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1. 发明申请

US20120235259A1 SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME 审中-公开
标题翻译：半导体封装及其制造方法
公开(公告)号：US20120235259A1
公开(公告)日：2012-09-20
申请号：US13242182
申请日：2011-09-23
申请人： Hao-Ju Fang , Hsin-Lung Chung , Cho-Hsin Chang , Tsung-Hsien Tsai
发明人： Hao-Ju Fang , Hsin-Lung Chung , Cho-Hsin Chang , Tsung-Hsien Tsai
IPC分类号： H01L31/0203 , H01L31/18
CPC分类号： H01L24/97 , H01L21/561 , H01L23/552 , H01L24/13 , H01L24/16 , H01L24/48 , H01L25/0655 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/48227 , H01L2224/97 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/12042 , H01L2924/1421 , H01L2924/181 , H01L2924/19107 , H01L2924/3025 , H01L2224/85 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package and a method of fabricating the same. The semiconductor package includes: a substrate having a plurality of semiconductor components disposed thereon; an encapsulant covering the substrate and the semiconductor components; and a metal layer formed on the exposed surfaces of the encapsulant, wherein the encapsulant is formed with a trench for dividing into a plurality of package units on the substrate to allow each of the package units to have at least one of the semiconductor components, and the metal layer is formed in the trench to encompass the encapsulant on the periphery of the semiconductor components, thereby preventing interference of electromagnetic waves between the semiconductor components.
摘要翻译：一种半导体封装及其制造方法。半导体封装包括：具有设置在其上的多个半导体部件的衬底; 覆盖基板和半导体部件的密封剂; 以及形成在所述密封剂的暴露表面上的金属层，其中所述密封剂形成有用于在所述基板上分成多个封装单元的沟槽，以允许每个所述封装单元具有所述半导体部件中的至少一个，以及金属层形成在沟槽中以包围半导体部件的周边上的密封剂，从而防止电磁波在半导体部件之间的干扰。

2. 发明申请

US20120074538A1 PACKAGE STRUCTURE WITH ESD AND EMI PREVENTING FUNCTIONS 有权
标题翻译：具有ESD和EMI防止功能的封装结构
公开(公告)号：US20120074538A1
公开(公告)日：2012-03-29
申请号：US12914217
申请日：2010-10-28
申请人： Tsung-Hsien Tsai , Heng-Cheng Chu , Hsin-Lung Chung , Chao-Ya Yang
发明人： Tsung-Hsien Tsai , Heng-Cheng Chu , Hsin-Lung Chung , Chao-Ya Yang
IPC分类号： H01L23/04
CPC分类号： H01L23/3121 , H01L23/49816 , H01L23/552 , H01L23/585 , H01L23/60 , H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/15192 , H01L2924/15311 , H01L2924/181 , H01L2924/19105 , H01L2924/3025 , H01L2924/00012 , H01L2924/00
摘要： A package structure with ESD (electrostatic discharge) and EMI (electromagnetic interference) preventing functions includes: a carrier having first and second ground structures electrically insulated from one another; a semiconductor component disposed on one surface of the carrier and electrically connected to the first ground structure; and a lid member disposed to cover the carrier and the semiconductor component and electrically connected to the second ground structure. The semiconductor component and the lid member are electrically connected with the first ground structure and the second ground structure, respectively, such that electrostatic charges and electromagnetic waves can be conducted away individually without damaging the semiconductor component, thereby improving yield and reducing the risk of short circuits.
摘要翻译：具有ESD（静电放电）和EMI（电磁干扰）防止功能的封装结构包括：具有彼此电绝缘的第一和第二接地结构的载体; 半导体部件，设置在所述载体的一个表面上并电连接到所述第一接地结构; 以及盖构件，其设置成覆盖所述载体和所述半导体部件并且电连接到所述第二接地结构。半导体部件和盖部件分别与第一接地结构和第二接地结构电连接，使得静电荷和电磁波可以单独传导而不损坏半导体部件，从而提高产量并降低短路的风险电路。

