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    • 2. 发明授权
    • Photomask blank, photomask, and method for manufacturing photomask blank
    • 光掩模坯料,光掩模以及制造光掩模坯料的方法
    • US08304147B2
    • 2012-11-06
    • US12935517
    • 2009-03-31
    • Hiroyuki IwashitaHiroaki ShishidoAtsushi KominatoMasahiro Hashimoto
    • Hiroyuki IwashitaHiroaki ShishidoAtsushi KominatoMasahiro Hashimoto
    • G03F1/20
    • G03F1/22G03F1/46G03F1/54G03F1/80H01L21/0274
    • The present invention provides a photomask blank used for producing a photomask to which an ArF excimer laser light is applied, wherein: a light-shielding film is provided on a light transmissive substrate; the light-shielding film has a laminated structure in which a back-surface antireflection layer, a light-shielding layer and a front-surface antireflection layer are laminated in this order from the side close to the light transmissive substrate; the thickness of the entire light-shielding film is 60 nm or less; the back-surface antireflection layer is made of a film containing a metal and has a first etching rate; the front-surface antireflection layer is made of a film containing a metal and has a third etching rate; the light-shielding layer is made of a film containing the same metal as that contained in the back-surface antireflection layer or the front-surface antireflection layer and has a second etching rate that is lower than the first etching rate and the third etching rate; and the thickness of the light-shielding layer is 30% or less of the thickness of the entire light-shielding film.
    • 本发明提供一种用于制造施加了ArF准分子激光的光掩模的光掩模坯料,其中:在透光基板上设置有遮光膜; 遮光膜具有层叠结构,其中背面防反射层,遮光层和前表面抗反射层从靠近透光基板的一侧依次层叠; 整个遮光膜的厚度为60nm以下; 背面抗反射层由含有金属的膜制成,具有第一蚀刻速率; 前表面抗反射层由含有金属的膜制成,具有第三蚀刻速率; 遮光层由含有与背面防反射层或前表面防反射层中所含的金属相同的金属的膜制成,并且具有比第一蚀刻速率和第三蚀刻速率低的第二蚀刻速率 ; 遮光层的厚度为整个遮光膜的厚度的30%以下。
    • 3. 发明申请
    • PHOTOMASK BLANK, PHOTOMASK, AND METHOD FOR MANUFACTURING PHOTOMASK BLANK
    • PHOTOMASK BLANK,PHOTOMASK和制造光电隔离层的方法
    • US20110104592A1
    • 2011-05-05
    • US12935517
    • 2009-03-31
    • Hiroyuki IwashitaHiroaki ShishidoAtsushi KominatoMasahiro Hashimoto
    • Hiroyuki IwashitaHiroaki ShishidoAtsushi KominatoMasahiro Hashimoto
    • G03F1/00
    • G03F1/22G03F1/46G03F1/54G03F1/80H01L21/0274
    • The present invention provides a photomask blank used for producing a photomask to which an ArF excimer laser light is applied, wherein: a light-shielding film is provided on a light transmissive substrate; the light-shielding film has a laminated structure in which a back-surface antireflection layer, a light-shielding layer and a front-surface antireflection layer are laminated in this order from the side close to the light transmissive substrate; the thickness of the entire light-shielding film is 60 nm or less; the back-surface antireflection layer is made of a film containing a metal and has a first etching rate; the front-surface antireflection layer is made of a film containing a metal and has a third etching rate; the light-shielding layer is made of a film containing the same metal as that contained in the back-surface antireflection layer or the front-surface antireflection layer and has a second etching rate that is lower than the first etching rate and the third etching rate; and the thickness of the light-shielding layer is 30% or less of the thickness of the entire light-shielding film.
    • 本发明提供一种用于制造施加了ArF准分子激光的光掩模的光掩模坯料,其中:在透光基板上设置有遮光膜; 遮光膜具有层叠结构,其中背面防反射层,遮光层和前表面抗反射层从靠近透光基板的一侧依次层叠; 整个遮光膜的厚度为60nm以下; 背面抗反射层由含有金属的膜制成,具有第一蚀刻速率; 前表面抗反射层由含有金属的膜制成,具有第三蚀刻速率; 遮光层由含有与背面防反射层或前表面防反射层中所含的金属相同的金属的膜制成,并且具有比第一蚀刻速率和第三蚀刻速率低的第二蚀刻速率 ; 遮光层的厚度为整个遮光膜的厚度的30%以下。
    • 4. 发明授权
    • Photomask blank, photomask, and methods of manufacturing the same
    • 光掩模坯料,光掩模及其制造方法
    • US08865378B2
    • 2014-10-21
    • US13854439
    • 2013-04-01
    • Hiroyuki IwashitaAtsushi KominatoMasahiro HashimotoHiroaki Shishido
    • Hiroyuki IwashitaAtsushi KominatoMasahiro HashimotoHiroaki Shishido
    • G03F1/46G03F1/38G03F1/50G03F1/54
    • G03F1/50G03F1/46G03F1/54
    • A photomask blank is for use in manufacturing a photomask to be applied with exposure light having a wavelength of 200 nm or less. The photomask blank has a light-transmitting substrate and a light-shielding film formed thereon. The light-shielding film has a light-shielding layer containing a transition metal and silicon and a front-surface antireflection layer formed contiguously on the light-shielding layer and made of a material containing at least one of oxygen and nitrogen. The light-shielding film has a front-surface reflectance of a predetermined value or less for the exposure light and has a property capable of controlling the change width of the front-surface reflectance at the exposure wavelength to be within 2% when the thickness of the front-surface antireflection layer changes in the range of 2 nm. The material of the front-surface antireflection layer having a refractive index n and an extinction coefficient k capable of achieving such property is selected.
