L21/84H01L27/118H01L27/11807H01L27/1203
    • In order to improve a withstand voltage and implement a gate array SOI semiconductor integrated circuit device having a large gate width, a region consisting of end cells (49) is provided on each end of a region formed by repeatedly arranging basic cells (BC) consisting of both transistor regions (32, 33) in a first direction and while symmetrically arranging the same to be folded in a second direction. Both ends of a channel region of a PMOS transistor (42) are drawn out in the second direction to provide a P-type semiconductor layer just under a field shielding gate electrode (FG), and this semiconductor layer is drawn also in the first direction to be connected with a P-type semiconductor layer of the end cell (49). A first source potential is applied to a region (PBD) which is bonded with one of the P-type semiconductor layers. Also as to an NMOS transistor (41) which is adjacent through a field oxide film (FO), on the other hand, an N-type semiconductor layer is similarly provided so that this N-type semiconductor layer is also connected with that of the end cell (49). A second source potential is applied to a region (NBD).
    • 为了提高耐压并实现具有较大栅极宽度的栅阵列SOI半导体集成电路器件,在通过重复布置基本单元(BC)形成的区域的每个端部上设置由端单元(49)组成的区域,所述基本单元(BC) 的两个晶体管区域(32,33)在第一方向上并且同时对称地布置在第二方向上被折叠。 PMOS晶体管(42)的沟道区域的两端在第二方向上被拉出以提供刚好在场屏蔽栅极(FG)下面的P型半导体层,并且该半导体层也沿第一方向 与端电池(49)的P型半导体层连接。 将第一源极电位施加到与一个P型半导体层接合的区域(PBD)。 另一方面,与通过场氧化膜(FO)相邻的NMOS晶体管(41)也类似地设置N型半导体层,使得该N型半导体层也与 端单元(49)。 第二源电位被应用于区域(NBD)。
    • 4. 发明授权
    • Square root extraction circuit and floating-point square root extraction
device
    • 平方根提取电路和浮点平方根提取装置
    • US6148318A
    • 2000-11-14
    • US964888
    • 1997-11-05
    • Hiroyuki KawaiRobert StreitenbergerYoshitsugu InoueHiroyuki Morinaka
    • Hiroyuki KawaiRobert StreitenbergerYoshitsugu InoueHiroyuki Morinaka
    • G06F7/552G06F7/38
    • G06F7/5525G06F7/483
    • A square root extraction circuit and a floating-point square root extraction device which simplify a circuit structure and improve an operation speed are provided. Portions for generating square root partial data (q3 to q8) include carry output prediction circuits (3 to 8), respectively. The carry output prediction circuit (i) (i equals any one of 3 to 8) receives condition flags (AHin, ALin), the most significant addition result (SUM), and square root partial data (q(i-1)) from the preceding square root partial data generating portion, and also receives a carry input (Cin) to output condition flags (AHout, ALout) for the next square root partial data generating portion, and square root partial data (q(i)). The condition flags (AHout, ALout) serve as the condition flags (AHin, ALin) for the carry output prediction circuit (i+1), respectively.