3. 发明授权

US08264070B2 Package structure with ESD and EMI preventing functions 有权
标题翻译：封装结构具有ESD和EMI防止功能
公开(公告)号：US08264070B2
公开(公告)日：2012-09-11
申请号：US12914217
申请日：2010-10-28
申请人： Tsung-Hsien Tsai , Heng-Cheng Chu , Hsin-Lung Chung , Chao-Ya Yang
发明人： Tsung-Hsien Tsai , Heng-Cheng Chu , Hsin-Lung Chung , Chao-Ya Yang
IPC分类号： H01L23/552
CPC分类号： H01L23/3121 , H01L23/49816 , H01L23/552 , H01L23/585 , H01L23/60 , H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/15192 , H01L2924/15311 , H01L2924/181 , H01L2924/19105 , H01L2924/3025 , H01L2924/00012 , H01L2924/00
摘要： A package structure with ESD (electrostatic discharge) and EMI (electromagnetic interference) preventing functions includes: a carrier having first and second ground structures electrically insulated from one another; a semiconductor component disposed on one surface of the carrier and electrically connected to the first ground structure; and a lid member disposed to cover the carrier and the semiconductor component and electrically connected to the second ground structure. The semiconductor component and the lid member are electrically connected with the first ground structure and the second ground structure, respectively, such that electrostatic charges and electromagnetic waves can be conducted away individually without damaging the semiconductor component, thereby improving yield and reducing the risk of short circuits.
摘要翻译：具有ESD（静电放电）和EMI（电磁干扰）防止功能的封装结构包括：具有彼此电绝缘的第一和第二接地结构的载体; 半导体部件，设置在所述载体的一个表面上并电连接到所述第一接地结构; 以及盖构件，其设置成覆盖所述载体和所述半导体部件并且电连接到所述第二接地结构。半导体部件和盖部件分别与第一接地结构和第二接地结构电连接，使得静电荷和电磁波可以单独传导而不损坏半导体部件，从而提高产量并降低短路的风险电路。

4. 发明申请

US20120133032A1 PACKAGE HAVING ESD AND EMI PREVENTING FUNCTIONS AND FABRICATION METHOD THEREOF 有权
标题翻译：具有ESD和EMI防护功能的封装及其制造方法
公开(公告)号：US20120133032A1
公开(公告)日：2012-05-31
申请号：US12987613
申请日：2011-01-10
申请人： Tsung-Hsien Tsai , Chih-Hsien Chiu , Hsin-Lung Chung , Chien-Cheng Lin
发明人： Tsung-Hsien Tsai , Chih-Hsien Chiu , Hsin-Lung Chung , Chien-Cheng Lin
IPC分类号： H01L23/552 , H01L21/78
CPC分类号： H01L21/4853 , H01L21/561 , H01L21/563 , H01L21/78 , H01L23/552 , H01L24/19 , H01L24/20 , H01L24/97 , H01L2224/0401 , H01L2224/04105 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2924/01029 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2224/85 , H01L2224/81 , H01L2224/19 , H01L2224/82 , H01L2224/83 , H01L2924/00 , H01L2924/00012
摘要： A package having ESD (electrostatic discharge) and EMI (electromagnetic interference) preventing functions includes: a substrate unit having a ground structure and an I/O structure disposed therein; at least a semiconductor component disposed on a surface of the substrate unit and electrically connected to the ground structure and the I/O structure; an encapsulant covering the surface of the substrate unit and the semiconductor component; and a metal layer disposed on exposed surfaces of the encapsulant and side surfaces of the substrate unit and electrically insulated from the ground structure, thereby protecting the semiconductor component against ESD and EMI so as to improve the product yield and reduce the risk of short circuits.
摘要翻译：具有ESD（静电放电）和EMI（电磁干扰）防止功能的封装包括：具有接地结构和设置在其中的I / O结构的衬底单元; 至少一个半导体部件，设置在所述基板单元的表面上并电连接到所述接地结构和所述I / O结构; 覆盖所述基板单元和所述半导体部件的表面的密封剂; 以及金属层，其设置在基板单元的密封剂和侧表面的暴露表面上并与基底结构电绝缘，从而保护半导体部件免受ESD和EMI，从而提高产品产量并降低短路的风险。