    • 光掩模坯料用于制造要施加具有200nm或更小的波长的曝光光的光掩模。 光掩模坯料具有形成在其上的透光性基板和遮光膜。 遮光膜具有含有过渡金属和硅的遮光层和在遮光层上连续形成并由含有氧和氮中的至少一种的材料制成的前表面抗反射层。 遮光膜对于曝光光具有预定值以下的正面反射率,并且具有能够将曝光波长处的前表面反射率的变化宽度控制在2%以内的特性,当厚度为 前表面抗反射层在2nm的范围内变化。 选择具有能够实现这种特性的折射率n和消光系数k的前表面抗反射层的材料。
    • 5. 发明授权
    • Photomask blank, photomask, and method for manufacturing photomask blank
    • 光掩模坯料,光掩模以及制造光掩模坯料的方法
    • US08507155B2
    • 2013-08-13
    • US12935464
    • 2009-03-31
    • Hiroyuki IwashitaHiroaki ShishidoAtsushi KominatoMasahiro Hashimoto
    • Hiroyuki IwashitaHiroaki ShishidoAtsushi KominatoMasahiro Hashimoto
    • G03F1/46G03F1/50G03F1/58G03F1/80
    • G03F1/46G03F1/54G03F1/80
    • A photomask blank for a photomask used with an ArF excimer laser. The photo mask has a light transmissive substrate with a surface on which a light-shielding film is formed. The light-shielding film has a laminated structure comprising a back-surface antireflection layer, a light-shielding layer and a front-surface antireflection layer. The thickness of the entire light-shielding film is 70 nm or less. The back-surface antireflection layer comprises a film containing a metal and having first etching rate. The front-surface antireflection layer comprises a film containing a metal and having a third etching rate. The light-shielding layer comprises a film containing the same metal as that contained in the back-surface antireflection layer or the front-surface antireflection layer, with a second etching rate that is lower than the first and third etching rates. The thickness of the light-shielding layer is 45% or less of the thickness of the entire light-shielding film.
    • 用于与ArF准分子激光器一起使用的光掩模的光掩模坯料。 光掩模具有其上形成有遮光膜的表面的透光基板。 遮光膜具有包括背面防反射层,遮光层和前表面抗反射层的层叠结构。 整个遮光膜的厚度为70nm或更小。 背面抗反射层包括含有金属并具有第一蚀刻速率的膜。 前表面抗反射层包括含有金属并具有第三蚀刻速率的膜。 遮光层包括含有与背面防反射层或前表面抗反射层中所含金属相同的金属的膜,其第二蚀刻速率低于第一和第三蚀刻速率。 遮光层的厚度为整个遮光膜的厚度的45%以下。
    • 8. 发明授权
    • Phase shift mask blank and phase shift mask
    • 相移掩模空白和相移掩模
    • US08329364B2
    • 2012-12-11
    • US13001365
    • 2009-06-25
    • Hiroyuki IwashitaHiroaki ShishidoAtsushi KominatoMasahiro Hashimoto
    • Hiroyuki IwashitaHiroaki ShishidoAtsushi KominatoMasahiro Hashimoto
    • G06F1/22
    • G03F1/58G03F1/32
    • The present invention provides a photomask blank used for producing a photomask to which an ArF excimer laser light is applied, wherein: a light-shielding film is provided on a light transmissive substrate; the light-shielding film has a laminated structure in which a lower layer, an interlayer and an upper layer are laminated in this order from the side close to the light transmissive substrate; the thickness of the entire light-shielding film is 60 nm or less; the lower layer is made of a film containing a metal and has a first etching rate; the upper layer is made of a film containing a metal and has a third etching rate; the interlayer is made of a film containing the same metal as that contained in the lower layer or the upper layer and has a second etching rate that is lower than the first etching rate and the third etching rate; and the thickness of the interlayer is 30% or less of the thickness of the entire light-shielding film.
