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    • 1. 发明授权
    • Protection device and related fabrication methods
    • 保护装置及相关制造方法
    • US09019667B2
    • 2015-04-28
    • US13671623
    • 2012-11-08
    • Freescale Semiconductor Inc.
    • Chai Ean GillChangsoo HongRouying ZhanWilliam G. Cowden
    • H01L21/8222H02H9/04
    • H02H9/044H01L21/8222H01L27/0259H01L27/0664
    • Protection device structures and related fabrication methods are provided. An exemplary protection device includes a first bipolar junction transistor, a second bipolar junction transistor, a first zener diode, and a second zener diode. The collectors of the first bipolar junction transistors are electrically coupled. A cathode of the first zener diode is coupled to the collector of the first bipolar transistor and an anode of the first zener diode is coupled to the base of the first bipolar transistor. A cathode of the second zener diode is coupled to the collector of the second bipolar transistor and an anode of the second zener diode is coupled to the base of the second bipolar transistor. In exemplary embodiments, the base and emitter of the first bipolar transistor are coupled at a first interface and the base and emitter of the second bipolar transistor are coupled at a second interface.
    • 提供了保护装置结构和相关制造方法。 示例性保护装置包括第一双极结型晶体管,第二双极结型晶体管,第一齐纳二极管和第二齐纳二极管。 第一双极结晶体管的集电极电耦合。 第一齐纳二极管的阴极耦合到第一双极晶体管的集电极,第一齐纳二极管的阳极耦合到第一双极晶体管的基极。 第二齐纳二极管的阴极耦合到第二双极晶体管的集电极,并且第二齐纳二极管的阳极耦合到第二双极晶体管的基极。 在示例性实施例中,第一双极晶体管的基极和发射极在第一接口处耦合,并且第二双极晶体管的基极和发射极在第二接口处耦合。
    • 3. 发明申请
    • Protection Device And Related Fabrication Methods
    • 保护装置及相关制作方法
    • US20140126091A1
    • 2014-05-08
    • US13671623
    • 2012-11-08
    • FREESCALE SEMICONDUCTOR, INC.
    • Chai Ean GillChangsoo HongRouying ZhanWilliam G. Cowden
    • H02H9/04H01L21/8222
    • H02H9/044H01L21/8222H01L27/0259H01L27/0664
    • Protection device structures and related fabrication methods are provided. An exemplary protection device includes a first bipolar junction transistor, a second bipolar junction transistor, a first zener diode, and a second zener diode. The collectors of the first bipolar junction transistors are electrically coupled. A cathode of the first zener diode is coupled to the collector of the first bipolar transistor and an anode of the first zener diode is coupled to the base of the first bipolar transistor. A cathode of the second zener diode is coupled to the collector of the second bipolar transistor and an anode of the second zener diode is coupled to the base of the second bipolar transistor. In exemplary embodiments, the base and emitter of the first bipolar transistor are coupled at a first interface and the base and emitter of the second bipolar transistor are coupled at a second interface.
    • 提供了保护装置结构和相关制造方法。 示例性保护装置包括第一双极结型晶体管,第二双极结型晶体管,第一齐纳二极管和第二齐纳二极管。 第一双极结晶体管的集电极电耦合。 第一齐纳二极管的阴极耦合到第一双极晶体管的集电极,第一齐纳二极管的阳极耦合到第一双极晶体管的基极。 第二齐纳二极管的阴极耦合到第二双极晶体管的集电极,并且第二齐纳二极管的阳极耦合到第二双极晶体管的基极。 在示例性实施例中,第一双极晶体管的基极和发射极在第一接口处耦合,并且第二双极晶体管的基极和发射极在第二接口处耦合。
    • 5. 发明授权
    • Methods for forming electrostatic discharge protection clamps with increased current capabilities
    • 用于形成具有增加的电流能力的静电放电保护夹的方法
    • US09018071B2
    • 2015-04-28
    • US14168807
    • 2014-01-30
    • Freescale Semiconductor Inc.
    • Rouying ZhanAmaury GendronChai Ean Gill
    • H01L21/8222H01L23/62H01L21/8228H01L27/02H01L29/66
    • H01L21/8228H01L27/0259H01L29/66234
    • Methods for forming an electrostatic discharge protection (ESD) clamps are provided. In one embodiment, the method includes forming at least one transistor having a first well region of a first conductivity type extending into a substrate. At least one transistor is formed having another well region of a second opposite conductivity type, which extends into the substrate to partially form a collector. The lateral edges of the transistor well regions are separated by a distance D, which at least partially determines a threshold voltage Vt1 of the ESD clamp. A base contact of the first conductivity type is formed in the first well region and separated from an emitter of the second conductivity type by a lateral distance Lbe. The first doping density and the lateral distance Lbe are selected to provide a parasitic base-emitter resistance Rbe in the range of 1
    • 提供了形成静电放电保护(ESD)夹具的方法。 在一个实施例中,该方法包括形成至少一个具有延伸到衬底中的第一导电类型的第一阱区的晶体管。 至少一个晶体管形成有具有第二相反导电类型的另一阱区,其延伸到衬底中以部分地形成集电极。 晶体管阱区的横向边缘被隔开距离D,距离D至少部分地确定ESD钳位的阈值电压Vt1。 第一导电类型的基极接触形成在第一阱区中,并且与第二导电类型的发射极分开横向距离Lbe。 选择第一掺杂浓度和横向距离Lbe以在1