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1. 发明申请

US20100165048A1 FORMING NOZZLES 有权
标题翻译：成型喷嘴
公开(公告)号：US20100165048A1
公开(公告)日：2010-07-01
申请号：US12346698
申请日：2008-12-30
申请人： Gregory DeBrabander , Mark Nepomnishy
发明人： Gregory DeBrabander , Mark Nepomnishy
IPC分类号： B41J2/16 , H01L21/302
CPC分类号： B41J2/161 , B41J2/162 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1642 , B81B2201/052 , B81C1/00087
摘要： Fluid ejection nozzles having a tapered section leading to a straight walled bore are described. Both the tapered section of the nozzle and the straight walled bore are formed from a single side of semiconductor layer so that the tapered section and the bore are aligned with one another, even when an array of nozzles are formed across a die and multiple dies are formed on a semiconductor substrate.
摘要翻译：描述了具有导向直壁的锥形部分的流体喷射嘴。喷嘴的锥形部分和直壁孔均由半导体层的单侧形成，使得锥形部分和孔彼此对准，即使在模具之间形成喷嘴阵列并且多个模具是形成在半导体衬底上。

2. 发明授权

US08641171B2 Forming nozzles 有权
标题翻译：成型喷嘴
公开(公告)号：US08641171B2
公开(公告)日：2014-02-04
申请号：US13484117
申请日：2012-05-30
申请人： Gregory DeBrabander , Mark Nepomnishy
发明人： Gregory DeBrabander , Mark Nepomnishy
IPC分类号： B41J2/135
CPC分类号： B41J2/161 , B41J2/162 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1642 , B81B2201/052 , B81C1/00087
摘要： Fluid ejection nozzles having a tapered section leading to a straight walled bore are described. Both the tapered section of the nozzle and the straight walled bore are formed from a single side of semiconductor layer so that the tapered section and the bore are aligned with one another, even when an array of nozzles are formed across a die and multiple dies are formed on a semiconductor substrate.
摘要翻译：描述了具有导向直壁的锥形部分的流体喷射嘴。喷嘴的锥形部分和直壁孔均由半导体层的单侧形成，使得锥形部分和孔彼此对准，即使在模具之间形成喷嘴阵列并且多个模具是形成在半导体衬底上。

3. 发明申请

US20120234946A1 FORMING NOZZLES 有权
标题翻译：成型喷嘴
公开(公告)号：US20120234946A1
公开(公告)日：2012-09-20
申请号：US13484117
申请日：2012-05-30
申请人： Gregory DeBrabander , Mark Nepomnishy
发明人： Gregory DeBrabander , Mark Nepomnishy
IPC分类号： B41J2/16 , B05B1/00
CPC分类号： B41J2/161 , B41J2/162 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1642 , B81B2201/052 , B81C1/00087
摘要： Fluid ejection nozzles having a tapered section leading to a straight walled bore are described. Both the tapered section of the nozzle and the straight walled bore are formed from a single side of semiconductor layer so that the tapered section and the bore are aligned with one another, even when an array of nozzles are formed across a die and multiple dies are formed on a semiconductor substrate.
摘要翻译：描述了具有导向直壁的锥形部分的流体喷射嘴。喷嘴的锥形部分和直壁孔均由半导体层的单侧形成，使得锥形部分和孔彼此对准，即使在模具之间形成喷嘴阵列并且多个模具是形成在半导体衬底上。

4. 发明申请

US20100141709A1 Shaping a Nozzle Outlet 审中-公开
标题翻译：塑造一个喷嘴出口
公开(公告)号：US20100141709A1
公开(公告)日：2010-06-10
申请号：US12605829
申请日：2009-10-26
申请人： Gregory DeBrabander , Deane A. Gardner , Thomas G. Duby , Marlene McDonald , William R. Letendre , Christoph Menzel
发明人： Gregory DeBrabander , Deane A. Gardner , Thomas G. Duby , Marlene McDonald , William R. Letendre , Christoph Menzel
IPC分类号： B41J2/16 , B23P17/00
CPC分类号： B41J2/14233 , B41J2/1606 , B41J2/162 , B41J2/1623 , B41J2/1628 , B41J2/1631 , B41J2/1646 , B41J2002/14475 , Y10T29/49401
摘要： A nozzle layer is described that has a semiconductor body having a first surface, a second surface opposing the first surface, and a nozzle formed through the body connecting the first and second surfaces, wherein the nozzle is configured to eject fluid through a nozzle outlet on the second surface, and the outlet having straight sides connected by curved corners.
摘要翻译：描述了具有半导体本体的喷嘴层，其具有第一表面，与第一表面相对的第二表面，以及通过连接第一和第二表面的主体形成的喷嘴，其中喷嘴构造成通过喷嘴出口喷射流体第二表面和具有通过弯曲角连接的直边的出口。

