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    • 10. 发明申请
    • Positive resist composition and method for forming resist pattern
    • 正型抗蚀剂组合物和形成抗蚀剂图案的方法
    • US20070105038A1
    • 2007-05-10
    • US10580768
    • 2004-11-24
    • Masaru TakeshitaRyotaro HayashiTakeshi Iwai
    • Masaru TakeshitaRyotaro HayashiTakeshi Iwai
    • G03C1/00
    • G03F7/0397
    • A positive resist composition that includes a base resin component (A) and an acid generator component (B), wherein the component (A) is a copolymer that includes structural units (a-1), which are derived from an (α-lower alkyl) acrylate ester that contains an acid dissociable, dissolution inhibiting group, and also contains an aliphatic cyclic group, structural units (a-2), which are derived from an (α-lower alkyl) acrylate ester that contains a γ-butyrolactone residue, and structural units (a-3), which are derived from an (α-lower alkyl) acrylate ester that contains a hydroxyl group-containing aliphatic polycyclic hydrocarbon group, and the glass transition temperature (Tg) of the copolymer is within a range from 100 to 170° C.; together with a method for forming a resist pattern using a lithography process that includes the steps of applying a chemically amplified positive resist composition to a substrate to provide a resist film, conducting selective exposure of the resist film, performing post exposure baking (PEB), and then conducting alkali developing, wherein the PEB temperature in the lithography process is set to a temperature within ±2° C. of the PEB temperature at which the line and space pattern formed by this lithography process reaches a maximum.
    • 包含基础树脂组分(A)和酸产生剂组分(B)的正性抗蚀剂组合物,其中组分(A)是包含结构单元(a-1)的共聚物,其衍生自(α-低级 烷基)丙烯酸酯,其含有酸解离,溶解抑制基团,并且还含有脂肪族环状基团,由含有γ-丁内酯残基的(α-低级烷基)丙烯酸酯衍生的结构单元(a-2) ,和由含有含羟基的脂族多环烃基的(α-低级烷基)丙烯酸酯衍生的结构单元(a-3),共聚物的玻璃化转变温度(Tg)在一定范围内 从100℃到170℃。 以及使用光刻工艺形成抗蚀剂图案的方法,其包括以下步骤:将化学放大的正性抗蚀剂组合物施加到基底上以提供抗蚀剂膜,进行抗蚀剂膜的选择性曝光,进行曝光后烘烤(PEB), 然后进行碱显影,其中光刻工艺中的PEB温度设定为由该光刻工艺形成的线和空间图案达到最大值的PEB温度的±2℃以内的温度。