专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07510972B2 Method of processing substrate, post-chemical mechanical polishing cleaning method, and method of and program for manufacturing electronic device 有权
标题翻译：基板处理方法，后化学机械抛光清洗方法，以及制造电子器件的方法和程序
公开(公告)号：US07510972B2
公开(公告)日：2009-03-31
申请号：US11353154
申请日：2006-02-14
申请人： Eiichi Nishimura , Kenya Iwasaki
发明人： Eiichi Nishimura , Kenya Iwasaki
IPC分类号： H01L21/302 , G06F17/50
CPC分类号： H01L21/31056 , H01L21/02063 , H01L21/02074 , H01L21/31116
摘要： A method of processing a substrate which enables a surface damaged layer and polishing remnants on the surface of an insulating film to be removed, and enable the amount removed of the surface damaged layer and polishing remnants to be controlled easily. An insulating film on a substrate, which has been revealed by chemical mechanical polishing, is exposed to an atmosphere of a mixed gas containing ammonia and hydrogen fluoride under a predetermined pressure. The insulating film which has been exposed to the atmosphere of the mixed gas is heated to a predetermined temperature.
摘要翻译：能够除去能够除去绝缘膜表面的表面损伤层和研磨残留物的基板的处理方法，能够容易地控制表面损伤层和研磨残留物的去除量。通过化学机械抛光显示的基板上的绝缘膜在预定压力下暴露于含有氨和氟化氢的混合气体的气氛中。已经暴露于混合气体的气氛的绝缘膜被加热到预定温度。

2. 发明授权

US07622392B2 Method of processing substrate, method of manufacturing solid-state imaging device, method of manufacturing thin film device, and programs for implementing the methods 有权
标题翻译：基板的处理方法，固态成像装置的制造方法，薄膜装置的制造方法以及实施该方法的程序
公开(公告)号：US07622392B2
公开(公告)日：2009-11-24
申请号：US11357168
申请日：2006-02-21
申请人： Eiichi Nishimura , Kenya Iwasaki
发明人： Eiichi Nishimura , Kenya Iwasaki
IPC分类号： H01L21/302
CPC分类号： H01L21/31055 , H01L21/67207 , H01L27/14621 , H01L27/14627 , H01L27/14683 , H01L27/14685 , H01L27/14806
摘要： A method of processing a substrate that enables the amount removed of an insulating film to be controlled precisely, without damaging an electronic device. An insulating film on a substrate of a solid-state imaging device is exposed to an atmosphere of a mixed gas containing ammonia and hydrogen fluoride under a predetermined pressure. The insulating film that has been exposed to the atmosphere of the mixed gas is heated to a predetermined temperature.
摘要翻译：一种处理基板的方法，其能够精确地控制绝缘膜的去除量，而不损坏电子设备。将固态成像装置的基板上的绝缘膜在规定压力下暴露于含有氨和氟化氢的混合气体的气氛中。已经暴露于混合气体的气氛的绝缘膜被加热到预定温度。

3. 发明申请

US20060194435A1 Method of processing substrate, and method of and program for manufacturing electronic device 有权
标题翻译：基板的处理方法，电子器件的制造方法及程序
公开(公告)号：US20060194435A1
公开(公告)日：2006-08-31
申请号：US11353132
申请日：2006-02-14
申请人： Eiichi Nishimura , Kenya Iwasaki
发明人： Eiichi Nishimura , Kenya Iwasaki
IPC分类号： C03C25/68 , H01L21/302
CPC分类号： H01L21/02063 , H01L21/0206 , H01L21/31116 , H01L21/67161 , H01L21/67167 , H01L21/6719 , H01L21/67201 , H01L21/76814 , Y10S438/906
摘要： A method of processing a substrate that enables the amount removed of a surface damaged layer to be controlled easily, and enable a decrease in wiring reliability to be prevented. A surface damaged layer having a reduced carbon concentration of a carbon-containing low dielectric constant insulating film on a substrate is exposed to an atmosphere of a mixed gas containing ammonia and hydrogen fluoride under a predetermined pressure. The surface damaged layer that has been exposed to the atmosphere of the mixed gas is heated to a predetermined temperature.
摘要翻译：一种能够容易地控制表面损伤层去除量的基板的处理方法，能够防止布线可靠性的降低。在基板上的含碳低介电常数绝缘膜的碳浓度降低的表面损伤层在预定压力下暴露于含有氨和氟化氢的混合气体的气氛中。已经暴露于混合气体的气氛的表面损伤层被加热到预定温度。

