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1. 发明授权

US11864350B2 Heat conduction apparatus and terminal device 有权
公开(公告)号：US11864350B2
公开(公告)日：2024-01-02
申请号：US17631256
申请日：2020-07-23
申请人： Huawei Technologies Co., Ltd.
发明人： Yongfu Sun , Jian Shi , Jie Yang , Linfang Jin , Zhen Sun
IPC分类号： H05K7/20 , H05K5/00
CPC分类号： H05K7/20336 , H05K5/0017 , H05K7/2099
摘要： A heat conduction apparatus includes a first cover plate and a second cover plate. The first cover plate is hermetically connected to the second cover plate. The first cover plate is provided with a plurality of grooves. A supporting portion is formed between two adjacent grooves. A liquid circulation channel and a vapor circulation channel are formed in the groove. The liquid circulation channel is filled with a liquid working medium. The liquid circulation channel is communicated with the vapor circulation channel. The liquid working medium vaporizes into vapor. The vapor enters the vapor circulation channel and condenses into liquid. The liquid enters the liquid circulation channel.

2. 发明申请

US20220279683A1 Heat Conduction Apparatus and Terminal Device 有权
公开(公告)号：US20220279683A1
公开(公告)日：2022-09-01
申请号：US17631256
申请日：2020-07-23
申请人： Huawei Technologies Co., Ltd.
发明人： Yongfu Sun , Jian Shi , Jie Yang , Linfang Jin , Zhen Sun
IPC分类号： H05K7/20 , H05K5/00
摘要： A heat conduction apparatus includes a first cover plate and a second cover plate. The first cover plate is hermetically connected to the second cover plate. The first cover plate is provided with a plurality of grooves. A supporting portion is formed between two adjacent grooves. A liquid circulation channel and a vapor circulation channel are formed in the groove. The liquid circulation channel is filled with a liquid working medium. The liquid circulation channel is communicated with the vapor circulation channel. The liquid working medium vaporizes into vapor. The vapor enters the vapor circulation channel and condenses into liquid. The liquid enters the liquid circulation channel.

3. 发明申请

US20210388849A1 Centrifugal Fan and Terminal 有权
公开(公告)号：US20210388849A1
公开(公告)日：2021-12-16
申请号：US17408278
申请日：2021-08-20
申请人： Huawei Technologies Co., Ltd.
发明人： Jianliang Wang , Liujun Zou , Jian Shi , Zhiguo Zhang
IPC分类号： F04D29/44 , F04D29/42 , F04D17/08 , G06F1/20
摘要： A centrifugal fan is disclosed. The centrifugal fan includes a housing, and the housing is configured to accommodate an impeller. The impeller rotates relative to the housing. A flow channel that cooperates with the impeller is disposed in the housing. The flow channel includes a pressurization area. In the pressurization area, a static pressure and a flow velocity of an air flow are gradually increased along a rotation direction of the impeller. However, an air inlet is disposed on the housing, and there is a specific gap between the impeller and the air inlet. As a result, when air flows through the pressurization area, there is a specific amount of leakage through the gap. Therefore, an air baffle ring is disposed in the centrifugal fan provided in this application.

4. 发明公开

US20240164053A1 Liquid Cooling Plate, Liquid Cooling System, and Electronic Device 审中-公开
公开(公告)号：US20240164053A1
公开(公告)日：2024-05-16
申请号：US18422847
申请日：2024-01-25
申请人： Huawei Technologies Co., Ltd.
发明人： Jianliang Wang , Dzmitry Kushner , Jiyang Li , Shuqin Xie , Along Zhou , Jian Shi , Shoubiao Xu
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： H05K7/20254 , G06F1/203 , H05K7/20263
摘要： A liquid cooling plate includes a housing, a support structure, and a coolant. The housing includes a top wall and a bottom wall, the top wall and the bottom wall are covered to form an accommodation cavity, and the accommodation cavity includes a first region and a second region. The support structure is disposed in the first region and is located between the top wall and the bottom wall. The coolant flows in the accommodation cavity to dissipate heat from a heat generating device, the coolant can expand in volume when being heated and shrink in volume when being cooled, and the second region can deform to absorb a volume variation of the coolant.

