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    • 1. 发明申请
    • Method to increase charge retention of non-volatile memory manufactured in a single-gate logic process
    • 增加在单门逻辑过程中制造的非易失性存储器的电荷保留的方法
    • US20070170489A1
    • 2007-07-26
    • US11341881
    • 2006-01-26
    • Gang-feng FangDennis SinitskyWingyu Leung
    • Gang-feng FangDennis SinitskyWingyu Leung
    • H01L29/76
    • H01L29/7883H01L27/115H01L27/11521H01L29/40114H01L29/42324
    • A non-volatile memory cell with increased charge retention is fabricated on the same substrate as logic devices using a single-gate conventional logic process. A silicide-blocking dielectric structure is formed over a floating gate of the NVM cell, thereby preventing silicide formation over the floating gate, while allowing silicide formation over the logic devices. Silicide spiking and bridging are prevented in the NVM cell, as silicide-blocking dielectric structure prevents silicide metal from coming in contact with the floating gate or adjacent sidewall spacers. The silicide-blocking dielectric layer may expose portions of the active regions of the NVM cell, away from the floating gate and adjacent sidewall spacers, thereby enabling silicide formation on these portions. Alternately, the silicide-blocking dielectric layer may cover the active regions of the NVM cell during silicide formation. In this case, silicide-blocking dielectric layer may be thinned or removed after silicide formation.
    • 具有增加的电荷保持的非易失性存储单元使用单栅极常规逻辑工艺在与逻辑器件相同的衬底上制造。 在NVM单元的浮动栅极上形成硅化物阻挡介质结构,从而防止在浮栅上形成硅化物,同时允许在逻辑器件上形成硅化物。 在NVM电池中防止硅化物尖峰和桥接,因为硅化物阻挡电介质结构防止硅化物金属与浮动栅极或相邻的侧壁间隔物接触。 硅化物阻挡电介质层可以暴露NVM电池的有源区的部分,远离浮动栅极和相邻的侧壁间隔物,从而使得这些部分上形成硅化物。 或者,硅化物阻挡电介质层可以在硅化物形成期间覆盖NVM电池的有源区。 在这种情况下,硅化物阻挡介电层可以在形成硅化物之后变薄或去除。
    • 2. 发明授权
    • Method to increase charge retention of non-volatile memory manufactured in a single-gate logic process
    • 增加在单门逻辑过程中制造的非易失性存储器的电荷保留的方法
    • US07919367B2
    • 2011-04-05
    • US12021229
    • 2008-01-28
    • Gang-feng FangDennis SinitskyWingyu Leung
    • Gang-feng FangDennis SinitskyWingyu Leung
    • H01L21/8238
    • H01L29/7883H01L21/28273H01L27/115H01L27/11521H01L29/42324
    • A non-volatile memory cell with increased charge retention is fabricated on the same substrate as logic devices using a single-gate conventional logic process. A silicide-blocking dielectric structure is formed over a floating gate of the NVM cell, thereby preventing silicide formation over the floating gate, while allowing silicide formation over the logic devices. Silicide spiking and bridging are prevented in the NVM cell, as silicide-blocking dielectric structure prevents silicide metal from coming in contact with the floating gate or adjacent sidewall spacers. The silicide-blocking dielectric layer may expose portions of the active regions of the NVM cell, away from the floating gate and adjacent sidewall spacers, thereby enabling silicide formation on these portions. Alternately, the silicide-blocking dielectric layer may cover the active regions of the NVM cell during silicide formation. In this case, silicide-blocking dielectric layer may be thinned or removed after silicide formation.
    • 具有增加的电荷保持的非易失性存储单元使用单栅极常规逻辑工艺在与逻辑器件相同的衬底上制造。 在NVM单元的浮动栅极上形成硅化物阻挡介质结构,从而防止在浮栅上形成硅化物,同时允许在逻辑器件上形成硅化物。 在NVM电池中防止硅化物尖峰和桥接,因为硅化物阻挡电介质结构防止硅化物金属与浮动栅极或相邻的侧壁间隔物接触。 硅化物阻挡电介质层可以暴露NVM电池的有源区的部分,远离浮动栅极和相邻的侧壁间隔物,从而使得这些部分上形成硅化物。 或者,硅化物阻挡电介质层可以在硅化物形成期间覆盖NVM电池的有源区。 在这种情况下,硅化物阻挡介质层可以在形成硅化物之后变薄或去除。
    • 4. 发明申请
    • Method To Increase Charge Retention Of Non-Volatile Memory Manufactured In A Single-Gate Logic Process
    • 在单门逻辑过程中制造的非易失性存储器的电荷保留方法
    • US20080138950A1
    • 2008-06-12
    • US12021229
    • 2008-01-28
    • Gang-feng FangDennis SinitskyWingyu Leung
    • Gang-feng FangDennis SinitskyWingyu Leung
    • H01L21/336
    • H01L29/7883H01L21/28273H01L27/115H01L27/11521H01L29/42324
    • A non-volatile memory cell with increased charge retention is fabricated on the same substrate as logic devices using a single-gate conventional logic process. A silicide-blocking dielectric structure is formed over a floating gate of the NVM cell, thereby preventing silicide formation over the floating gate, while allowing silicide formation over the logic devices. Silicide spiking and bridging are prevented in the NVM cell, as silicide-blocking dielectric structure prevents silicide metal from coming in contact with the floating gate or adjacent sidewall spacers. The silicide-blocking dielectric layer may expose portions of the active regions of the NVM cell, away from the floating gate and adjacent sidewall spacers, thereby enabling silicide formation on these portions. Alternately, the silicide-blocking dielectric layer may cover the active regions of the NVM cell during silicide formation. In this case, silicide-blocking dielectric layer may be thinned or removed after silicide formation.