5. 发明申请

US20100079523A1 Control of Velocity Through a Nozzle 有权
标题翻译：通过喷嘴控制速度
公开(公告)号：US20100079523A1
公开(公告)日：2010-04-01
申请号：US12564618
申请日：2009-09-22
申请人： Andreas Bibl , Christoph Menzel , Corina Nistorica , Gregory DeBrabander
发明人： Andreas Bibl , Christoph Menzel , Corina Nistorica , Gregory DeBrabander
IPC分类号： B41J2/045
CPC分类号： B41J2/04581 , B41J2/04506 , B41J2/0456 , B41J2/04578 , B41J2/0458 , B41J2/161 , B41J2/1623 , B41J2/1632 , B41J2/1642
摘要： A method is described wherein one or more parameters are measured that affect the nozzle velocity at which a printing fluid is ejected from a pumping chamber through a nozzle. The printing fluid is contained in the pumping chamber actuated by deflection of a piezoelectric layer. A surface area of an electrode actuating the piezoelectric layer is reduced based at least in part on the measured one or more parameters. Reducing the surface area of the electrode reduces the actuated area of the piezoelectric layer.
摘要翻译：描述了一种方法，其中测量影响从泵送室通过喷嘴喷射印刷流体的喷嘴速度的一个或多个参数。打印流体容纳在通过压电层的偏转致动的泵送室中。至少部分地基于所测量的一个或多个参数来减少致动压电层的电极的表面积。减小电极的表面积减小了压电层的致动面积。

6. 发明申请

US20050175051A1 Detecting pinholes in vertical cavity surface-emitting laser passivation 审中-公开
标题翻译：在垂直腔表面发射激光钝化中检测针孔
公开(公告)号：US20050175051A1
公开(公告)日：2005-08-11
申请号：US11096397
申请日：2005-03-31
申请人： Gregory DeBrabander , Robert Herrick , Suning Xie , Matthew Slater
发明人： Gregory DeBrabander , Robert Herrick , Suning Xie , Matthew Slater
IPC分类号： H01S5/00 , H01S5/183
CPC分类号： H01S5/18338 , H01S5/0042 , H01S5/18311 , H01S2301/176
摘要： A method for detecting a passivation pinhole includes forming an oxide vertical cavity surface-emitting laser (VCSEL) having an oxidation cavity, forming a passivation layer over a surface of the oxidation cavity, exposing the oxide VCSEL to an etchant vapor, and inspecting the oxide VCSEL for a defect caused by the etchant vapor.
摘要翻译：一种用于检测钝化针孔的方法包括形成具有氧化腔的氧化物垂直腔表面发射激光器（VCSEL），在氧化腔的表面上形成钝化层，将氧化物VCSEL暴露于蚀刻剂蒸气，并检查氧化物 VCSEL用于由蚀刻剂蒸气引起的缺陷。

7. 发明授权

US08727475B2 Control of velocity through a nozzle 有权
标题翻译：通过喷嘴控制速度
公开(公告)号：US08727475B2
公开(公告)日：2014-05-20
申请号：US12564618
申请日：2009-09-22
申请人： Andreas Bibl , Christoph Menzel , Corina Nistorica , Gregory DeBrabander
发明人： Andreas Bibl , Christoph Menzel , Corina Nistorica , Gregory DeBrabander
IPC分类号： B41J29/393
CPC分类号： B41J2/04581 , B41J2/04506 , B41J2/0456 , B41J2/04578 , B41J2/0458 , B41J2/161 , B41J2/1623 , B41J2/1632 , B41J2/1642
摘要： A method is described wherein one or more parameters are measured that affect the nozzle velocity at which a printing fluid is ejected from a pumping chamber through a nozzle. The printing fluid is contained in the pumping chamber actuated by deflection of a piezoelectric layer. A surface area of an electrode actuating the piezoelectric layer is reduced based at least in part on the measured one or more parameters. Reducing the surface area of the electrode reduces the actuated area of the piezoelectric layer.
摘要翻译：描述了一种方法，其中测量影响从泵送室通过喷嘴喷射印刷流体的喷嘴速度的一个或多个参数。打印流体容纳在通过压电层的偏转致动的泵送室中。至少部分地基于测量的一个或多个参数来减少致动压电层的电极的表面积。减小电极的表面积减小了压电层的致动面积。