5. 发明授权

US09111945B2 Package having ESD and EMI preventing functions and fabrication method thereof 有权
标题翻译：具有ESD和EMI防止功能的封装及其制造方法
公开(公告)号：US09111945B2
公开(公告)日：2015-08-18
申请号：US12987613
申请日：2011-01-10
申请人： Tsung-Hsien Tsai , Chih-Hsien Chiu , Hsin-Lung Chung , Chien-Cheng Lin
发明人： Tsung-Hsien Tsai , Chih-Hsien Chiu , Hsin-Lung Chung , Chien-Cheng Lin
IPC分类号： H01L23/552 , H01L23/00
CPC分类号： H01L21/4853 , H01L21/561 , H01L21/563 , H01L21/78 , H01L23/552 , H01L24/19 , H01L24/20 , H01L24/97 , H01L2224/0401 , H01L2224/04105 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2924/01029 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2224/85 , H01L2224/81 , H01L2224/19 , H01L2224/82 , H01L2224/83 , H01L2924/00 , H01L2924/00012
摘要： A package having ESD (electrostatic discharge) and EMI (electromagnetic interference) preventing functions includes: a substrate unit having a ground structure and an I/O structure disposed therein; at least a semiconductor component disposed on a surface of the substrate unit and electrically connected to the ground structure and the I/O structure; an encapsulant covering the surface of the substrate unit and the semiconductor component; and a metal layer disposed on exposed surfaces of the encapsulant and side surfaces of the substrate unit and electrically insulated from the ground structure, thereby protecting the semiconductor component against ESD and EMI so as to improve the product yield and reduce the risk of short circuits.
摘要翻译：具有ESD（静电放电）和EMI（电磁干扰）防止功能的封装包括：具有接地结构和设置在其中的I / O结构的衬底单元; 至少一个半导体部件，设置在所述基板单元的表面上并电连接到所述接地结构和所述I / O结构; 覆盖所述基板单元和所述半导体部件的表面的密封剂; 以及金属层，其设置在基板单元的密封剂和侧表面的暴露表面上并与基底结构电绝缘，从而保护半导体部件免受ESD和EMI，从而提高产品产量并降低短路的风险。

6. 发明授权

US09150769B2 Phase-changing material microcapsules by using PMMA prepolymer and organic-solvent free synthesis process 有权
标题翻译：通过使用PMMA预聚物和无机溶剂的合成方法，改变相变材料微胶囊
公开(公告)号：US09150769B2
公开(公告)日：2015-10-06
申请号：US13442126
申请日：2012-04-09
申请人： Yi-Hsiuan Yu , Ping-Szu Tsai , Tsung-Hsien Tsai , Bao-Yann Lin , Ming-Hsiung Wei
发明人： Yi-Hsiuan Yu , Ping-Szu Tsai , Tsung-Hsien Tsai , Bao-Yann Lin , Ming-Hsiung Wei
IPC分类号： A61Q17/04 , A61K36/00 , C09K5/02 , C09K5/06 , C08F220/14 , C08F22/10
CPC分类号： C09K5/02 , C08F22/105 , C08F220/14 , C09K5/063
摘要： Phase change material microcapsules are obtained using a PMMA prepolymer and an organic-solvent free synthesis process. A polymer monomer and an initiator are subject to pre-polymerization in a water bath to form Polymethyl methacrylate (PMMA) prepolymer which is then prepared to be a stabilizer aqueous solution. A phase change material is added to the stabilizer aqueous solution and liquefied in advance, and stirred to form an emulsion by a homogenizing mixer. A starting agent, a cross-linking agent and a Polymethyl methacrylate methyl ester prepolymer are added to the emulsion containing the phase-change material. The emulsion is further stirred by the homogenizing mixer for micro-emulsification which then aggregates in water bath. In this way, the process may use organic-solvent free process to pre-polymerize the polymer monomer into a Polymethyl methacrylate prepolymer and carries out encapsulation and polymerization at an oil-water interface to achieve the preparation of phase change material microcapsules.
摘要翻译：使用PMMA预聚物和无有机溶剂的合成方法获得相变材料微胶囊。聚合物单体和引发剂在水浴中进行预聚合以形成聚甲基丙烯酸甲酯（PMMA）预聚物，然后将其制备为稳定剂水溶液。将相变材料加入到稳定剂水溶液中并预先液化，并通过均化混合器搅拌形成乳液。将起始剂，交联剂和聚甲基丙烯酸甲酯甲酯预聚物加入含有相变材料的乳液中。通过用于微乳化的均化混合器进一步搅拌该乳液，然后将其在水浴中聚集。以这种方式，该方法可以使用无有机溶剂的方法将聚合物单体预聚合成聚甲基丙烯酸甲酯预聚物，并在油 - 水界面处进行封装和聚合以实现相变材料微胶囊的制备。

