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1. 发明授权

US5918362A Jig for dual-side mounting PC boards 失效
标题翻译：双面安装PC板的夹具
公开(公告)号：US5918362A
公开(公告)日：1999-07-06
申请号：US883900
申请日：1997-06-27
申请人： Hiroaki Yamashita , Yasuhiro Murasawa
发明人： Hiroaki Yamashita , Yasuhiro Murasawa
IPC分类号： H05K13/04 , H05K3/34 , H05K13/00 , H05K3/30
CPC分类号： H05K13/0069 , H05K3/3415 , Y10S29/044 , Y10T29/53178 , Y10T29/53191
摘要： A jig for dual-side mounting PC boards is composed of a board table which has a board supporting surface, a component receiving hole and a board sucking holes, spacers for placement in the component receiving holes, and a platform having a pressure-reducing space communicating with the board sucking holes. The spacers each have a protrusion for engagement with a spacer positioning hole made in the bottom of the component receiving hole.
摘要翻译：用于双面安装PC板的夹具由具有板支撑表面的板台，部件接收孔和板吸入孔组成，用于放置在部件接收孔中的间隔件和具有减压空间的平台与板吸入孔通信。间隔件各自具有用于与在部件容纳孔的底部形成的间隔物定位孔接合的突起。

2. 发明授权

US5521433A IC card including a substrate having improved strength and heat radiation properties 失效
标题翻译： IC卡包括具有改进的强度和散热性能的基板
公开(公告)号：US5521433A
公开(公告)日：1996-05-28
申请号：US408300
申请日：1995-03-22
申请人： Teru Hirata , Shigeo Onoda , Tetsuro Washida , Yasuhiro Murasawa
发明人： Teru Hirata , Shigeo Onoda , Tetsuro Washida , Yasuhiro Murasawa
IPC分类号： B42D15/10 , G06K19/02 , G06K19/077 , H01L23/12 , H01L23/538 , H01L25/00 , H05K1/03 , H05K1/05 , H01L23/02 , H01L23/053
CPC分类号： G06K19/07728 , G06K19/02 , G06K19/077 , G06K19/0773 , H01L23/5388 , H05K1/0373 , H01L2924/0002 , H05K1/036 , H05K1/056 , H05K2201/0215 , H05K2201/0281
摘要： An IC card includes a substrate having a metal fiber resin material layer made of a mixture of a resin and metal fibers and a conductive pattern. The conductive pattern and the metal fiber resin material layer are electrically insulated from each other by a resist film. Heat radiation and mechanical strength of the IC card are enhanced.
摘要翻译： IC卡包括具有由树脂和金属纤维的混合物制成的金属纤维树脂材料层和导电图案的基板。导电图案和金属纤维树脂材料层通过抗蚀剂膜彼此电绝缘。提高了IC卡的散热和机械强度。

3. 发明授权

US4868714A IC card including enclosed sliding shutter 失效
标题翻译： IC卡包括封闭滑动快门
公开(公告)号：US4868714A
公开(公告)日：1989-09-19
申请号：US175195
申请日：1988-03-30
申请人： Toshinobu Banjo , Yasuhiro Murasawa , Shigeo Onoda , Yasushi Kasatani
发明人： Toshinobu Banjo , Yasuhiro Murasawa , Shigeo Onoda , Yasushi Kasatani
IPC分类号： B42D15/02 , B42D15/10 , G06K19/07 , G06K19/077 , G11C5/00 , H01R13/453
CPC分类号： H01R13/4534 , G06K19/077
摘要： An IC card having a package in which a semiconductor device is accommodated, a plurality of electrode terminals disposed on a surface of the package near the front end thereof in the direction in which the IC card is inserted into a connector in an external device, a shutter supported on the surface of a front portion of the package for exposing and covering the electrode terminals, the shutter having a width smaller than that of the package as measured in the direction perpendicular to the direction of insertion into the connector, a pair of guide projections formed on the shutter at both-sides thereof to extend into the package, the guide projections functioning to open the shutter by abutting against a pair of shutter receiving pins disposed in the insertion hole of the connector when the package is inserted into the connector, and a pair of guide grooves adapted to guide the guide projections, the guide grooves being formed in both sides of the front portion of the surface of the package to be within the side surfaces thereof, the guide grooves extending from the front side of the package in the insertion direction thereof.
摘要翻译：具有容纳半导体装置的封装的IC卡，在IC卡插入到外部装置的连接器的方向上，在其前端附近设置在封装体的表面附近的多个电极端子，支撑在封装的前部表面上的遮光板用于曝光和覆盖电极端子，该遮板的宽度小于在垂直于插入连接器的方向的方向上测量的包装的宽度;一对导向件突起形成在挡板的两侧以延伸到包装中，引导突起用于当包装被插入连接器时通过抵靠设置在连接器的插入孔中的一对挡板接收销来打开闸门，以及适于引导引导突起的一对引导槽，所述引导槽形成在所述p的表面的前部的两侧所述引导槽沿着所述封装的插入方向从所述封装的前侧延伸。

