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1. 发明授权

US06995342B2 Apparatus and method for bonding electronic component, circuit board, and electronic component mounting apparatus 失效
标题翻译：电子部件，电路板和电子部件安装装置的接合装置及其方法
公开(公告)号：US06995342B2
公开(公告)日：2006-02-07
申请号：US10919264
申请日：2004-08-17
申请人： Hiroshi Yamauchi , Naoto Hosotani , Kazuki Fukada , Katsuhiko Watanabe
发明人： Hiroshi Yamauchi , Naoto Hosotani , Kazuki Fukada , Katsuhiko Watanabe
IPC分类号： H05B3/18 , B23K31/02
CPC分类号： H01L21/67144 , B23K3/087 , B23K2101/40 , H01L24/75 , H01L2924/12042 , H01L2924/14 , H05K3/3494 , H05K2203/0165 , H05K2203/082 , H05K2203/1581 , H01L2924/00
摘要： Disclosed are an apparatus and a method for bonding electronic components, a circuit board, and an electronic component mounting apparatus, whereby various kinds of circuit boards can be manufactured, each by a small amount, with high productivity as compared with the conventional art. There are provided a stage member and a heating device, so that a circuit board is heated by the heating device while held in contact with the stage member, which stage member has a size almost equal to that of one circuit board. Generation of losses can be reduced for compact circuit boards, and heating can be performed individually, correspondingly, for each kind of circuit board. Manufacturing various kinds of circuit boards, each by a small amount, with high productivity as compared with the conventional art is enabled accordingly.
摘要翻译：公开了一种用于接合电子部件的装置和方法，电路板和电子部件安装装置，由此与现有技术相比，能够以高生产率少量地制造各种电路板。设置有台架构件和加热装置，使得电路板在与台架构件保持接触的状态下被加热装置加热，该台架构件的尺寸几乎等于一个电路板的尺寸。对于紧凑型电路板，可以减少损耗的产生，并且可以相应地针对各种电路板单独执行加热。与现有技术相比，能够高生产率地制造各种各样的电路板。

2. 发明授权

US06797926B2 Apparatus and method for bonding electronic component, circuit board, and electronic component mounting apparatus 失效
标题翻译：用于接合电子元件，电路板和电子元件安装装置的装置和方法
公开(公告)号：US06797926B2
公开(公告)日：2004-09-28
申请号：US10244429
申请日：2002-09-17
申请人： Hiroshi Yamauchi , Naoto Hosotani , Kazuki Fukada , Katsuhiko Watanabe
发明人： Hiroshi Yamauchi , Naoto Hosotani , Kazuki Fukada , Katsuhiko Watanabe
IPC分类号： H05B368
CPC分类号： H01L21/67144 , B23K3/087 , B23K2101/40 , H01L24/75 , H01L2924/12042 , H01L2924/14 , H05K3/3494 , H05K2203/0165 , H05K2203/082 , H05K2203/1581 , H01L2924/00
摘要： Disclosed are an apparatus and a method for bonding electronic components, a circuit board, and an electronic component mounting apparatus, whereby various kinds of circuit boards can be manufactured, each by a small amount, with high productivity as compared with the conventional art. There are provided a stage member and a heating device, so that a circuit board is heated by the heating device while held in contact with the stage member, which stage member has a size almost equal to that of one circuit board. Generation of losses can be reduced for compact circuit boards, and heating can be performed individually, correspondingly, for each kind of circuit board. Manufacturing various kinds of circuit boards, each by a small amount, with high productivity as compared with the conventional art is enabled accordingly.
摘要翻译：公开了一种用于接合电子部件的装置和方法，电路板和电子部件安装装置，由此与现有技术相比，能够以高生产率少量地制造各种电路板。设置有台架构件和加热装置，使得电路板在与台架构件保持接触的状态下被加热装置加热，该台架构件的尺寸几乎等于一个电路板的尺寸。对于紧凑型电路板，可以减少损耗的产生，并且可以相应地针对各种电路板单独执行加热。与现有技术相比，能够高生产率地制造各种各样的电路板。

