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    • 3. 发明申请
    • ELECTRONIC DEVICE HOUSING AND MANUFACTURING METHOD THEREOF
    • 电子设备外壳及其制造方法
    • US20120147532A1
    • 2012-06-14
    • US12979473
    • 2010-12-28
    • JING-HUA YUANZI-MING TANGFA-GUANG SHICONG-CONG WANG
    • JING-HUA YUANZI-MING TANGFA-GUANG SHICONG-CONG WANG
    • H05K7/00H05K13/00
    • G06F1/1626Y10T29/49002
    • An electronic device housing includes a bottom housing, a support frame, a display panel, and a side frame. The bottom housing includes a base plate and four sidewalls extending from a periphery of the base plate. The support frame is welded to the sidewalls of the bottom housing. The support frame is received in the bottom housing and made up of at least two support plates, two ends of each are welded to ends of the adjacent support plates. The support frame forms at least two welding lines at joints of the at least two support plates, and each welding line corresponds to a middle portion of one sidewall. The display panel is positioned on the support frame sandwiched between the support frame and the side frame. The side frame is connected to a top edge of the bottom housing.
    • 电子设备壳体包括底部壳体,支撑框架,显示面板和侧框架。 底部壳体包括基板和从基板的周边延伸的四个侧壁。 支撑框架焊接到底部壳体的侧壁。 支撑框架被容纳在底部壳体中并且由至少两个支撑板构成,每个的两个端部焊接到相邻支撑板的端部。 支撑框架在至少两个支撑板的接头处形成至少两条焊接线,并且每个焊接线对应于一个侧壁的中间部分。 显示面板位于夹在支撑框架和侧框架之间的支撑框架上。 侧框架连接到底部外壳的顶部边缘。
    • 4. 发明申请
    • ELECTRONIC DEVICE WITH CLIP CARD INSTALLATION ASSEMBLY
    • 具有夹子卡安装组件的电子设备
    • US20120134127A1
    • 2012-05-31
    • US13178663
    • 2011-07-08
    • YAN LIANGBIN DAIJING-HUA YUANFA-GUANG SHIZI-MING TANG
    • YAN LIANGBIN DAIJING-HUA YUANFA-GUANG SHIZI-MING TANG
    • H05K7/00
    • H05K5/0247
    • An electronic device includes a housing and an installation assembly. The housing defines an opening. The installation assembly includes a fixing member and a holding member. The fixing member includes a base and a fixing portion protruding from the base. The base defines an entrance corresponding to the opening. The holding member comprising a holding portion and an engaging portion formed on an end of the holding portion. The fixing portion runs through the opening, and the base abuts against an outer surface of the housing with the entrance corresponding to the first opening. The engaging portion is engaged with the fixing portion to fix the holding member to the fixing member in the housing, and the engaging portion abuts against an inner surface of the housing, such that the installation assembly is fixed the housing surrounding the first opening.
    • 电子设备包括壳体和安装组件。 壳体限定开口。 安装组件包括固定构件和保持构件。 固定构件包括基部和从基部突出的固定部。 底座限定了与开口对应的入口。 保持构件包括保持部和形成在保持部的端部上的接合部。 固定部分穿过开口,并且基座与对应于第一开口的入口抵靠外壳的外表面。 接合部与固定部接合,将保持部件固定在壳体内的固定部件上,并且卡合部抵靠壳体的内表面,使得安装组件固定围绕第一开口的壳体。
    • 6. 发明申请
    • ELECTRONIC DEVICE HOUSING ASSEMBLY AND MANUFACTURING METHOD THEREOF
    • 电子设备外壳组件及其制造方法
    • US20120127040A1
    • 2012-05-24
    • US13163871
    • 2011-06-20
    • ZI-MING TANGFA-GUANG SHI
    • ZI-MING TANGFA-GUANG SHI
    • H01Q1/24H01P11/00
    • H01Q1/243H01Q1/405H01Q9/04Y10T29/49016
    • A housing assembly includes an outer housing, a support member, an antenna cover, a foam member, and an adhesive member. The outer housing defines an antenna opening. The support member is positioned in the outer housing, and encloses the antenna opening. The support member defines a receiving portion for receiving an antenna module, and the receiving portion is aligned with the antenna opening. The antenna cover is positioned in the antenna opening. Both of the foam member and the adhesive member are positioned between the support member and the antenna cover, and the foam member surrounds the adhesive member. The adhesive member connects or fixes the antenna cover to the support member. A method of manufacturing the housing assembly is also provided.
    • 壳体组件包括外壳,支撑构件,天线罩,泡沫构件和粘合构件。 外壳限定天线开口。 支撑构件定位在外壳中,并且包围天线开口。 支撑构件限定用于接收天线模块的接收部分,并且接收部分与天线开口对准。 天线盖位于天线开口中。 泡沫构件和粘合构件都位于支撑构件和天线盖之间,并且泡沫构件围绕着粘合构件。 粘合构件将天线盖连接或固定到支撑构件。 还提供了制造壳体组件的方法。
    • 7. 发明申请
    • BONDING STRUCTURE AND ELECTRONIC DEVICE USING THE SAME
    • 使用相同的结合结构和电子设备
    • US20130107432A1
    • 2013-05-02
    • US13632275
    • 2012-10-01
    • JU-PING DUANMING-FU LUOFA-GUANG SHI
    • JU-PING DUANMING-FU LUOFA-GUANG SHI
    • H05K7/00B32B1/04
    • G06F1/1626Y10T428/13
    • A bonding structure includes a first connecting part, a second connecting part and an adhesive. The first connecting part includes a top surface and a first joining surface opposite to the top surface. The second connecting part includes a mounting surface and defines a bonding groove on the mounting surface, the second connecting part further includes positioning members in the bonding groove. The adhesive is received in the bonding groove of the second connecting part, then the first connecting part is received in the bonding groove. The first joining surface is supported by the positioning members to position the first connecting part, the adhesive is located between the first joining surface and a bottom of the bonding groove to join the first and the second connecting part together. The present disclosure further discloses an electronic device using the bonding structure.
    • 接合结构包括第一连接部分,第二连接部分和粘合剂。 第一连接部分包括顶表面和与顶表面相对的第一接合表面。 第二连接部分包括安装表面并且在安装表面上限定了接合槽,第二连接部分还包括接合槽中的定位构件。 粘合剂被接收在第二连接部的接合槽中,然后第一连接部被容纳在接合槽中。 第一接合面被定位构件支撑以定位第一连接部分,粘合剂位于接合槽的第一接合表面和底部之间,以将第一和第二连接部分接合在一起。 本公开进一步公开了一种使用该接合结构的电子设备。