4. 发明授权

US4868713A Memory card housing a smiconductor device 失效
标题翻译：存储卡容纳半导体器件
公开(公告)号：US4868713A
公开(公告)日：1989-09-19
申请号：US175277
申请日：1988-03-30
申请人： Toshinobu Banjo , Yasuhiro Murasawa , Shigeo Onoda
发明人： Toshinobu Banjo , Yasuhiro Murasawa , Shigeo Onoda
IPC分类号： B42D15/10 , G06K19/077 , G11C5/00
CPC分类号： G06K19/077 , G11C5/00
摘要： A memory card comprises a plastic outer package which houses a semiconductor device and electrical connector. The outer package comprises a plurality of package sections which are stacked atop one another and bonded together along connecting surfaces formed on the outer peripheries of the package sections. The connecting surface of one package section of each pair of adjoining package sections has a projecting engaging portion formed thereon, and the connecting surface of the other package section of the pair of adjoining package sections has a recessed engaging portion formed therein which engages with the projecting engaging portion of the adjoining package section.
摘要翻译：存储卡包括容纳半导体器件和电连接器的塑料外包装。外包装包括多个包装部分，这些包装部分彼此堆叠并且沿着形成在包装部分的外周上的连接表面粘合在一起。每对相邻包装部分的一个包装部分的连接表面具有形成在其上的突出接合部分，并且一对相邻包装部分中的另一个包装部分的连接表面具有形成在其中的凹入的接合部分，相邻的包装部分的接合部分。

5. 发明授权

US5952713A Non-contact type IC card 失效
标题翻译：非接触式IC卡
公开(公告)号：US5952713A
公开(公告)日：1999-09-14
申请号：US577541
申请日：1995-12-22
申请人： Kenichi Takahira , Jun Ohbuchi , Yasuhiro Murasawa
发明人： Kenichi Takahira , Jun Ohbuchi , Yasuhiro Murasawa
IPC分类号： G06K19/077 , H05K1/18 , H05K3/28 , H05K3/32 , H05K3/38 , H05K3/40 , H05K3/46 , H01L23/02 , H01L23/29 , H01L23/34
CPC分类号： G06K19/07718 , G06K19/0722 , G06K19/077 , G06K19/07779 , H01L24/97 , H05K3/284 , H05K3/321 , H05K3/4046 , H05K3/4652 , H01L2224/16225 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/19041 , H05K1/189 , H05K2201/0195 , H05K2201/10303 , H05K2203/0191 , H05K2203/063 , H05K2203/1453 , H05K3/386 , H05K3/4626 , H05K3/4655
摘要： A non-contact IC card and a method and apparatus for manufacturing the IC card. The IC card has a small thickness and is manufactured at a low cost, automatically. Electronic parts are mounted on a circuit pattern on a surface of a resin sheet. A filling resin covers the elcetronic parts and fills gaps between them. An electronically insulating plastic material on the filling resin wraps around the filling resin, contacting its side surfaces and saide surfaces of the resin sheet. The plastic material provides added protection to the electronic parts. In a method of manufacturing the non-contact IC card, the laminated structure of the resin sheet, filling resin, and plastic material is subjected to two sequential severing steps. In the first severing step, only the resin sheet and the filling resin are severed, generally in the shape of an IC card that is to be completed. The plastic material is not severed and extends over side surfaces of the resin sheet and filling that are produced in the first cutting step. The plastic material is severed so that it extends beyond the side surfaces of the resin filling material and resin sheet. Finally, the overhanging parts to the resin material are deformed and bent to cover and protect the side surfaces of the resin sheet and the filling resin.
摘要翻译：一种非接触式IC卡及其制造方法和装置。 IC卡的厚度很小，并且自动以低成本制造。电子部件安装在树脂片的表面上的电路图案上。填充树脂覆盖电子部件并填充它们之间的间隙。填充树脂上的电子绝缘塑料材料包裹在填充树脂周围，与树脂片的侧表面和边缘表面接触。塑料材料为电子零件提供了额外的保护。在制造非接触式IC卡的方法中，树脂片，填充树脂和塑料材料的叠层结构经受两个顺序的切断步骤。在第一切断步骤中，只有树脂片和填充树脂被切断，通常是待完成的IC卡的形状。塑料材料不被切断并且在树脂片的侧表面和在第一切割步骤中产生的填充物中延伸。塑料材料被切断，使其延伸超出树脂填充材料和树脂片的侧表面。最后，向树脂材料的突出部分变形并弯曲以覆盖和保护树脂片和填充树脂的侧表面。