8. 发明授权

US08853915B2 Bonding on silicon substrate having a groove 有权
标题翻译：在具有凹槽的硅衬底上键合
公开(公告)号：US08853915B2
公开(公告)日：2014-10-07
申请号：US12562618
申请日：2009-09-18
申请人： Christoph Menzel , Gregory DeBrabander , Corina Nistorica
发明人： Christoph Menzel , Gregory DeBrabander , Corina Nistorica
IPC分类号： H01L41/053 , H01L41/22 , B41J2/045 , H01L41/313 , H01L41/09
CPC分类号： H01L41/0973 , H01L41/313 , Y10T29/42 , Y10T156/10
摘要： A method and apparatus for bonding on a silicon substrate are disclosed. An apparatus includes a membrane having a membrane surface, a groove in the membrane surface, a transducer having a transducer surface substantially parallel to the membrane surface, and an adhesive connecting the membrane surface to the transducer surface. The groove can be configured to permit flow of adhesive into and through the groove while minimizing voids or air gaps that could result from incomplete filling of the groove. Multiple grooves can be formed in the membrane surface and can be of uniform depth.
摘要翻译：公开了一种用于在硅衬底上接合的方法和装置。一种装置包括具有膜表面的膜，膜表面中的槽，具有基本上平行于膜表面的换能器表面的换能器以及将膜表面连接到换能器表面的粘合剂。凹槽可以被配置为允许粘合剂流入并穿过凹槽，同时最小化由于凹槽不完全填充可能导致的空隙或气隙。可以在膜表面形成多个凹槽并且可以具有均匀的深度。

9. 发明申请

US20110109694A1 Thermal Oxide Coating On A Fluid Ejector 有权
标题翻译：流体喷射器上的热氧化物涂层
公开(公告)号：US20110109694A1
公开(公告)日：2011-05-12
申请号：US12614356
申请日：2009-11-06
申请人： Zhenfang Chen , Gregory DeBrabander
发明人： Zhenfang Chen , Gregory DeBrabander
IPC分类号： B41J2/16 , B32B7/00
CPC分类号： B41J2/14233 , B41J2/1606 , B41J2/161 , B41J2/1623 , B41J2/1626 , B41J2/1642
摘要： A fluid ejection module includes a flow-path body, a first oxide layer, a membrane, and a second oxide layer. The flow-path body has a first outer surface and an opposing second outer surface and a plurality of flow paths, each flow path extending at least from the first outer surface to the second outer surface. The first oxide layer coats at least an interior surface of each of the flow paths and the first and second outer surfaces of the flow-path body and has a thickness that varies by less than 5% along {100} planes. The membrane has a first outer surface. The second oxide layer is coated on the first outer surface of the membrane and has a thickness that varies by less than 5% along {100} planes and is bonded to the first oxide layer.
摘要翻译：流体喷射模块包括流路主体，第一氧化物层，膜和第二氧化物层。流路主体具有第一外表面和相对的第二外表面和多个流动通道，每个流动通道至少从第一外表面延伸到第二外表面。第一氧化物层涂覆至少每个流路的内表面和流动通道体的第一和第二外表面，并且具有沿{100}平面变化小于5％的厚度。膜具有第一外表面。第二氧化物层被涂覆在膜的第一外表面上，并且具有沿{100}面变化小于5％的厚度并且结合到第一氧化物层。

10. 发明申请

US20100066206A1 Bonding On Silicon Substrate Having A Groove 有权
标题翻译：具有凹槽的硅衬底上的键合
公开(公告)号：US20100066206A1
公开(公告)日：2010-03-18
申请号：US12562618
申请日：2009-09-18
申请人： Christoph Menzel , Gregory DeBrabander , Corina Nistorica
发明人： Christoph Menzel , Gregory DeBrabander , Corina Nistorica
IPC分类号： H01L41/053 , B32B37/12 , H01L41/22
CPC分类号： H01L41/0973 , H01L41/313 , Y10T29/42 , Y10T156/10
摘要： A method and apparatus for bonding on a silicon substrate are disclosed. An apparatus includes a membrane having a membrane surface, a groove in the membrane surface, a transducer having a transducer surface substantially parallel to the membrane surface, and an adhesive connecting the membrane surface to the transducer surface. The groove can be configured to permit flow of adhesive into and through the groove while minimizing voids or air gaps that could result from incomplete filling of the groove. Multiple grooves can be formed in the membrane surface and can be of uniform depth.
摘要翻译：公开了一种用于在硅衬底上接合的方法和装置。一种装置包括具有膜表面的膜，膜表面中的槽，具有基本上平行于膜表面的换能器表面的换能器以及将膜表面连接到换能器表面的粘合剂。凹槽可以被配置为允许粘合剂流入并穿过凹槽，同时最小化由于凹槽不完全填充可能导致的空隙或气隙。可以在膜表面形成多个凹槽并且可以具有均匀的深度。

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