    • 具有增加的电荷保持的非易失性存储单元使用单栅极常规逻辑工艺在与逻辑器件相同的衬底上制造。 在NVM单元的浮动栅极上形成硅化物阻挡介质结构,从而防止在浮栅上形成硅化物,同时允许在逻辑器件上形成硅化物。 在NVM电池中防止硅化物尖峰和桥接,因为硅化物阻挡电介质结构防止硅化物金属与浮动栅极或相邻的侧壁间隔物接触。 硅化物阻挡电介质层可以暴露NVM电池的有源区的部分,远离浮动栅极和相邻的侧壁间隔物,从而使得这些部分上形成硅化物。 或者,硅化物阻挡电介质层可以在硅化物形成期间覆盖NVM电池的有源区。 在这种情况下,硅化物阻挡介电层可以在形成硅化物之后变薄或去除。
    • 7. 发明授权
    • Non-volatile memory in CMOS logic process and method of operation thereof
    • CMOS逻辑过程中的非易失性存储器及其操作方法
    • US07391647B2
    • 2008-06-24
    • US11279382
    • 2006-04-11
    • Gang-feng FangDennis SinitskyWingyu Leung
    • Gang-feng FangDennis SinitskyWingyu Leung
    • G11C16/04
    • G11C16/0408G11C16/0416G11C16/10G11C2216/10H01L27/11519H01L27/11521H01L27/11558H01L29/42324H01L29/7883
    • A non-volatile memory (NVM) cell fabricated on a semiconductor substrate, and including a floating gate electrode (which extends at least partially over all active regions of the NVM cell). The NVM cell also includes a PMOS access transistor located in a first n-type region, a PMOS control capacitor located in a second n-type region (separate from the first n-type region), and an NMOS programming transistor located in a p-type region. The floating gate electrode is a continuous electrode which extends over the active regions of the PMOS access transistor, the PMOS control capacitor and the NMOS programming transistor. Various array connections are provided for implementing arrays using this NVM cell. The PMOS access transistor and NMOS programming transistor can be replaced with an NMOS access transistor and a PMOS erase transistor, respectively, in an alternate embodiment.
    • 制造在半导体衬底上的非易失性存储器(NVM)单元,并且包括浮置栅极电极(至少部分地延伸到NVM单元的所有有源区域上)。 NVM单元还包括位于第一n型区域中的PMOS访问晶体管,位于第二n型区域(与第一n型区域分离)的PMOS控制电容器,以及位于p型区域中的NMOS编程晶体管 型区域。 浮置栅电极是在PMOS存取晶体管,PMOS控制电容器和NMOS编程晶体管的有源区域上延伸的连续电极。 提供了各种阵列连接来实现使用该NVM单元的阵列。 在替代实施例中,PMOS存取晶体管和NMOS编程晶体管可以分别被NMOS存取晶体管和PMOS擦除晶体管代替。
    • 10. 发明授权
    • N-channel SONOS non-volatile memory for embedded in logic
    • 用于嵌入逻辑的N沟道SONOS非易失性存储器
    • US08228726B2
    • 2012-07-24
    • US12906153
    • 2010-10-18
    • Gang-Feng FangWingyu Leung
    • Gang-Feng FangWingyu Leung
    • G11C16/04H01L29/788H01L21/336
    • H01L27/11565G11C16/0466G11C16/28H01L27/11568H01L27/11573
    • A system and method of an electrically programmable and erasable non-volatile memory cell fabricated using a single-poly, logic process with the addition of ONO deposition and etching is disclosed. In one embodiment, a non-volatile memory system includes at least one non-volatile memory cell consists of a SONOS transistor fabricated on a P substrate, with a deep N-well located in the P substrate, with a P-well located in the deep N-well. The memory cell further includes an access NMOS transistor, coupled to the SONOS transistor and located in the same P-well that includes an oxide only gate-dielectric. The cell can be fabricated in a modified logic process with other transistors and with their physical characteristics preserved.
    • 公开了一种通过添加ONO沉积和蚀刻的单一多逻辑工艺制造的电可编程和可擦除非易失性存储单元的系统和方法。 在一个实施例中,非易失性存储器系统包括至少一个非易失性存储器单元,其由在P衬底上制造的SONOS晶体管构成,其中深N阱位于P衬底中,P阱位于 深N井 存储单元还包括一个访问NMOS晶体管,其耦合到SONOS晶体管并且位于包括仅氧化物栅电介质的相同P阱中。 电池可以用其他晶体管的修改逻辑工艺制造,并保留其物理特性。