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    • 1. 发明申请
    • Display device and method of manufacturing the same
    • 显示装置及其制造方法
    • US20090101902A1
    • 2009-04-23
    • US12076297
    • 2008-03-17
    • Han-Tu LinChien-Hung ChenShiun-Chang Jan
    • Han-Tu LinChien-Hung ChenShiun-Chang Jan
    • H01L33/00H01L21/00
    • H01L27/1288H01L27/1214H01L27/124H01L27/1255
    • A substrate comprising a thin-film-transistor (TFT) region, a pixel region, a gate-line region and a data-line region is provided. A transparent conductive layer and a first metal layer are orderly formed on the substrate. A conductive stack layer is formed within each of the TFT/pixel/gate-line regions and the end of the data-line region. Next, a first insulating layer and a semiconductor layer are orderly formed, and a patterned first insulating layer and a patterned semiconductor layer are formed above the conductive stack layer within the TFT region. Then, a second metal layer and a first photoresist layer are respectively formed. Afterwards, the second and the first metal layers are patterned by using the first photoresist layer as a photomask. Finally, the first photoresist layer is reflowed by heat, and part of the reflowed first photoresist layer covers a channel formed within the TFT region.
    • 提供了包括薄膜晶体管(TFT)区域,像素区域,栅极线区域和数据线区域的衬底。 在衬底上有序地形成透明导电层和第一金属层。 在每个TFT /像素/栅极线区域和数据线区域的末端中形成导电堆叠层。 接下来,有序地形成第一绝缘层和半导体层,并且在TFT区域内的导电堆叠层的上方形成图案化的第一绝缘层和图案化半导体层。 然后,分别形成第二金属层和第一光致抗蚀剂层。 之后,通过使用第一光致抗蚀剂层作为光掩模来对第二和第一金属层进行构图。 最后,第一光致抗蚀剂层通过热回流,并且回流的第一光致抗蚀剂层的一部分覆盖形成在TFT区域内的沟道。
    • 2. 发明授权
    • Display device and method of manufacturing the same
    • 显示装置及其制造方法
    • US08143624B2
    • 2012-03-27
    • US12076297
    • 2008-03-17
    • Han-Tu LinChien-Hung ChenShiun-Chang Jan
    • Han-Tu LinChien-Hung ChenShiun-Chang Jan
    • H01L27/14
    • H01L27/1288H01L27/1214H01L27/124H01L27/1255
    • A substrate comprising a thin-film-transistor (TFT) region, a pixel region, a gate-line region and a data-line region is provided. A transparent conductive layer and a first metal layer are orderly formed on the substrate. A conductive stack layer is formed within each of the TFT/pixel/gate-line regions and the end of the data-line region. Next, a first insulating layer and a semiconductor layer are orderly formed, and a patterned first insulating layer and a patterned semiconductor layer are formed above the conductive stack layer within the TFT region. Then, a second metal layer and a first photoresist layer are respectively formed. Afterwards, the second and the first metal layers are patterned by using the first photoresist layer as a photomask. Finally, the first photoresist layer is reflowed by heat, and part of the reflowed first photoresist layer covers a channel formed within the TFT region.