    • 本发明提供一种用于制造施加了ArF准分子激光的光掩模的光掩模坯料,其中:在透光基板上设置有遮光膜; 遮光膜具有层叠结构,其中从靠近透光基底的一侧依次层叠下层,中间层和上层; 整个遮光膜的厚度为60nm以下; 下层由含有金属的膜制成,具有第一蚀刻速率; 上层由含有金属的膜制成,具有第三蚀刻速率; 中间层由含有与下层或上层相同的金属的膜制成,具有比第一蚀刻速度和第三蚀刻速度低的第二蚀刻速率; 并且中间层的厚度为整个遮光膜的厚度的30%以下。
    • 9. 发明申请
    • PHOTOMASK BLANK, PHOTOMASK , AND METHOD FOR MANUFACTURING PHOTOMASK BLANK
    • PHOTOMASK BLANK,PHOTOMASK和制造光电隔离层的方法
    • US20110070533A1
    • 2011-03-24
    • US12935464
    • 2009-03-31
    • Hiroyuki IwashitaHiroaki ShishidoAtsushi KominatoMasahiro Hashimoto
    • Hiroyuki IwashitaHiroaki ShishidoAtsushi KominatoMasahiro Hashimoto
    • G03F1/00
    • G03F1/46G03F1/54G03F1/80
    • The present invention provides a photomask blank used for producing a photomask to which an ArF excimer laser light is applied, wherein: a light-shielding film is provided on a light transmissive substrate; the light-shielding film has a laminated structure in which a back-surface antireflection layer, a light-shielding layer and a front-surface antireflection layer are laminated in this order from the side close to the light transmissive substrate; the thickness of the entire light-shielding film is 70 nm or less; the back-surface antireflection layer is made of a film containing a metal and has a first etching rate; the front-surface antireflection layer is made of a film containing a metal and has a third etching rate; the light-shielding layer is made of a film containing the same metal as that contained in the back-surface antireflection layer or the front-surface antireflection layer and has a second etching rate that is lower than the first etching rate and the third etching rate; and the thickness of the light-shielding layer is 45% or less of the thickness of the entire light-shielding film.
    • 本发明提供一种用于制造施加了ArF准分子激光的光掩模的光掩模坯料,其中:在透光基板上设置有遮光膜; 遮光膜具有层叠结构,其中背面防反射层,遮光层和前表面抗反射层从靠近透光基板的一侧依次层叠; 整个遮光膜的厚度为70nm以下; 背面抗反射层由含有金属的膜制成,具有第一蚀刻速率; 前表面抗反射层由含有金属的膜制成,具有第三蚀刻速率; 遮光层由含有与背面防反射层或前表面防反射层中所含的金属相同的金属的膜制成,并且具有比第一蚀刻速率和第三蚀刻速率低的第二蚀刻速率 ; 遮光层的厚度为整个遮光膜的厚度的45%以下。
    • 10. 发明申请
    • PHASE SHIFT MASK BLANK AND PHASE SHIFT MASK
    • 相移屏蔽层和相位移屏蔽
    • US20110111332A1
    • 2011-05-12
    • US13001365
    • 2009-06-25
    • Hiroyuki IwashitaHiroaki ShishidoAtsushi KominatoMasahiro Hashimoto
    • Hiroyuki IwashitaHiroaki ShishidoAtsushi KominatoMasahiro Hashimoto
    • G03F1/00
    • G03F1/58G03F1/32
    • The present invention provides a photomask blank used for producing a photomask to which an ArF excimer laser light is applied, wherein: a light-shielding film is provided on a light transmissive substrate; the light-shielding film has a laminated structure in which a lower layer, an interlayer and an upper layer are laminated in this order from the side close to the light transmissive substrate; the thickness of the entire light-shielding film is 60 nm or less; the lower layer is made of a film containing a metal and has a first etching rate; the upper layer is made of a film containing a metal and has a third etching rate; the interlayer is made of a film containing the same metal as that contained in the lower layer or the upper layer and has a second etching rate that is lower than the first etching rate and the third etching rate; and the thickness of the interlayer is 30% or less of the thickness of the entire light-shielding film.
    • 本发明提供一种用于制造施加了ArF准分子激光的光掩模的光掩模坯料,其中:在透光基板上设置有遮光膜; 遮光膜具有层叠结构,其中从靠近透光基底的一侧依次层叠下层,中间层和上层; 整个遮光膜的厚度为60nm以下; 下层由含有金属的膜制成,具有第一蚀刻速率; 上层由含有金属的膜制成,具有第三蚀刻速率; 中间层由含有与下层或上层相同的金属的膜制成,具有比第一蚀刻速度和第三蚀刻速度低的第二蚀刻速率; 并且中间层的厚度为整个遮光膜的厚度的30%以下。