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    • 4. 发明授权
    • Oxygen-doped Al-containing current blocking layers in active semiconductor devices in photonic integrated circuits (PICs)
    • 在光子集成电路(PIC)中的有源半导体器件中的氧掺杂的含Al电流阻挡层
    • US07208770B2
    • 2007-04-24
    • US11059207
    • 2005-02-16
    • Fred A. Kish, Jr.Sheila HurttCharles H. JoynerRichard P. Schneider
    • Fred A. Kish, Jr.Sheila HurttCharles H. JoynerRichard P. Schneider
    • H01L33/00H01L29/22
    • B82Y20/00H01L31/03046H01L31/109H01L33/145H01S5/026H01S5/2072H01S5/221H01S5/2224H01S5/2226H01S5/2227H01S5/2231H01S5/227H01S5/2275H01S5/3072H01S5/34306Y02E10/544
    • In photonic integrated circuits (PICs) having at least one active semiconductor device, such as, a buried heterostructure semiconductor laser, LED, modulator, photodiode, heterojunction bipolar transistor, field effect transistor or other active device, a plurality of semiconductor layers are formed on a substrate with one of the layers being an active region. A current channel is formed through this active region defined by current blocking layers formed on adjacent sides of a designated active region channel where the blocking layers substantially confine the current through the channel. The blocking layers are characterized by being an aluminum-containing Group III-V compound, i.e., an Al-III-V layer, intentionally doped with oxygen from an oxide source. Also, wet oxide process or a deposited oxide source may be used to laterally form a native oxide of the Al-III-V layer. An example of a material system for this invention useful at optical telecommunication wavelengths is InGaAsP/InP where the Al-III-V layer comprises InAlAs:O or InAlAs:O:Fe. Other materials for the blocking layers may be InAlGaAs or alternating layers or alternating monolayers of AlAs/InAs. Thus, the O-doped blocking layers may be undoped, impurity doped or co-doped with Fe.
    • 在具有至少一个有源半导体器件(例如掩埋异质结构半导体激光器,LED,调制器,光电二极管,异质结双极晶体管,场效应晶体管或其它有源器件)的光子集成电路(PIC)中,多个半导体层 其中一层是活性区的基底。 通过由形成在指定的有源区通道的相邻侧上的电流阻挡层限定的有源区形成电流通道,其中阻挡层基本上限制电流通过通道。 阻挡层的特征在于含有铝的III-V族化合物,即有意从氧化物源掺杂氧的Al-III-V层。 此外,湿氧化物工艺或沉积的氧化物源可用于横向形成Al-III-V层的天然氧化物。 在光通信波长下用于本发明的材料系统的一个例子是InGaAsP / InP,其中Al-III-V层包括InAlAs:O或InAlAs:O:Fe。 用于阻挡层的其它材料可以是AlAlGaAs或AlAs / InAs的交替层或交替单层。 因此,O掺杂阻挡层可以是未掺杂的,杂质掺杂的或与Fe共掺杂的。
    • 5. 发明授权
    • Oxygen-doped Al-containing current blocking layers in active semiconductor devices in photonic integrated circuits (PICs)
    • 在光子集成电路(PIC)中的有源半导体器件中的氧掺杂的含Al电流阻挡层
    • US07122846B2
    • 2006-10-17
    • US11059201
    • 2005-02-16
    • Fred A. Kish, Jr.Sheila HurttCharles H. JoynerRichard P. Schneider
    • Fred A. Kish, Jr.Sheila HurttCharles H. JoynerRichard P. Schneider
    • H01L29/221H01L29/22
    • B82Y20/00H01L31/03046H01L31/109H01L33/145H01S5/026H01S5/2072H01S5/221H01S5/2224H01S5/2226H01S5/2227H01S5/2231H01S5/227H01S5/2275H01S5/3072H01S5/34306Y02E10/544
    • In photonic integrated circuits (PICs) having at least one active semiconductor device, such as, a buried heterostructure semiconductor laser, LED, modulator, photodiode, heterojunction bipolar transistor, field effect transistor or other active device, a plurality of semiconductor layers are formed on a substrate with one of the layers being an active region. A current channel is formed through this active region defined by current blocking layers formed on adjacent sides of a designated active region channel where the blocking layers substantially confine the current through the channel. The blocking layers are characterized by being an aluminum-containing Group III-V compound, i.e., an Al-III-V layer, intentionally doped with oxygen from an oxide source. Also, wet oxide process or a deposited oxide source may be used to laterally form a native oxide of the Al-III-V layer. An example of a material system for this invention useful at optical telecommunication wavelengths is InGaAsP/InP where the Al-III-V layer comprises InAlAs:O or InAlAs:O:Fe. Other materials for the blocking layers may be InAlGaAs or alternating layers or alternating monolayers of AlAs/InAs. Thus, the O-doped blocking layers may be undoped, impurity doped or co-doped with Fe.
    • 在具有至少一个有源半导体器件(例如掩埋异质结构半导体激光器,LED,调制器,光电二极管,异质结双极晶体管,场效应晶体管或其它有源器件)的光子集成电路(PIC)中,多个半导体层 其中一层是活性区的基底。 通过由形成在指定的有源区通道的相邻侧上的电流阻挡层限定的有源区形成电流通道,其中阻挡层基本上限制电流通过通道。 阻挡层的特征在于含有铝的III-V族化合物,即有意从氧化物源掺杂氧的Al-III-V层。 此外,湿氧化物工艺或沉积的氧化物源可用于横向形成Al-III-V层的天然氧化物。 在光通信波长下用于本发明的材料系统的一个例子是InGaAsP / InP,其中Al-III-V层包括InAlAs:O或InAlAs:O:Fe。 用于阻挡层的其它材料可以是AlAlGaAs或AlAs / InAs的交替层或交替单层。 因此,O掺杂阻挡层可以是未掺杂的,杂质掺杂的或与Fe共掺杂的。