    • 提供了包括薄膜晶体管(TFT)区域,像素区域,栅极线区域和数据线区域的衬底。 在衬底上有序地形成透明导电层和第一金属层。 在每个TFT /像素/栅极线区域和数据线区域的末端中形成导电堆叠层。 接下来,有序地形成第一绝缘层和半导体层,并且在TFT区域内的导电堆叠层的上方形成图案化的第一绝缘层和图案化半导体层。 然后,分别形成第二金属层和第一光致抗蚀剂层。 之后,通过使用第一光致抗蚀剂层作为光掩模来对第二和第一金属层进行构图。 最后,第一光致抗蚀剂层通过热回流,并且回流的第一光致抗蚀剂层的一部分覆盖形成在TFT区域内的沟道。
    • 4. 发明授权
    • Method for fabricating thin film transistor array substrate
    • 薄膜晶体管阵列基板的制造方法
    • US08349631B2
    • 2013-01-08
    • US13225568
    • 2011-09-06
    • Shine-Kai TsengHan-Tu LinShiun-Chang JanKuo-Lung Fang
    • Shine-Kai TsengHan-Tu LinShiun-Chang JanKuo-Lung Fang
    • H01L21/338H01L31/112
    • H01L27/1248H01L27/1288
    • A method for fabricating a TFT array substrate includes following steps. A gate pattern and a first pad pattern are formed on a substrate. A gate insulation layer and a semiconductor layer covering the two patterns are sequentially formed. A patterned photoresist layer having different resist blocks is formed, and patterns and thicknesses of the resist blocks in different regions are adjusted. The semiconductor layer and the gate insulation layer above the first pad pattern are removed through performing an etching process and reducing a thickness of the patterned photoresist layer. After removing the patterned photoresist layer, a source pattern, a drain pattern, and a second pad pattern electrically connected to the first pad pattern are formed. A patterned passivation layer is formed on the gate insulation layer and has a second opening exposing the source pattern or the drain pattern and a third opening exposing the second pad pattern.
    • 制造TFT阵列基板的方法包括以下步骤。 在基板上形成栅极图案和第一焊盘图案。 依次形成覆盖这两个图案的栅绝缘层和半导体层。 形成具有不同抗蚀剂块的图案化光致抗蚀剂层,并且调整不同区域中的抗蚀剂块的图案和厚度。 通过执行蚀刻工艺并减小图案化光致抗蚀剂层的厚度来去除第一焊盘图案上方的半导体层和栅极绝缘层。 在去除图案化的光致抗蚀剂层之后,形成电连接到第一焊盘图案的源图案,漏极图案和第二焊盘图案。 图案化的钝化层形成在栅极绝缘层上,并且具有暴露源图案或漏极图案的第二开口和暴露第二焊盘图案的第三开口。
    • 7. 发明申请
    • METHOD FOR FABRICATING THIN FILM TRANSISTOR ARRAY SUBSTRATE
    • 用于制造薄膜晶体管阵列基板的方法
    • US20110318856A1
    • 2011-12-29
    • US13225568
    • 2011-09-06
    • Shine-Kai TsengHan-Tu LinShiun-Chang JanKuo-Lung Fang
    • Shine-Kai TsengHan-Tu LinShiun-Chang JanKuo-Lung Fang
    • H01L21/336
    • H01L27/1248H01L27/1288
    • A method for fabricating a TFT array substrate includes following steps. A gate pattern and a first pad pattern are formed on a substrate. A gate insulation layer and a semiconductor layer covering the two patterns are sequentially formed. A patterned photoresist layer having different resist blocks is formed, and patterns and thicknesses of the resist blocks in different regions are adjusted. The semiconductor layer and the gate insulation layer above the first pad pattern are removed through performing an etching process and reducing a thickness of the patterned photoresist layer. After removing the patterned photoresist layer, a source pattern, a drain pattern, and a second pad pattern electrically connected to the first pad pattern are formed. A patterned passivation layer is formed on the gate insulation layer and has a second opening exposing the source pattern or the drain pattern and a third opening exposing the second pad pattern.
    • 制造TFT阵列基板的方法包括以下步骤。 在基板上形成栅极图案和第一焊盘图案。 依次形成覆盖这两个图案的栅绝缘层和半导体层。 形成具有不同抗蚀剂块的图案化光致抗蚀剂层,并且调整不同区域中的抗蚀剂块的图案和厚度。 通过执行蚀刻工艺并减小图案化光致抗蚀剂层的厚度来去除第一焊盘图案上方的半导体层和栅极绝缘层。 在去除图案化的光致抗蚀剂层之后,形成电连接到第一焊盘图案的源图案,漏极图案和第二焊盘图案。 图案化的钝化层形成在栅极绝缘层上,并且具有暴露源图案或漏极图案的第二开口和暴露第二焊盘图案的第三开口。