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1. 发明申请

US20100132210A1 INSTALLATION FOR DRYING ORGANIC MATTER 有权
标题翻译：干燥有机物的安装
公开(公告)号：US20100132210A1
公开(公告)日：2010-06-03
申请号：US12524291
申请日：2008-01-21
申请人： Gunter Kruger
发明人： Gunter Kruger
IPC分类号： F26B3/347 , F26B13/30 , F26B21/06 , F26B19/00
CPC分类号： F23G5/04 , B01F7/088 , B01F13/06 , B01F15/00785 , C02F11/12 , C10L5/44 , C10L5/46 , F23G2201/80 , F23G2900/50206 , F23K2201/1006 , F23K2201/20 , F26B1/005 , F26B5/048 , F26B11/16 , F26B25/006 , Y02E50/10 , Y02E50/30
摘要： An installation for drying organic matter, especially kitchen and food wastes or other biological matter, including matter that contains packaging residues, napkins, straws or the like. The installation comprises the following components: (a) a vacuum mixer (M) having a closable charging opening for introducing the organic matter and a closable discharge opening, disposed at the bottom or laterally towards the bottom, for the dried matter, (b) at least one vacuum pump (VP) for evacuating the air in the mixer to generate the vacuum, the pump being connected to at least one evacuation tube mounted above the maximum filling level in the housing of the mixer (M), (c) a heater (H) for heating the organic matter, (d) at least one condenser (K), connected to the air evacuation duct (AL) of the vacuum pump (VP) and having a cooling unit (KA) connected thereto to condense the evacuated air, and (e) a discharge duct (AW) for the condensate obtained from the evacuated air by cooling in the condenser (K).
摘要翻译：用于干燥有机物，特别是厨房和食物废物或其他生物物质的装置，包括含有包装残渣，餐巾，吸管等的物质。该装置包括以下部件：（a）具有用于引入有机物的可关闭的充气开口的真空混合器（M）和设置在干燥物质的底部或横向底部的可关闭的排出口，（b）至少一个用于抽空混合器中的空气以产生真空的真空泵（VP），所述泵连接到安装在所述混合器（M）壳体中的最大填充水平以上的至少一个抽真空管，（c）用于加热有机物的加热器（H），（d）连接到真空泵（VP）的排气管（AL）的至少一个冷凝器（K），并具有连接到其上的冷却单元（KA），以冷凝抽空的空气，以及（e）通过在冷凝器（K）中冷却从抽空的空气获得的冷凝物的排放管道（AW）。

2. 发明授权

US4134808A Method of trimming electronic components having an integrated circuit to design specification 失效
标题翻译：具有集成电路的电子部件的修整方法来设计规格
公开(公告)号：US4134808A
公开(公告)日：1979-01-16
申请号：US870470
申请日：1978-01-18
申请人： Gunter Kruger , Klaus Kuttner , Manfred Widmaier , Erich Leinauer
发明人： Gunter Kruger , Klaus Kuttner , Manfred Widmaier , Erich Leinauer
IPC分类号： H01C17/26 , H01L21/70 , H01L27/01 , H05K3/22 , C25F3/02 , C25D21/12 , C25F5/00
CPC分类号： H01L21/707
摘要： A thin film path of medium resistivity provided by a strip of tantalum by which a design parameter of an electronic component is determined is modified by making contact with the path by an electrode having an electrolyte at its tip in passing an anodizing current into the path through the electrode that is much smaller in value than the normal current flowing through the path under design conditions of operation. In consequence, the current injected to produce chemical change in the resistance has a negligible effect on the characteristics of operation of the component and the component can have operating conditions applied to it during the trimming process can be carried while the component is under operating conditions and the parameter to be adjusted is being measured, so that the measurements of the parameter can control the current injected through the electrode so as to shut it off when the desired value of the measured parameter is reached. When the difference between actual and desired values reaches a certain small value, it is advantageous to switch over the current source for the electrode to a lower value of current in order to make possible a closer approach to the design value.
摘要翻译：由电子元件的设计参数确定的由钽带提供的中等电阻率的薄膜路径是通过在其尖端处具有电解质的电极与路径接触而改变的，所述电极通过阳极氧化电流进入通路该电极的值比在设计操作条件下流过路径的正常电流小得多。因此，注入以产生电阻的化学变化的电流对组件的操作特性具有可忽略的影响，并且组件可以在修整过程中施加的操作条件可以在组件处于操作条件下进行，并且正在测量要调节的参数，使得参数的测量可以控制通过电极注入的电流，以便在达到测量参数的期望值时关闭电流。当实际值和期望值之间的差值达到一定的小值时，有利的是将电极的电流源切换到较低的电流值，以便使设计值更接近。

3. 发明授权

US4075416A Electronic thin film circuit unit and method of making the same 失效
标题翻译：电子薄膜电路单元及其制造方法
公开(公告)号：US4075416A
公开(公告)日：1978-02-21
申请号：US652728
申请日：1976-01-27
申请人： Klaus Kuttner , Gunter Kruger , Fedor Modic
发明人： Klaus Kuttner , Gunter Kruger , Fedor Modic
IPC分类号： H01L27/01 , H05K1/16 , H05K1/00
CPC分类号： H01L27/016
摘要： After a valve metal layer on an insulating substrate has been metallized by sputtering on two layers of copper separated by an intermediate layer of iron, nickel or cobalt, and the combined circuit and component pattern has been etched out, followed by selectively etching away the metallization over the resistance components of the circuit, electroless deposited nickel and gold layers are successively applied to the remaining metallization and a solder layer is then applied on top by contact with liquid solder.

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