5. 发明申请

US20130299125A1 COOLING SYSTEM AND METHOD FOR COOLING RADIO UNIT 审中-公开
标题翻译：冷却系统和冷却无线电单元的方法
公开(公告)号：US20130299125A1
公开(公告)日：2013-11-14
申请号：US13667462
申请日：2012-11-02
申请人： HUAWEI TECHNOLOGIES CO., LTD.
发明人： Jian Shi , Stephen Haworth , Yi Zhang
IPC分类号： F28F9/00
CPC分类号： H01L23/467 , H01L23/3672 , H01L2924/0002 , H04B1/036 , H01L2924/00
摘要： At least one heat generating radio unit in an active antenna system unit, the cooling system comprising at least one fan and an air duct, where each heat generating radio unit to be cooled by the cooling system is arranged connected to a heat sink unit comprising cooling fins, the heat sink unit being arranged to transfer heat between the radio unit and the ambient air, where the at least one fan is arranged to generate a primary air flow of ambient air in the air duct between at least one air duct inlet and at least one air duct outlet, where the air duct is arranged to extend in the longitudinal direction (A) of the active antenna system unit along each of the said heat sink units and to border on each of the said heat sink units.
摘要翻译：在有源天线系统单元中的至少一个发热无线电单元，所述冷却系统包括至少一个风扇和风道，其中要由所述冷却系统冷却的每个发热无线电单元布置成连接到散热单元，所述散热单元包括冷却所述散热单元被布置成在所述无线电单元和所述环境空气之间传递热量，其中所述至少一个风扇被布置成在至少一个空气通道入口和在至少一个空气通道入口之间的空气管道中产生环境空气的一次空气流至少一个空气管道出口，其中空气管道布置成沿着每个所述散热器单元沿有源天线系统单元的纵向方向（A）延伸并且在每个所述散热器单元上边界。

6. 发明申请

US20130199208A1 LIQUID COOLING SYSTEM AND METHOD FOR COOLING AT LEAST ONE HEAT GENERATING COMPONENT 审中-公开
标题翻译：用于冷却至少一个发热组件的液体冷却系统和方法
公开(公告)号：US20130199208A1
公开(公告)日：2013-08-08
申请号：US13705967
申请日：2012-12-05
申请人： Huawei Technologies Co., Ltd.
发明人： Jian Shi , Vadim Tsoi
IPC分类号： F25B21/02
CPC分类号： F25B21/02 , F25B2321/0252 , F25B2400/04 , H01L23/473 , H01L2924/0002 , H05K7/20218 , H01L2924/00
摘要： A liquid cooling system for cooling at least one heat generating component, comprises a liquid loop in which liquid is arranged to be circulated, and arranged to be cooled by a first stage cooling unit, where the cold side of at least one Thermo Electric Cooling unit is arranged at a position situated downstream of the first stage cooling unit and upstream of the at least one heat generating component to be cooled by liquid, where the at least one Thermo Electric Cooling unit is arranged in its operative state to cool the liquid in order to provide for further cooling power when the cooling power of the first stage cooling unit is not sufficient.
摘要翻译：一种用于冷却至少一个发热部件的液体冷却系统，包括液体循环，液体被布置成循环，并且被布置成被第一级冷却单元冷却，其中至少一个热电冷却单元布置在位于第一级冷却单元下游的位置，并且至少一个发热部件的上游将由液体冷却，其中至少一个热电冷却单元布置在其操作状态以依次冷却液体以在第一级冷却单元的冷却功率不足时提供进一步的冷却功率。