7. 发明授权

US08589831B1 Skew sensitive calculation for misalignment from multi patterning 有权
标题翻译：对多图案化的偏移的偏移计算
公开(公告)号：US08589831B1
公开(公告)日：2013-11-19
申请号：US13561189
申请日：2012-07-30
申请人： Chih-Hsien Chang , Min-Shueh Yuan , Tsung-Hsien Tsai
发明人： Chih-Hsien Chang , Min-Shueh Yuan , Tsung-Hsien Tsai
IPC分类号： G06F17/50
CPC分类号： G06F17/5068
摘要： Some aspects of the present disclosure provide for a method of accurately simulating variations in an operating parameter, due to processing variations caused by a multi-patterning exposure, by reducing the impact of layout sections having a large width and spacing. The method assigns a skew sensitive index to one or more sections of a multi-patterning layer formed with a first mask. Runlengths of the one or more sections are respectively multiplied by an assigned skew sensitive index to determine a skew variation for each of the one or more sections. The overall skew variation sum is then determined by summing the skew variation for each of the one or more sections. By separately determining the effects of processing variations (e.g., mask misalignment) for different sections of a multi-patterning layer, an accurate measurement of operating parameter variations is achieved.
摘要翻译：本公开的一些方面提供了通过减小具有大的宽度和间隔的布局部分的影响，由于由多图案化曝光引起的处理变化，准确地模拟操作参数的变化的方法。该方法为由形成有第一掩模的多图案化层的一个或多个部分分配偏斜敏感指数。一个或多个部分的运行长度分别乘以一个分配的偏移敏感指数，以确定一个或多个部分中的每个部分的偏斜变化。然后通过对一个或多个部分中的每一个的偏斜变化求和来确定总体偏差变化和。通过分别确定多图案化层的不同部分的处理变化（例如，掩模未对准）的影响，实现了操作参数变化的精确测量。

8. 发明申请

US20130264513A1 PHASE-CHANGING MATERIAL MICROCAPSULES BY USING PMMA PREPOLYMER AND ORGANIC-SOLVENT FREE SYNTHESIS PROCESS 有权
标题翻译：通过使用PMMA预处理器和有机溶剂自由合成过程的相变材料微球
公开(公告)号：US20130264513A1
公开(公告)日：2013-10-10
申请号：US13442126
申请日：2012-04-09
申请人： Yi-Hsiuan Yu , Ping-Szu Tsai , Tsung-Hsien Tsai , Bao-Yann Lin , Ming-Hsiung Wei
发明人： Yi-Hsiuan Yu , Ping-Szu Tsai , Tsung-Hsien Tsai , Bao-Yann Lin , Ming-Hsiung Wei
IPC分类号： C09K5/02
CPC分类号： C09K5/02 , C08F22/105 , C08F220/14 , C09K5/063
摘要： Phase change material microcapsules are obtained using a PMMA prepolymer and an organic-solvent free synthesis process. A polymer monomer and an initiator are subject to pre-polymerization in a water bath to form Polymethyl methacrylate (PMMA) prepolymer which is then prepared to be a stabilizer aqueous solution. A phase change material is added to the stabilizer aqueous solution and liquefied in advance, and stirred to form an emulsion by a homogenizing mixer. A starting agent, a cross-linking agent and a Polymethyl methacrylate methyl ester prepolymer are added to the emulsion containing the phase-change material. The emulsion is further stirred by the homogenizing mixer for micro-emulsification which then aggregates in water bath. In this way, the process may use organic-solvent free process to pre-polymerize the polymer monomer into a Polymethyl methacrylate prepolymer and carries out encapsulation and polymerization at an oil-water interface to achieve the preparation of phase change material microcapsules.
摘要翻译：使用PMMA预聚物和无有机溶剂的合成方法获得相变材料微胶囊。聚合物单体和引发剂在水浴中进行预聚合以形成聚甲基丙烯酸甲酯（PMMA）预聚物，然后将其制备为稳定剂水溶液。将相变材料加入到稳定剂水溶液中并预先液化，并通过均化混合器搅拌形成乳液。将起始剂，交联剂和聚甲基丙烯酸甲酯甲酯预聚物加入含有相变材料的乳液中。通过用于微乳化的均化混合器进一步搅拌该乳液，然后将其在水浴中聚集。以这种方式，该方法可以使用无有机溶剂的方法将聚合物单体预聚合成聚甲基丙烯酸甲酯预聚物，并在油 - 水界面处进行封装和聚合以实现相变材料微胶囊的制备。