6. 发明授权

US5086336A Semiconductor device card 失效
标题翻译：半导体器件卡
公开(公告)号：US5086336A
公开(公告)日：1992-02-04
申请号：US516127
申请日：1990-04-27
申请人： Yasuhiro Murasawa
发明人： Yasuhiro Murasawa
IPC分类号： G06K19/077
CPC分类号： G06K19/077
摘要： A semiconductor device card includes a frame on which a semiconductor module may be mounted and a protection panel adhered to the frame. The frame includes pairs of offset grooves along each of two opposed sides and the protection panel includes pairs of offset flanges along each of two opposed edges of the panel. The protection panel flanges are inserted into the grooves in the frame and adhered to the frame in the grooves. Thus, a large attached area for ensuring good adhesive strength between the frame and the protection panel is achieved.
摘要翻译：半导体器件卡包括可以安装半导体模块的框架和粘附到框架的保护面板。框架包括沿着两个相对的侧面中的每一个的成对的偏移凹槽，并且保护面板包括沿面板的两个相对边缘中的每一个的一对偏移凸缘。保护面板凸缘插入框架中的凹槽中并粘附到凹槽中的框架上。因此，实现了用于确保框架和保护面板之间良好粘合强度的大附接区域。

7. 发明授权

US4789347A Memory card 失效
标题翻译：存储卡
公开(公告)号：US4789347A
公开(公告)日：1988-12-06
申请号：US154322
申请日：1988-02-10
申请人： Toshinobu Banjo , Yasuhiro Murasawa , Shigeo Onoda
发明人： Toshinobu Banjo , Yasuhiro Murasawa , Shigeo Onoda
IPC分类号： G06K19/07 , B42D15/10 , G11C5/00 , H01R13/447 , H01R13/648 , H01R13/44
CPC分类号： H01R13/447 , H01R13/648
摘要： A memory card having: a card-like package; a semiconductor module disposed within the package; a plurality of electrode terminals mounted on the package for allowing an external electrical connection of the semiconductor module in the package to an external circuit, the electrode terminals including an earth electrode terminal; a metallic shutter disposed on the package and movable between an open position in which the electrode terminals are exposed for the electrical connection and a closed position in which the electrode terminals are covered; an electrically conductive spring having one end electrically connected to the shutter and the other end secured to the package for biasing the shutter toward the closed position; and a conductor for electrically connecting the other end of the spring to the earth electrode terminal.
摘要翻译：一种存储卡，具有：卡状包装; 设置在所述封装内的半导体模块; 安装在封装上的多个电极端子，用于允许封装中的半导体模块与外部电路的外部电连接，所述电极端子包括接地电极端子; 金属快门，其设置在所述封装上，并且在所述电极端子暴露于所述电连接的打开位置和所述电极端子被覆盖的关闭位置之间可移动; 导电弹簧，其一端电连接到闸门，另一端固定到封装件上，用于将闸板偏压到关闭位置; 以及用于将弹簧的另一端电连接到接地电极端子的导体。