3. 发明申请

US20050011934A1 Apparatus and method for bonding electronic component, circuit board, and electronic component mounting apparatus 失效
标题翻译：电子部件，电路板和电子部件安装装置的接合装置及其方法
公开(公告)号：US20050011934A1
公开(公告)日：2005-01-20
申请号：US10919264
申请日：2004-08-17
申请人： Hiroshi Yamauchi , Naoto Hosotani , Kazuki Fukada , Katsuhiko Watanabe
发明人： Hiroshi Yamauchi , Naoto Hosotani , Kazuki Fukada , Katsuhiko Watanabe
IPC分类号： H05K13/04 , B23K3/08 , H01L21/00 , H05K3/34 , B23K31/00
CPC分类号： H01L21/67144 , B23K3/087 , B23K2101/40 , H01L24/75 , H01L2924/12042 , H01L2924/14 , H05K3/3494 , H05K2203/0165 , H05K2203/082 , H05K2203/1581 , H01L2924/00
摘要： Disclosed are an apparatus and a method for bonding electronic components, a circuit board, and an electronic component mounting apparatus, whereby various kinds of circuit boards can be manufactured, each by a small amount, with high productivity as compared with the conventional art. There are provided a stage member and a heating device, so that a circuit board is heated by the heating device while held in contact with the stage member, which stage member has a size almost equal to that of one circuit board. Generation of losses can be reduced for compact circuit boards, and heating can be performed individually, correspondingly, for each kind of circuit board. Manufacturing various kinds of circuit boards, each by a small amount, with high productivity as compared with the conventional art is enabled accordingly.
摘要翻译：公开了一种用于接合电子部件的装置和方法，电路板和电子部件安装装置，由此与现有技术相比，能够以高生产率少量地制造各种电路板。设置有台架构件和加热装置，使得电路板在与台架构件保持接触的状态下被加热装置加热，该台架构件的尺寸几乎等于一个电路板的尺寸。对于紧凑型电路板，可以减少损耗的产生，并且可以相应地针对各种电路板单独执行加热。与现有技术相比，能够高生产率地制造各种各样的电路板。

4. 发明申请

US20050034302A1 Component connecting apparatus and method and component mounting apparatus 失效
标题翻译：部件连接装置及方法及部件安装装置
公开(公告)号：US20050034302A1
公开(公告)日：2005-02-17
申请号：US10891524
申请日：2004-07-15
申请人： Naoto Hosotani , Kazuki Fukada , Keiichi Iwata , Daido Komyoji
发明人： Naoto Hosotani , Kazuki Fukada , Keiichi Iwata , Daido Komyoji
IPC分类号： B23K3/08 , H05K3/34 , H05K3/30
CPC分类号： B23K3/087 , B23K2101/40 , H01L24/75 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/12042 , H05K3/3494 , H05K2201/10727 , H05K2203/0195 , H05K2203/1121 , H05K2203/1581 , H05K2203/304 , Y10T29/4913 , Y10T29/49144 , Y10T29/53178 , Y10T29/53191 , Y10T29/53261 , H01L2924/00014 , H01L2924/00
摘要： When a component that has a connection portion to be connected to the electrode of a board and a weak heat-resistant portion of a lower heat-resisting property than the fusing point of a connection material for connecting the electrode of the board with the connection portion is connected to the board with interposition of the connection material between the electrode of the board and the connection portion, a cooling member is brought in contact with the weak heat-resistant portion or its neighborhood while heating the connection material by heating the board brought in contact with a placement member, and the quantity of heat conducted to the weak heat-resistant portion via the board is reduced by being conducted to the cooling member, carrying out the fusing of the connection material while preventing the occurrence of thermal damage to the weak heat-resistant portion.
摘要翻译：当具有要连接到板的电极的连接部分和具有比用于将板的电极连接到连接部分的连接材料的熔点低的耐热性能的弱耐热部分的部件通过在板的电极和连接部之间插入连接材料而连接到板，通过加热连接材料来加热连接材料，冷却部件与弱的耐热部分或其邻近部分接触与放置构件接触，并且经由基板传导到弱耐热部的热量通过被传导到冷却构件而被减少，进行连接材料的熔合同时防止对弱的热损伤的发生耐热部分。

