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    • 1. 发明授权
    • Modular wafer polishing apparatus and method
    • 模块化晶圆抛光装置及方法
    • US5957764A
    • 1999-09-28
    • US964930
    • 1997-11-05
    • H. Alexander AndersonLinh X. CanTsungnan ChengGarry K. KwongAlbert HuDavid ChenShu-Wong S. Lee
    • H. Alexander AndersonLinh X. CanTsungnan ChengGarry K. KwongAlbert HuDavid ChenShu-Wong S. Lee
    • B24B21/04B24B37/04B24B5/00B24B29/00
    • B24B21/04B24B37/04
    • A wafer polishing apparatus includes a module frame; a continuous belt rotatable with respect to the frame, the belt having at least one vertically-oriented belt transverse portion including a polishing pad assembly; and at least one pivotable wafer-holding head drive within the frame and having a distal end portion movable to a vertical first position parallel and juxtaposed to the belt transverse portion. The head drive includes a wafer carrier for holding a wafer on the distal end portion of the head drive, while a drive moves the distal end portion and a held wafer into a vertical polishing position abutting the belt transverse portion and pressure is applied to the held-wafer against the polishing pad assembly while the wafer-holding distal end portion is rotated and swept side-by-side. After polishing the drive is reversed and the head drive is pivoted away from the belt transverse portion to a horizontal or other orientation and the then polished wafer removed. Multiple modules may be placed end-to-end or side-by-side with a robot pathway therebetween to load unpolished wafers and to unload polished wafers to a buffing station, to a cassette or other processing station.
    • 晶片抛光装置包括模块框架; 相对于框架可旋转的连续带,所述带具有包括抛光垫组件的至少一个垂直定向的带横向部分; 以及在所述框架内的至少一个可枢转的晶片保持头驱动器,并且具有可移动到平行并并列到所述带横向部分的垂直第一位置的远端部分。 头驱动器包括用于将晶片保持在头驱动器的远端部分的晶片载体,同时驱动器将远端部分和保持的晶片移动到邻近带横向部分的垂直抛光位置,并且压力施加到保持的 - 在晶片保持前端部分旋转并且并排扫掠的同时,抵靠抛光垫组件。 在抛光之后,驱动器被反转并且头驱动器从带横向部分转动到水平或其它方向,并且然后抛光晶片。 多个模块可以端对端或并排地放置在其间的机器人通路以加载未抛光的晶片并将抛光的晶片卸载到抛光台,到盒或其它处理站。