4. 发明申请

US20060189138A1 Method of processing substrate, post-chemical mechanical polishing cleaning method, and method of and program for manufacturing electronic device 有权
公开(公告)号：US20060189138A1
公开(公告)日：2006-08-24
申请号：US11353154
申请日：2006-02-14
申请人： Eiichi Nishimura , Kenya Iwasaki
发明人： Eiichi Nishimura , Kenya Iwasaki
IPC分类号： H01L21/302 , C03C15/00 , C03C25/68 , H01L21/306 , H01L21/461 , B05C11/00 , H01L21/311 , C23C16/00
CPC分类号： H01L21/31056 , H01L21/02063 , H01L21/02074 , H01L21/31116
摘要： A method of processing a substrate which enables a surface damaged layer and polishing remnants on the surface of an insulating film to be removed, and enable the amount removed of the surface damaged layer and polishing remnants to be controlled easily. An insulating film on a substrate, which has been revealed by chemical mechanical polishing, is exposed to an atmosphere of a mixed gas containing ammonia and hydrogen fluoride under a predetermined pressure. The insulating film which has been exposed to the atmosphere of the mixed gas is heated to a predetermined temperature.

5. 发明授权

US07682517B2 Method of processing substrate, and method of and program for manufacturing electronic device 有权
标题翻译：基板的处理方法，电子器件的制造方法及程序
公开(公告)号：US07682517B2
公开(公告)日：2010-03-23
申请号：US11353132
申请日：2006-02-14
申请人： Eiichi Nishimura , Kenya Iwasaki
发明人： Eiichi Nishimura , Kenya Iwasaki
IPC分类号： B44C1/22
CPC分类号： H01L21/02063 , H01L21/0206 , H01L21/31116 , H01L21/67161 , H01L21/67167 , H01L21/6719 , H01L21/67201 , H01L21/76814 , Y10S438/906
摘要： A method of processing a substrate that enables the amount removed of a surface damaged layer to be controlled easily, and enable a decrease in wiring reliability to be prevented. A surface damaged layer having a reduced carbon concentration of a carbon-containing low dielectric constant insulating film on a substrate is exposed to an atmosphere of a mixed gas containing ammonia and hydrogen fluoride under a predetermined pressure. The surface damaged layer that has been exposed to the atmosphere of the mixed gas is heated to a predetermined temperature.
摘要翻译：一种能够容易地控制表面损伤层去除量的基板的处理方法，能够防止布线可靠性的降低。在基板上的含碳低介电常数绝缘膜的碳浓度降低的表面损伤层在预定压力下暴露于含有氨和氟化氢的混合气体的气氛中。已经暴露于混合气体的气氛的表面损伤层被加热到预定温度。

6. 发明申请

US20060191865A1 Method of processing substrate, method of manufacturing solid-state imaging device, method of manufacturing thin film device, and programs for implementing the methods 有权
公开(公告)号：US20060191865A1
公开(公告)日：2006-08-31
申请号：US11357168
申请日：2006-02-21
申请人： Eiichi Nishimura , Kenya Iwasaki
发明人： Eiichi Nishimura , Kenya Iwasaki
IPC分类号： C03C25/68 , H01L21/306 , C23F1/00
CPC分类号： H01L21/31055 , H01L21/67207 , H01L27/14621 , H01L27/14627 , H01L27/14683 , H01L27/14685 , H01L27/14806
摘要： A method of processing a substrate that enables the amount removed of an insulating film to be controlled precisely, without damaging an electronic device. An insulating film on a substrate of a solid-state imaging device is exposed to an atmosphere of a mixed gas containing ammonia and hydrogen fluoride under a predetermined pressure. The insulating film that has been exposed to the atmosphere of the mixed gas is heated to a predetermined temperature.