    • 提供了简化电路结构并提高操作速度的平方根提取电路和浮点平方根提取装置。 用于产生平方根部分数据(q3至q8)的部分分别包括进位输出预测电路(3至8)。 进位输出预测电路(i)(i等于3至8中的任何一个)从第一个输入预测电路(i)中接收条件标志(AHin,ALin),最高有效相加结果(SUM)和平方根部分数据(q(i-1) 前一平方根部分数据生成部分,并且还接收用于下一个平方根部分数据生成部分的输出条件标志(AHout,ALout)的进位输入(Cin)和平方根部分数据(q(i))。 条件标志(AHout,ALout)分别用作进位输出预测电路(i + 1)的条件标志(AHin,ALin)。
    • 5. 发明授权
    • Square root extraction circuit and floating-point square root extraction device
    • 平方根提取电路和浮点平方根提取装置
    • US06820107B1
    • 2004-11-16
    • US09667783
    • 2000-09-22
    • Hiroyuki KawaiRobert StreitenbergerYoshitsugu InoueHiroyuki Morinaka
    • Hiroyuki KawaiRobert StreitenbergerYoshitsugu InoueHiroyuki Morinaka
    • G06F738
    • G06F7/5525G06F7/483
    • A square root extraction circuit and a floating-point square root extraction device which simplify a circuit structure and improve an operation speed are provided. Portions for generating square root partial data (q3 to q8) include carry output prediction circuits (3 to 8), respectively. The carry output prediction circuit (i) (i equals any one of 3 to 8) receives condition flags (AHin, ALin), the most significant addition result (SUM), and square root partial data (q(i−1)) from the preceding square root partial data generating portion, and also receives a carry input (Cin) to output condition flags (AHout, ALout) for the next square root partial data generating portion, and square root partial data (q(i)). The condition flags (AHout, ALout) serve as the condition flags (AHin, ALin) for the carry output prediction circuit (i+1), respectively.
    • 提供了简化电路结构并提高操作速度的平方根提取电路和浮点平方根提取装置。 用于产生平方根部分数据(q3至q8)的部分分别包括进位输出预测电路(3至8)。 进位输出预测电路(i)(i等于3至8中的任何一个)从第一个输入预测电路(i)中接收条件标志(AHin,ALin),最高有效相加结果(SUM)和平方根部分数据(q(i-1) 前一平方根部分数据生成部分,并且还接收用于下一个平方根部分数据生成部分的输出条件标志(AHout,ALout)的进位输入(Cin)和平方根部分数据(q(i))。 条件标志(AHout,ALout)分别用作进位输出预测电路(i + 1)的条件标志(AHin,ALin)。
    • 9. 发明授权
    • Gate array semiconductor integrated circuit device
    • 门阵列半导体集成电路器件
    • US5633524A
    • 1997-05-27
    • US580609
    • 1995-12-29
    • Kimio UedaHiroyuki MorinakaKoichiro Mashiko
    • Kimio UedaHiroyuki MorinakaKoichiro Mashiko
    • H01L21/82H01L21/84H01L27/118H01L27/12H01L29/786H01L27/10H01L27/01H01L29/76
    • H01L21/84H01L27/118H01L27/11807H01L27/1203
    • In order to improve a withstand voltage and implement a gate array SOI semiconductor integrated circuit device having a large gate width, a region consisting of end cells (49) is provided on each end of a region formed by repeatedly arranging basic cells (BC) consisting of both transistor regions (32, 33) in a first direction and while symmetrically arranging the same to be folded in a second direction. Both ends of a channel region of a PMOS transistor (42) are drawn out in the second direction to provide a P-type semiconductor layer just under a field shielding gate electrode (FG), and this semiconductor layer is drawn also in the first direction to be connected with a P-type semiconductor layer of the end cell (49). A first source potential is applied to a region (PBD) which is bonded with one of the P-type semiconductor layers. Also as to an NMOS transistor (41) which is adjacent through a field oxide film (FO), on the other hand, an N-type semiconductor layer is similarly provided so that this N-type semiconductor layer is also connected with that of the end cell (49). A second source potential is applied to a region (NBD).
    • 为了提高耐压并实现具有较大栅极宽度的栅阵列SOI半导体集成电路器件,在通过重复布置基本单元(BC)形成的区域的每个端部上设置由端单元(49)组成的区域,所述基本单元(BC) 的两个晶体管区域(32,33)在第一方向上并且同时对称地布置在第二方向上被折叠。 PMOS晶体管(42)的沟道区域的两端在第二方向上被拉出以提供刚好在场屏蔽栅极(FG)下面的P型半导体层,并且该半导体层也沿第一方向 与端电池(49)的P型半导体层连接。 将第一源极电位施加到与一个P型半导体层接合的区域(PBD)。 另一方面,与通过场氧化膜(FO)相邻的NMOS晶体管(41)也类似地设置N型半导体层,使得该N型半导体层也与 端单元(49)。 第二源电位被应用于区域(NBD)。