8. 发明授权

US5841188A Tape carrier structure for a tape carrier package 失效
标题翻译：用于载带包的载带结构
公开(公告)号：US5841188A
公开(公告)日：1998-11-24
申请号：US562511
申请日：1995-11-24
申请人： Yasuhiro Murasawa
发明人： Yasuhiro Murasawa
IPC分类号： H01L21/60 , H01L23/495 , H01L23/50 , H01L21/56 , H01L21/58
CPC分类号： H01L23/49572 , H01L24/50
摘要： A tape carrier structure (T1,T2) for a tape carrier package on which at least one semiconductor chip (1) is mounted, the tape carrier structure (T1,T2) having a polyimide tape (3) and leads (2) joined onto the polyimide tape (3), an end of each of the leads (2) being connected to one of connecting pads corresponding thereto, the connecting pads being provided on the semiconductor chip (1), wherein the polyimide tape (3) has a facing portion (3a) which is situated so as to face to the semiconductor chip (1) except the connecting pads on condition that the semiconductor chip (1) is mounted on the tape carrier package.
摘要翻译：一种用于载带封装的载带结构（T1，T2），其上安装有至少一个半导体芯片（1），所述带状载体结构（T1，T2）具有聚酰亚胺带（3）和引线（2）所述聚酰亚胺胶带（3）中，每个所述引线（2）的端部连接到与其对应的连接焊盘之一，所述连接焊盘设置在所述半导体芯片（1）上，其中所述聚酰亚胺胶带（3）在将半导体芯片（1）安装在带载包装上的条件下，位于除了连接焊盘之外面对半导体芯片（1）的部分（3a）。

9. 发明授权

US4890197A Memory card housing 失效
标题翻译：存储卡外壳
公开(公告)号：US4890197A
公开(公告)日：1989-12-26
申请号：US175212
申请日：1988-03-30
申请人： Toshinobu Banjo , Yasuhiro Murasawa , Shigeo Onoda
发明人： Toshinobu Banjo , Yasuhiro Murasawa , Shigeo Onoda
IPC分类号： B42D15/10 , G06K19/077 , G11C5/00 , H05K5/02
CPC分类号： H05K5/0269 , G06K19/077
摘要： A memory card comprises a plastic outer package which houses a semiconductor device and an electrical connector. The outer package comprises a plurality of package sections which are stacked atop one another and bonded together along connecting surfaces formed on the outer peripheries of the package sections. At least one of the connecting surface of each pair of adjoining package sections has an overflow groove for bonding agent formed therein which prevents the bonding agent from being forced to the outside of the outer package when the package sections are bonded together.
摘要翻译：存储卡包括容纳半导体器件和电连接器的塑料外包装。外包装包括多个包装部分，这些包装部分彼此堆叠并且沿着形成在包装部分的外周上的连接表面粘合在一起。每对相邻包装部分的连接表面中的至少一个具有用于在其中形成的粘合剂的溢流槽，当封装部分结合在一起时，防止粘合剂被迫到外部包装的外部。

10. 发明授权

US5309020A Packaged semiconductor device assembly including two interconnected packaged semiconductor devices mounted on a common substrate 失效
标题翻译：封装的半导体器件组件包括安装在公共衬底上的两个互连的封装半导体器件
公开(公告)号：US5309020A
公开(公告)日：1994-05-03
申请号：US783878
申请日：1991-10-29
申请人： Yasuhiro Murasawa , Syuniti Uemura , Hajime Maeda
发明人： Yasuhiro Murasawa , Syuniti Uemura , Hajime Maeda
IPC分类号： H01L23/50 , H01L23/495 , H01L23/52 , H01L25/10 , H05K1/18 , H01L23/16 , H01L23/02 , H01L23/12
CPC分类号： H05K1/181 , H01L23/49555 , H01L25/105 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2225/1005 , H05K2201/10522 , H05K2201/10689 , Y02P70/611
摘要： A semiconductor device includes a package substrate, a first IC package having external lead terminals which are downwardly bent with respect to a plane surface of the package and a second IC package having external lead terminals which are upwardly bent with respect to a plane surface of the package. These packages are disposed on one surface of the package substrate parallel to each other. One or more pairs of the external lead terminals of the first and second IC packages, which face each other and are electrically connected with to each other, are disposed on the same mount pads provided on the package substrate. Therefore, wires for connecting those lead terminals can be dispensed with and the other external lead terminals can be connected by simply drawing around wires without providing through holes. In addition, no positional deviation between the two packages, occurs and no solder bridges are created during soldering.
摘要翻译：半导体器件包括封装衬底，第一IC封装，其具有相对于封装的平面表面向下弯曲的外部引线端子;以及第二IC封装，其具有相对于所述封装基板的平面向上弯曲的外部引线端子包。这些封装被布置在彼此平行的封装基板的一个表面上。第一和第二IC封装的彼此面对并彼此电连接的一对或多对外部引线端子设置在设置在封装基板上的相同的安装焊盘上。因此，可以省略用于连接这些引线端子的导线，并且可以通过简单地绕线而不提供通孔来连接其它外部引线端子。另外，焊接之间不会发生两个封装之间的位置偏移，也不会产生焊接桥。

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