7. 发明申请

US20050209902A1 Worker management system, worker management apparatus and worker management method 有权
标题翻译：工人管理制度，工人管理制度和工人管理办法
公开(公告)号：US20050209902A1
公开(公告)日：2005-09-22
申请号：US11117676
申请日：2005-04-29
申请人： Kenya Iwasaki , Hiroshi Nishikawa
发明人： Kenya Iwasaki , Hiroshi Nishikawa
IPC分类号： G06Q10/00 , G06F17/60
CPC分类号： G06Q10/10 , G06Q10/063112 , G06Q10/063114 , G06Q10/063116 , G06Q10/06316 , Y10S707/99943
摘要： A worker management system, which includes a plant 100 divided into a plurality of work areas each in correspondence to specific task contents, a database 220 having stored therein task identification information correlating each work area 112 with contents of tasks performed therein and worker detection sensors 130 installed in each work area, identifies the specific work area where a worker is currently located based upon outputs from the worker detection means and then identifies the task currently performed by the worker based upon the task identification information. Based upon the current task thus identified, a decision is made as to whether the worker should continue the current task or be assigned a new task and an instruction for task execution is issued to the worker. Therefore the identification of current tasks, the assignment of a new task and the task reassignment are facilitated to improve the work efficiency.
摘要翻译：工作人员管理系统，其包括：分割为与特定任务内容相对应的多个工作区域的工厂100;存储有将每个工作区域112与其中执行的任务的内容相关联的任务标识信息的数据库220以及工作人员检测传感器130 安装在每个工作区域中，基于来自工作人员检测装置的输出来识别工作人员当前所在的具体工作区域，然后基于任务识别信息识别工作人员当前执行的任务。根据这样确定的当前任务，决定工作人员是否应该继续当前的任务或分配新任务，并向工作人员发出任务执行指令。因此，有助于确定当前任务，分配新任务和任务重新分配以提高工作效率。

8. 发明申请

US20110281377A1 METHOD FOR SEPARATING AND TRANSFERRING IC CHIPS 有权
标题翻译：分离和传输IC芯片的方法
公开(公告)号：US20110281377A1
公开(公告)日：2011-11-17
申请号：US13089619
申请日：2011-04-19
申请人： Masahiro Yamada , Kenya Iwasaki , Hiroshi Nishikawa
发明人： Masahiro Yamada , Kenya Iwasaki , Hiroshi Nishikawa
IPC分类号： H01L21/78 , H01L21/66
CPC分类号： H01L21/82 , H01L21/3065 , H01L21/308 , H01L21/6836 , H01L21/78 , H01L22/12 , H01L22/34 , H01L25/0657 , H01L2221/68327 , H01L2221/68381 , H01L2224/32145 , H01L2224/45144 , H01L2224/48091 , H01L2224/48463 , H01L2224/73265 , H01L2225/0651 , H01L2225/06555 , H01L2225/06568 , H01L2924/00014 , H01L2924/00
摘要： [Problems] There are provided a chip separation method and a chip transfer method using features of dry etching.[Means for Solving the Problems] In the chip separation method, a multiple number of semiconductor devices or semiconductor integrated circuits are separated from a wafer 100 on which the multiple number of semiconductor devices or semiconductor integrated circuits are formed. The method includes forming, on a surface of the wafer 100, a mask layer through which a line-shaped pattern to be removed for separating the semiconductor devices or semiconductor integrated circuits is exposed; and etching the exposed pattern to a depth equal to or larger than about ⅔ of a thickness of the wafer. One group of separated semiconductor devices or semiconductor integrated circuits has a distinguishable shape from another group of separated semiconductor devices or semiconductor integrated circuits.
摘要翻译： [问题]提供了使用干蚀刻特征的芯片分离方法和芯片转印方法。解决问题的手段在芯片分离方法中，多个半导体器件或半导体集成电路与形成有多个半导体器件或半导体集成电路的晶片100分离。该方法包括在晶片100的表面上形成掩模层，通过该掩模层露出用于分离半导体器件或半导体集成电路的要移除的线状图案; 并且将暴露图案蚀刻到等于或大于晶片厚度的约⅔的深度。一组分离的半导体器件或半导体集成电路具有与另一组分离的半导体器件或半导体集成电路的区别的形状。