9. 发明授权

US08183914B2 Constant Gm circuit and methods 有权
标题翻译：恒定电路和方法
公开(公告)号：US08183914B2
公开(公告)日：2012-05-22
申请号：US12617583
申请日：2009-11-12
申请人： Tsung-Hsien Tsai , Chien-Hung Chen , Min-Shueh Yuan
发明人： Tsung-Hsien Tsai , Chien-Hung Chen , Min-Shueh Yuan
IPC分类号： G05F1/575 , G05F1/567
CPC分类号： G05F3/242
摘要： Structures and methods for providing a temperature independent constant current reference are provided. A constant Gm circuit is disclosed with embodiments including a voltage controlled resistor providing a current into a current mirror, the current mirror sinking a reference current at its output. By providing a feedback loop that controls the voltage controlled resistor, a temperature compensated circuit may be obtained. The temperature dependence of the voltage controlled resistor is positive and the feedback circuitry maintains this resistor at a value that compensates for the negative temperature dependence of the current mirror circuit. The reference current is thus obtained at a predetermined level independent of temperature. A method for providing a reference current is disclosed wherein a voltage dependent resistor is provided supply current to a current mirror, the voltage dependent resistor receiving a feedback voltage from the current mirror and the feedback controlling the resistor so that a temperature independent reference current is obtained.
摘要翻译：提供了提供独立于温度的恒流基准的结构和方法。公开了一种恒定的Gm电路，其实施例包括向电流镜提供电流的电压控制电阻器，电流镜在其输出端吸收参考电流。通过提供控制压控电阻器的反馈回路，可以获得温度补偿电路。电压控制电阻的温度依赖性为正，并且反馈电路将该电阻保持在补偿电流镜电路的负温度依赖性的值。因此，在与温度无关的预定水平上获得参考电流。公开了一种用于提供参考电流的方法，其中提供电压依赖电阻器供应电流到电流镜，电压相关电阻器接收来自电流镜的反馈电压和控制电阻器的反馈，使得获得与温度无关的参考电流。

10. 发明申请

US20100176777A1 Constant Gm Circuit and Methods 有权
标题翻译：恒定电路和方法
公开(公告)号：US20100176777A1
公开(公告)日：2010-07-15
申请号：US12617583
申请日：2009-11-12
申请人： Tsung-Hsien Tsai , Chien-Hung Chen , Min-Shueh Yuan
发明人： Tsung-Hsien Tsai , Chien-Hung Chen , Min-Shueh Yuan
IPC分类号： G05F1/10
CPC分类号： G05F3/242
摘要： Structures and methods for providing a temperature independent constant current reference are provided. A constant Gm circuit is disclosed with embodiments including a voltage controlled resistor providing a current into a current mirror, the current mirror sinking a reference current at its output. By providing a feedback loop that controls the voltage controlled resistor, a temperature compensated circuit may be obtained. The temperature dependence of the voltage controlled resistor is positive and the feedback circuitry maintains this resistor at a value that compensates for the negative temperature dependence of the current mirror circuit. The reference current is thus obtained at a predetermined level independent of temperature. A method for providing a reference current is disclosed wherein a voltage dependent resistor is provided supply current to a current mirror, the voltage dependent resistor receiving a feedback voltage from the current mirror and the feedback controlling the resistor so that a temperature independent reference current is obtained.
摘要翻译：提供了提供独立于温度的恒流基准的结构和方法。公开了一种恒定的Gm电路，其实施例包括向电流镜提供电流的电压控制电阻器，电流镜在其输出端吸收参考电流。通过提供控制压控电阻器的反馈回路，可以获得温度补偿电路。电压控制电阻的温度依赖性为正，并且反馈电路将该电阻保持在补偿电流镜电路的负温度依赖性的值。因此，在与温度无关的预定水平上获得参考电流。公开了一种用于提供参考电流的方法，其中提供电压依赖电阻器供应电流到电流镜，电压相关电阻器接收来自电流镜的反馈电压和控制电阻器的反馈，使得获得与温度无关的参考电流。

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