5. 发明授权

US07357288B2 Component connecting apparatus 失效
标题翻译：部件连接装置
公开(公告)号：US07357288B2
公开(公告)日：2008-04-15
申请号：US10891524
申请日：2004-07-15
申请人： Naoto Hosotani , Kazuki Fukada , Keiichi Iwata , Daido Komyoji
发明人： Naoto Hosotani , Kazuki Fukada , Keiichi Iwata , Daido Komyoji
IPC分类号： B23K1/00
CPC分类号： B23K3/087 , B23K2101/40 , H01L24/75 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/12042 , H05K3/3494 , H05K2201/10727 , H05K2203/0195 , H05K2203/1121 , H05K2203/1581 , H05K2203/304 , Y10T29/4913 , Y10T29/49144 , Y10T29/53178 , Y10T29/53191 , Y10T29/53261 , H01L2924/00014 , H01L2924/00
摘要： When a component, that has a connection portion to be connected to an electrode of a board and a weak heat-resistant portion of a lower heat-resisting property than a fusing point of a connection material for connecting the electrode of the board with the connection portion, is connected to the board with interposition of connection material between the electrode of the board and the connection portion, a cooling member is brought into contact with the weak heat-resistant portion or its neighborhood while heating the connection material by heating the board brought in contact with a placement member, and a quantity of heat conducted to the weak heat-resistant portion via the board is reduced by being conducted to the cooling member, thereby performing fusing of the connection material while preventing occurrence of thermal damage to the weak heat-resistant portion.
摘要翻译：当具有要连接到板的电极的连接部分和具有比用于将板的电极与连接件连接的连接材料的熔点低的耐热性能的弱耐热部分的部件通过在板的电极和连接部之间插入连接材料而连接到板，冷却部件与弱耐热部或其附近接触，同时通过加热连接材料来加热板与放置构件接触，并且通过被传导到冷却构件而减少通过板传导到弱耐热部分的热量，从而进行连接材料的熔合，同时防止对弱热的热损伤的发生抵抗部分。

6. 发明授权

US08727507B2 Ink-jet apparatus 有权
标题翻译：喷墨设备
公开(公告)号：US08727507B2
公开(公告)日：2014-05-20
申请号：US13449364
申请日：2012-04-18
申请人： Kazuki Fukada , Hiroshi Hayata , Hidehiro Yoshida
发明人： Kazuki Fukada , Hiroshi Hayata , Hidehiro Yoshida
IPC分类号： B41J2/045
CPC分类号： B41J2/14274 , B41J2202/11 , B41J2202/12
摘要： Provided is an ink-jet apparatus that: has a wide control range of the direction for ink ejection; can correct a variation in the direction for ink ejection; and can improve the yield of a product when used for manufacture of electronic devices. The ink-jet apparatus includes: pressure chamber 110 configured with a pair of partition walls 111; nozzle plate 101 having nozzle 100; diaphragm 112 supported by partition walls 111; piezoelectric elements 131 and 132 that are in contact with diaphragm 112 for pressurizing pressure chamber 110; and piezoelectric elements 141, 142 and 143 supporting partition walls 111. A voltage can be applied individually to piezoelectric elements 131, 132, and 141 to 143. The widths of part A and part B of diaphragm 112, part A being in contact with a piezoelectric element, and part B being in contact with partition wall 111 satisfy a particular relationship.
摘要翻译：本发明提供一种喷墨装置，其具有油墨喷射方向的宽的控制范围; 可以校正喷墨方向的变化; 并且当用于制造电子设备时可以提高产品的产量。喷墨装置包括：配置有一对分隔壁111的压力室110; 具有喷嘴100的喷嘴板101; 由分隔壁111支撑的隔膜112; 压电元件131和132与隔膜112接触，用于对压力室110加压; 以及支撑分隔壁111的压电元件141,142和143.可以将电压分别施加到压电元件131,132和141至143上。隔膜112的部分A和部分B的宽度部分A与压电元件和与分隔壁111接触的部分B满足特定的关系。

