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1. 发明申请

US20150136170A1 METHOD FOR REMOVING ADHESIVE AGENT 审中-公开
标题翻译：去除粘合剂的方法
公开(公告)号：US20150136170A1
公开(公告)日：2015-05-21
申请号：US14520910
申请日：2014-10-22
申请人： HON HAI PRECISION INDUSTRY CO., LTD.
发明人： MING-JEN CHANG , JHIH-KUEI GE , CHANG-CHIN WU
IPC分类号： B08B3/08 , H05K3/22 , B08B1/00
CPC分类号： H05K3/22 , H05K3/225 , H05K3/282 , H05K3/305 , H05K2203/0264 , H05K2203/0769 , H05K2203/108 , H05K2203/1383 , H05K2203/176 , H05K2203/304
摘要： A method for removing an adhesive agent from a base plate with a plurality of accessories installed adjacent to the adhesive agent includes certain steps. The steps form a protection layer on the base plate, and the protection layer completely covers the electronic members and completely or partially covers the adhesive agent. The protection layer is solidified and a part of the protection layer is removed to expose the adhesive agent. The base plate is soaked in a removing solution to soften the adhesive agent and decrease an adhering strength of the adhesive agent, the protection layer being resistant to the removing solution to protect the electronic members. The softened adhesive agent is scraped off and the remaining protection layer removed.
摘要翻译：一种用于从具有多个附着在粘合剂附近安装的附件的基板上去除粘合剂的方法包括一些步骤。台阶在基板上形成保护层，保护层完全覆盖电子元件，完全或部分覆盖粘合剂。保护层固化，并且去除保护层的一部分以露出粘合剂。将底板浸泡在去除溶液中以软化粘合剂并降低粘合剂的粘合强度，保护层对除去溶液具有抵抗力以保护电子部件。将软化的粘合剂刮去并且剩余的保护层被去除。

2. 发明申请

US20140144590A1 ADHESIVE STRUCTURE, SURFACE TREATING AGENT, AND METHOD OF SEPARATING THE SAME 审中-公开
标题翻译：胶粘结构，表面处理剂及其分离方法
公开(公告)号：US20140144590A1
公开(公告)日：2014-05-29
申请号：US14080969
申请日：2013-11-15
申请人： HON HAI PRECISION INDUSTRY CO., LTD.
发明人： JHIH-KUEI GE , CHIH-PEN LIN , MING-JEN CHANG
IPC分类号： B32B7/06 , B32B43/00
CPC分类号： B32B7/06 , B32B7/12 , B32B15/04 , B32B43/006 , B32B2255/06 , B32B2255/20 , B32B2307/208 , B32B2310/12 , Y10T156/11 , Y10T428/254
摘要： An adhering structure is disclosed. The adhering structure includes an adhering member, an adhesive layer, and a surface treatment layer sandwiched between the adhering member and the adhesive. The surface treatment layer includes a plurality of magnetic disabling particles. Each of the plurality of magnetic disabling particles has a core-shell structure, and includes a magnetic shell and a core capsulated in the magnetic shell. The core decreases an adhesive strength of the adhesive layer.
摘要翻译：公开了一种附着结构。粘合结构包括粘合构件，粘合剂层和夹在粘合构件和粘合剂之间的表面处理层。表面处理层包括多个磁性不良颗粒。多个磁性不良粒子中的每一个具有核 - 壳结构，并且包括磁性壳和封装在磁性壳中的芯。该芯降低了粘合剂层的粘合强度。

3. 发明申请

US20160347977A1 CURING AGENT, METHOD FOR MAKING THE SAME, AND STRUCTURAL ADHESIVE USING THE SAME 审中-公开
标题翻译：固化剂，其制备方法和使用其的结构粘合剂
公开(公告)号：US20160347977A1
公开(公告)日：2016-12-01
申请号：US14843044
申请日：2015-09-02
申请人： HON HAI PRECISION INDUSTRY CO., LTD.
发明人： JHIH-KUEI GE , MING-JEN CHANG , TING-HSIEN LEE
IPC分类号： C09J163/00 , C08K9/04
CPC分类号： C08K9/04 , C08G59/188 , C08J3/242 , C08J2363/00
摘要： A curing agent in a structural adhesive includes a plurality of spherical shells and a curing compound bonded to an outer surface of each of the plurality of spherical shells. Each spherical shell is formed of a plurality of primary magnetic nanoparticles. The spherical shells can be broken down under an applied frequency-varied magnetic field, allowing objects bonded by such adhesive to be separated. A method for making the curing agent, and a structural adhesive using the curing agent are also provided.
摘要翻译：结构粘合剂中的固化剂包括多个球形壳和结合到多个球形壳中的每一个的外表面的固化化合物。每个球形壳体由多个初级磁性纳米颗粒形成。球形壳可以在施加的频率变化的磁场下分解，允许通过这种粘合剂粘合的物体被分离。还提供了制备固化剂的方法和使用该固化剂的结构粘合剂。

4. 发明申请

US20150183172A1 METHOD FOR REPAIRING ELECTRONIC DEVICE 审中-公开
标题翻译：修复电子设备的方法
公开(公告)号：US20150183172A1
公开(公告)日：2015-07-02
申请号：US14583101
申请日：2014-12-25
申请人： HON HAI PRECISION INDUSTRY CO., LTD.
发明人： MING-JEN CHANG , JHIH-KUEI GE , YU-TING CHIU
IPC分类号： B29C73/00 , B32B43/00
CPC分类号： B32B43/006 , H04M1/0202 , Y10T156/1158
摘要： A method is employed for repairing an electronic device. The electronic device includes a base plate, a component installed on the base plate, and a second workpiece adhered on the base plate by an adhesive agent which is positioned adjacent to or away from the component. The method includes the following procedures. A reflective layer is formed on a side of the base plate away from the component to cover the part of the base plate corresponding to the component, and the reflective protection layer is capable of reflecting infrared radiation to protect the component. The adhesive agent is softened by infrared radiation to decrease an adhesive strength of the adhesive agent. The remaining reflective protection layer is removed. The electronic device is dissembled to separate the first workpiece from the second workpiece.
摘要翻译：采用一种修复电子设备的方法。电子设备包括基板，安装在基板上的部件和通过邻近或远离部件定位的粘合剂粘附在基板上的第二工件。该方法包括以下步骤。反射层形成在基板的远离部件的一侧以覆盖对应于部件的基板的部分，并且反射保护层能够反射红外辐射以保护部件。粘合剂通过红外辐射软化，降低粘合剂的粘合强度。剩下的反射保护层被去除。电子设备被拆卸以将第一工件与第二工件分离。

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