7. 发明授权

US11719256B2 Centrifugal fan and terminal 有权
公开(公告)号：US11719256B2
公开(公告)日：2023-08-08
申请号：US17408278
申请日：2021-08-20
申请人： Huawei Technologies Co., Ltd.
发明人： Jianliang Wang , Liujun Zou , Jian Shi , Zhiguo Zhang
IPC分类号： F01D1/02 , F04D29/44 , F04D17/16 , F04D29/42 , G06F1/20
CPC分类号： F04D29/441 , F04D17/16 , F04D29/4226 , G06F1/203
摘要： A centrifugal fan includes a housing configured to accommodate an impeller. The impeller rotates relative to the housing. A flow channel that cooperates with the impeller is disposed in the housing. The flow channel includes a pressurization area, in which a static pressure and a flow velocity of an air flow are gradually increased along a rotation direction of the impeller. However, an air inlet is disposed on the housing, and there is a specific gap between the impeller and the air inlet. As a result, when air flows through the pressurization area, there is a specific amount of leakage through the gap. Therefore, an air baffle ring is disposed in the centrifugal fan provided in this application.

8. 发明授权

US11665816B2 Circuit board, method for manufacturing circuit board, and electronic device 有权
公开(公告)号：US11665816B2
公开(公告)日：2023-05-30
申请号：US17598530
申请日：2020-03-27
申请人： Huawei Technologies Co., Ltd.
发明人： Zhi Yuan , Guo Yang , Jian Shi , Linfang Jin , Zhen Xu
IPC分类号： H05K1/02 , H05K3/46
CPC分类号： H05K1/0272 , H05K1/0203 , H05K1/0219 , H05K3/4644 , H05K2201/064 , H05K2201/10121
摘要： In an electronic device, a circuit board connects different systems or structures such that heat of a system with a relatively large amount of heat can be transferred to a position or a heat dissipation structure with a relatively small amount of heat, thereby mitigating local high temperatures in the electronic device and distributing heat more evenly throughout the electronic device.

9. 发明授权

US12085840B2 Camera assembly and electronic device 有权
公开(公告)号：US12085840B2
公开(公告)日：2024-09-10
申请号：US17871533
申请日：2022-07-22
申请人： HUAWEI TECHNOLOGIES CO., LTD.
发明人： Sen Wang , Jian Shi , Zhi Yuan , Weidong Tang , Along Zhou , Chenhan Liu
IPC分类号： G03B17/55 , G03B30/00 , H04N23/52 , H04N23/54 , H04N23/55
CPC分类号： G03B17/55 , G03B30/00 , H04N23/52 , H04N23/54 , H04N23/55
摘要： A camera assembly is provided. The camera assembly includes an auxiliary mount, a rotatable camera module and a flexible heat conducting assembly, the rotatable camera module includes a rotatable mount and a camera function group disposed on the rotatable mount, the rotatable mount is rotatably connected to the auxiliary mount, the flexible heat conducting assembly is fixedly connected to one end of the camera function group, and the flexible heat conducting assembly is further configured to be connected to a non-rotatable camera module component, so that heat generated by the camera function group is transferred to the non-rotatable camera module component. A flexible heat conducting assembly performs a cross-region transfer of heat generated by the rotatable camera module, to help reduce an ambient temperature of the rotatable camera module, so as to improve photography quality of the camera module, and prolong a photography time period of the rotatable camera module.

10. 发明公开

US20240164056A1 GAS COLLECTION APPARATUS 审中-公开
公开(公告)号：US20240164056A1
公开(公告)日：2024-05-16
申请号：US18550265
申请日：2022-03-11
申请人： HUAWEI TECHNOLOGIES CO., LTD.
发明人： Huipeng Wu , Xinpei Huang , Tao Liu , Along Zhou , Jian Shi
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： H05K7/20272 , G06F1/203 , H05K7/20254
摘要： This application relates to the field of liquid cooling technologies, and provides a gas collection apparatus, configured to collect bubbles generated due to loss of a working medium in a liquid cooling apparatus. The gas collection apparatus includes a cooling plate. The cooling plate includes at least one gas collection structure disposed inside the cooling plate, a first flow channel disposed inside the cooling plate, a second flow channel disposed inside the gas collection structure, and at least one connecting channel configured to connect the first flow channel and the second flow channel. The at least one connecting channel is configured to transfer, to the second flow channel, bubbles carried when the working medium flows in the first flow channel. The at least one gas collection structure is configured to collect the bubbles from the second flow channel.

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