7. 发明申请

US20070193682A1 Bonding method and apparatus 失效
标题翻译：粘合方法和装置
公开(公告)号：US20070193682A1
公开(公告)日：2007-08-23
申请号：US10599638
申请日：2005-04-06
申请人： Tatsuo Sasaoka , Satoshi Horie , Isamu Aokura , Yoshihiko Yagi , Kazuki Fukada
发明人： Tatsuo Sasaoka , Satoshi Horie , Isamu Aokura , Yoshihiko Yagi , Kazuki Fukada
IPC分类号： B32B38/16 , B32B38/10 , B32B38/00 , B31F1/07
CPC分类号： B23K1/203 , B23K2101/40 , H01L21/4864 , H01L21/6835 , H01L23/3142 , H01L24/75 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/1134 , H01L2224/1181 , H01L2224/1184 , H01L2224/13019 , H01L2224/13144 , H01L2224/749 , H01L2224/75 , H01L2224/75301 , H01L2224/75753 , H01L2224/81009 , H01L2224/81011 , H01L2224/81012 , H01L2224/81013 , H01L2224/81191 , H01L2224/81395 , H01L2224/81801 , H01L2224/8182 , H01L2224/81894 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01021 , H01L2924/01025 , H01L2924/01033 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H05K3/328 , H05K3/3489 , H05K3/383 , H05K2201/0373 , H05K2201/10674 , H05K2203/0307 , Y10S438/974 , Y10T156/1023 , Y10T156/14 , H01L2224/05599
摘要： A bonding method and an apparatus that enable metal bonding under the atmospheric pressure and at room temperature, wherein the surfaces of objects (1b, 2a) to be bonded together are cleaned in an initial cleaning step (S1) to remove bonding inhibitor substances (G) such as oxides and adhered substances; one (1b) of the bonding surfaces is provided with an uneven profile with a predetermined roughness in a surface roughness control step (S3); a surface treatment step (S5) is performed to remove the substances (F) that have been removed but adhered to the bonding surfaces (1b, 2a) again; and the uneven bonding surface (1b) is pressed against the other bonding surface (2a) to bond them together.
摘要翻译：在大气压和室温下能够进行金属接合的接合方法和装置，其中在初始清洁步骤（S1）中清洁要结合在一起的物体（1b，2a）的表面以除去结合抑制剂物质（G），如氧化物和附着物质; 一个（1b）的粘合表面在表面粗糙度控制步骤（S 3）中设置有具有预定粗糙度的凹凸轮廓; 执行表面处理步骤（S 5）以除去已经去除但又粘附到接合表面（1b，2a）上的物质（F）并且不平坦的接合表面（1b）被压靠在另一个接合表面（2a）上以将它们结合在一起。

8. 发明申请

US20110279552A1 INK-JET HEAD, INK-JET APPARATUS, AND METHOD OF MANUFACTURING THE SAME 失效
标题翻译：喷墨头，喷墨装置及其制造方法
公开(公告)号：US20110279552A1
公开(公告)日：2011-11-17
申请号：US13103298
申请日：2011-05-09
申请人： Hidehiro Yoshida , Kazuki Fukada , Keisei Yamamuro
发明人： Hidehiro Yoshida , Kazuki Fukada , Keisei Yamamuro
IPC分类号： B41J2/045 , B21D53/76
CPC分类号： B41J2/14274 , B41J2202/12
摘要： The present invention provides an ink-jet head which comprises an ink supply channel configured to allow ink to flow, two or more ink chambers each having a bottom surface with a nozzle and an upper surface constituting of a vibrating plate, the two or more ink chambers being arranged in a row along a direction in which the ink flows in the ink supply channel, a partition wall partitioning the ink chambers. and a piezo-mounting plate having two or more multilayer piezoelectric elements and two or more columns fixed thereto. The two or more multilayer piezoelectric elements are arranged in a row, and the two or more columns are arranged between the multilayer piezoelectric elements. And also, the piezo-mounting plate is arranged on the upper surface of the ink chambers. In the ink-jet head, the vibrating plate constituting the upper surface of the ink chamber is held between the partition wall and the column. A large gap and a small gap are arranged between the two multilayer piezoelectric elements adjacent to each other, and the column is arranged at only the portion with a large gap.
摘要翻译：本发明提供了一种喷墨头，其包括构造成允许油墨流动的油墨供应通道，两个或更多个油墨室，每个油墨室具有带有喷嘴的底表面和构成振动板的上表面，所述两个或更多个油墨沿墨水在供墨通道中流动的方向排列成一排，分隔着墨室的分隔壁。以及具有两个以上的多层压电元件和固定在其上的两个以上的列的压电安装板。两层以上的多层压电元件排列成一列，两层以上的列配置在层叠型压电元件之间。此外，压电安装板设置在墨室的上表面上。在喷墨头中，构成墨水室上表面的振动板保持在分隔壁和柱之间。在彼此相邻的两个叠层压电元件之间布置有大的间隙和小的间隙，并且柱仅布置在具有大间隙的部分。