9. 发明授权

US08658436B2 Method for separating and transferring IC chips 有权
标题翻译：分离和转移IC芯片的方法
公开(公告)号：US08658436B2
公开(公告)日：2014-02-25
申请号：US13089619
申请日：2011-04-19
申请人： Masahiro Yamada , Kenya Iwasaki , Hiroshi Nishikawa
发明人： Masahiro Yamada , Kenya Iwasaki , Hiroshi Nishikawa
IPC分类号： H01L21/78 , H01L21/66
CPC分类号： H01L21/82 , H01L21/3065 , H01L21/308 , H01L21/6836 , H01L21/78 , H01L22/12 , H01L22/34 , H01L25/0657 , H01L2221/68327 , H01L2221/68381 , H01L2224/32145 , H01L2224/45144 , H01L2224/48091 , H01L2224/48463 , H01L2224/73265 , H01L2225/0651 , H01L2225/06555 , H01L2225/06568 , H01L2924/00014 , H01L2924/00
摘要： [Problems] There are provided a chip separation method and a chip transfer method using features of dry etching.[Means for Solving the Problems] In the chip separation method, a multiple number of semiconductor devices or semiconductor integrated circuits are separated from a wafer 100 on which the multiple number of semiconductor devices or semiconductor integrated circuits are formed. The method includes forming, on a surface of the wafer 100, a mask layer through which a line-shaped pattern to be removed for separating the semiconductor devices or semiconductor integrated circuits is exposed; and etching the exposed pattern to a depth equal to or larger than about ⅔ of a thickness of the wafer. One group of separated semiconductor devices or semiconductor integrated circuits has a distinguishable shape from another group of separated semiconductor devices or semiconductor integrated circuits.
摘要翻译： [问题]提供了使用干蚀刻特征的芯片分离方法和芯片转印方法。解决问题的手段在芯片分离方法中，多个半导体器件或半导体集成电路与形成有多个半导体器件或半导体集成电路的晶片100分离。该方法包括在晶片100的表面上形成掩模层，通过该掩模层露出用于分离半导体器件或半导体集成电路的要移除的线状图案; 并且将曝光图案蚀刻到等于或大于晶片厚度的约2/3的深度。一组分离的半导体器件或半导体集成电路具有与另一组分离的半导体器件或半导体集成电路的区别的形状。

10. 发明授权

US07769617B2 Worker management system, worker management apparatus and worker management method 有权
标题翻译：工人管理制度，工人管理制度和工人管理办法
公开(公告)号：US07769617B2
公开(公告)日：2010-08-03
申请号：US11117676
申请日：2005-04-29
申请人： Kenya Iwasaki , Hiroshi Nishikawa
发明人： Kenya Iwasaki , Hiroshi Nishikawa
IPC分类号： G05B19/418 , G06F9/46
CPC分类号： G06Q10/10 , G06Q10/063112 , G06Q10/063114 , G06Q10/063116 , G06Q10/06316 , Y10S707/99943
摘要： A worker management system, which includes a plant 100 divided into a plurality of work areas each in correspondence to specific task contents, a database 220 having stored therein task identification information correlating each work area 112 with contents of tasks performed therein and worker detection sensors 130 installed in each work area, identifies the specific work area where a worker is currently located based upon outputs from the worker detection means and then identifies the task currently performed by the worker based upon the task identification information. Based upon the current task thus identified, a decision is made as to whether the worker should continue the current task or be assigned a new task and an instruction for task execution is issued to the worker. Therefore the identification of current tasks, the assignment of a new task and the task reassignment are facilitated to improve the work efficiency.
摘要翻译：工作人员管理系统，其包括：分割为与特定任务内容相对应的多个工作区域的工厂100;存储有将每个工作区域112与其中执行的任务的内容相关联的任务标识信息的数据库220以及工作人员检测传感器130 安装在每个工作区域中，基于来自工作人员检测装置的输出来识别工作人员当前所在的具体工作区域，然后基于任务识别信息识别工作人员当前执行的任务。根据这样确定的当前任务，决定工作人员是否应该继续当前的任务或分配新任务，并向工作人员发出任务执行指令。因此，有助于确定当前任务，分配新任务和任务重新分配以提高工作效率。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式