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    • 1. 发明授权
    • Transient voltage suppression device
    • 瞬态电压抑制装置
    • US07510903B1
    • 2009-03-31
    • US12042826
    • 2008-03-05
    • Fred MattesonVenkatesh P. PaiDonald K. Cartmell
    • Fred MattesonVenkatesh P. PaiDonald K. Cartmell
    • H01L21/00H01L21/20
    • H01L27/0814H01L27/0817H01L29/861H01L29/866
    • A bi-directional transient voltage suppression (“TVS”) device (101) includes a semiconductor die (201) that has a first avalanche diode (103) in series with a first rectifier diode (104) connected cathode to cathode, electrically coupled in an anti-parallel configuration with a second avalanche diode (105) in series with a second rectifier diode (106) also connected cathode to cathode. All the diodes of the TVS device are on a single semiconductor substrate (301). The die has a low resistivity buried diffused layer (303) having a first conductivity type disposed between a semiconductor substrate (301) having the opposite conductivity type and a high resistivity epitaxial layer (305) having the first conductivity type. The buried diffused layer shunts most of a transient current away from a portion of the epitaxial layer between the first avalanche diode and the first rectifier diode, thereby reducing the clamping voltage relative to the breakdown voltage. The TVS device is packaged as a flip chip (202) that has four solder bump pads (211-214). The abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims pursuant to 37 C.F.R. §1.72(b).
    • 双向瞬态电压抑制(“TVS”)器件(101)包括半导体管芯(201),其具有与阴极 - 阴极连接的第一整流二极管(104)串联的第一雪崩二极管(103) 具有与第二整流二极管(106)串联的第二雪崩二极管(105)的反并联配置也连接阴极至阴极。 TVS器件的所有二极管都在单个半导体衬底(301)上。 芯片具有设置在具有相反导电类型的半导体衬底(301)和具有第一导电类型的高电阻率外延层(305)之间的具有第一导电类型的低电阻率掩埋扩散层(303)。 掩埋扩散层将大部分瞬态电流从第一雪崩二极管和第一整流二极管之间的外延层的一部分分流,从而相对于击穿电压降低钳位电压。 TVS装置被封装成具有四个焊料凸块(211-214)的倒装芯片(202)。 提交摘要的理解是,根据37 C.F.R.不会将其用于解释或限制索赔的范围或含义。 §1.72(b)。