9. 发明授权

US08579420B2 Ink-jet apparatus 有权
标题翻译：喷墨设备
公开(公告)号：US08579420B2
公开(公告)日：2013-11-12
申请号：US13047432
申请日：2011-03-14
申请人： Hidehiro Yoshida , Kazuki Fukada , Keisei Yamamuro
发明人： Hidehiro Yoshida , Kazuki Fukada , Keisei Yamamuro
IPC分类号： B41J2/17
CPC分类号： B41J2/14274 , B41J2202/12
摘要： An ink-jet apparatus comprising: an ink supply channel through which ink flows; an ink chamber that communicates with the ink supply channel via an ink inlet channel, holds the ink supplied from the ink supply channel, and has a nozzle that discharges the ink; an ink evacuation channel that communicates with the ink chamber via an ink outlet channel, and through which the ink evacuated from the ink chamber flows; an ink circulating section that applies pressure to the ink so that the ink flows into the ink evacuation channel from the ink supply channel via the ink chamber; a first actuator that vibrates a wall of the ink chamber; and a second actuator that changes an area of a cross-section of the ink outlet channel.
摘要翻译：一种喷墨设备，包括：墨水供应通道; 通过墨水入口通道与墨水供应通道连通的墨水室，保持从供墨通道供应的墨水，并具有排出墨水的喷嘴; 墨水排出通道，其经由墨水出口与墨水室连通，墨水从墨水室排出的墨水排出通道; 油墨循环部分，其对油墨施加压力，使得油墨经由油墨室从供墨通道流入排墨通道; 使所述墨水室的壁振动的第一致动器; 以及改变所述出墨通道的横截面的面积的第二致动器。

10. 发明授权

US08303080B2 Ink-jet head and ink-jet apparatus 有权
标题翻译：喷墨头和喷墨设备
公开(公告)号：US08303080B2
公开(公告)日：2012-11-06
申请号：US13079222
申请日：2011-04-04
申请人： Hidehiro Yoshida , Kazuki Fukada
发明人： Hidehiro Yoshida , Kazuki Fukada
IPC分类号： B41J2/045
CPC分类号： B41J2/14201 , B41J2002/14403 , B41J2202/07 , B41J2202/12
摘要： An ink-jet head includes an ink chamber; an ink supply channel through which ink to be supplied to the ink chamber flows; an ink discharge channel through which the ink discharged from the ink chamber flows; a partition wall constituting a side surface of the ink chamber; an ink inlet opening formed in the partition wall, the ink inlet opening communicating with the ink supply channel; an ink outlet opening formed in the partition wall, the ink outlet opening communicating with the ink discharge channel; a piezo-mounting plate constituting a top surface of the ink chamber; an expandable multilayer piezoelectric element placed inside the ink chamber, the multilayer piezoelectric element having a fixed end secured to the piezo-mounting plate and a movable end directing to the expanding direction of the multilayer piezoelectric element; a nozzle plate constituting a bottom surface of the ink chamber; and a nozzle formed in the nozzle plate, the nozzle communicating with the ink chamber, wherein the multilayer piezoelectric element is separated from the partition wall, and the ink inlet opening is positioned closer to the fixed end of the multilayer piezoelectric element than to the movable end thereof.
摘要翻译：喷墨头包括墨水室; 供给到墨水室的墨水的供墨路径流过; 从墨水室排出的墨流过的墨水排出通道; 构成所述墨水室侧面的分隔壁; 形成在分隔壁上的墨水入口，与墨水供应通道连通的墨水入口; 形成在分隔壁上的墨水出口，与排墨通道连通的墨出口; 构成所述墨室的上表面的压电安装板; 放置在所述墨水室内的可膨胀的多层压电元件，所述多层压电元件具有固定在所述压电安装板上的固定端和朝向所述多层压电元件的扩展方向的可动端; 构成墨水室底面的喷嘴板; 以及形成在喷嘴板中的喷嘴，与墨水室连通的喷嘴，其中多层压电元件与分隔壁分离，并且墨水入口开口更靠近多层压电元件的固定端而不是可移动的结束。

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