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1. 发明授权

US07524390B2 Fixture and method of holding and debonding a workpiece with the fixture 有权
标题翻译：夹具和夹具固定和剥离工件的方法
公开(公告)号：US07524390B2
公开(公告)日：2009-04-28
申请号：US11460159
申请日：2006-07-26
申请人： Edward C. DeMeter , R. Michael Powell
发明人： Edward C. DeMeter , R. Michael Powell
IPC分类号： B32B38/10
CPC分类号： B32B38/10 , B23Q1/035 , B23Q3/084 , B25B11/00 , Y10T156/11 , Y10T156/1168 , Y10T156/19 , Y10T156/1961 , Y10T156/1972
摘要： A fixture for holding a workpiece during a manufacturing process includes a base and a rod received by and moveable relative to the base. The rod includes a proximal end presenting a bonding surface. Adhesive establishes an adhesive bond extending between and bonding to the bonding surface and the workpiece. The bonding surface is moveable with the rod relative to the base in an adhesive bond destroying motion. A method of holding the workpiece on the fixture includes the step of adjoining the adhesive to the bonding surface and to the workpiece to create the adhesive bond between the bonding surface and the workpiece during the manufacturing process. The method also includes the step of displacing the bonding surface relative to the base and relative to the workpiece to destroy the adhesive bond between the bonding surface and the workpiece after the manufacturing process has been performed on the workpiece.
摘要翻译：用于在制造过程中保持工件的固定装置包括基座和相对于底座接收并可移动的杆。杆包括具有接合表面的近端。粘合剂建立在粘合表面和工件之间延伸并粘合到粘合表面和工件上的粘合剂粘结。接合表面可以与棒相对于底座以粘合剂粘结破坏运动而移动。将工件保持在夹具上的方法包括将粘合剂与粘合表面和工件相邻的步骤，以在制造过程中在粘合表面和工件之间形成粘合剂粘结。该方法还包括相对于基座相对于工件移动接合表面的步骤，以便在对工件进行制造过程之后破坏接合表面和工件之间的粘结。

2. 发明申请

US20070221328A1 FIXTURE AND METHOD OF HOLDING AND DEBONDING A WORKPIECE WITH THE FIXTURE 有权
标题翻译：用工具夹持和去除工件的方法和方法
公开(公告)号：US20070221328A1
公开(公告)日：2007-09-27
申请号：US11460159
申请日：2006-07-26
申请人： Edward C. DeMeter , R. Michael Powell
发明人： Edward C. DeMeter , R. Michael Powell
IPC分类号： B32B37/12
CPC分类号： B32B38/10 , B23Q1/035 , B23Q3/084 , B25B11/00 , Y10T156/11 , Y10T156/1168 , Y10T156/19 , Y10T156/1961 , Y10T156/1972
摘要： A fixture for holding a workpiece during a manufacturing process includes a base and a rod received by and moveable relative to the base. The rod includes a proximal end presenting a bonding surface. Adhesive establishes an adhesive bond extending between and bonding to the bonding surface and the workpiece. The bonding surface is moveable with the rod relative to the base in an adhesive bond destroying motion. A method of holding the workpiece on the fixture includes the step of adjoining the adhesive to the bonding surface and to the workpiece to create the adhesive bond between the bonding surface and the workpiece during the manufacturing process. The method also includes the step of displacing the bonding surface relative to the base and relative to the workpiece to destroy the adhesive bond between the bonding surface and the workpiece after the manufacturing process has been performed on the workpiece.
摘要翻译：用于在制造过程中保持工件的固定装置包括基座和相对于底座接收并可移动的杆。杆包括具有接合表面的近端。粘合剂建立在粘合表面和工件之间延伸并粘合到粘合表面和工件上的粘合剂粘结。接合表面可以与棒相对于底座以粘合剂粘结破坏运动而移动。将工件保持在夹具上的方法包括将粘合剂与粘合表面和工件相邻的步骤，以在制造过程中在粘合表面和工件之间形成粘合剂粘结。该方法还包括相对于基座相对于工件移动接合表面的步骤，以便在对工件进行制造过程之后破坏接合表面和工件之间的粘结。

3. 发明授权

US07172676B2 System and method for bonding and debonding a workpiece to a manufacturing fixture 有权
标题翻译：用于将工件粘结和剥离到制造夹具的系统和方法
公开(公告)号：US07172676B2
公开(公告)日：2007-02-06
申请号：US10635791
申请日：2003-08-06
申请人： Edward C. DeMeter
发明人： Edward C. DeMeter
IPC分类号： B27G11/02
CPC分类号： B27G11/02 , B23Q3/084 , B29C65/1403 , B29C65/1406 , B29C65/1409 , B29C65/1416 , B29C65/1435 , B29C65/1464 , B29C65/1483 , B29C65/1487 , B29C65/1606 , B29C65/1616 , B29C65/1635 , B29C65/1664 , B29C65/1683 , B29C65/1687 , B29C65/4835 , B29C65/4845 , B29C65/485 , B29C65/4865 , B29C65/76 , B29C66/1122 , B29C66/472 , B29C66/5326 , C09J5/00
摘要： A system and a method by which workpieces are bonded to and debond from a manufacturing fixture using a radiation responsive adhesive as a bonding agent. The system includes curing the adhesive agent during loading within seconds, and structurally weakens the adhesive bond during unloading within seconds. During the workpiece loading cycle, an adhesive dispenser deposits radiation responsive adhesive on to a load bearing, light transmittive surface, known as gripper pins. The workpiece is subsequently pushed against the locators, and towards the gripper pins causing the adhesive to interpose between workpiece and gripper pins, curing radiant energy is transmitted through the gripper pins and on to the adhesive to cure adhesive and bond the workpiece to the fixture. Therefore, the bond is structurally weakened or debonded in order to remove the workpiece from the fixture after manufacturing.
摘要翻译：使用辐射敏感性粘合剂作为粘合剂将工件粘合到制造夹具上并脱离的系统和方法。该系统包括在几秒钟内装载期间固化粘合剂，并且在几秒钟内在卸载过程中结构地削弱粘合剂粘结。在工件加载循环期间，粘合剂分配器将辐射响应粘合剂沉积在负载轴承，光透射表面（称为夹持销）上。工件随后被推靠在定位器上，并且朝着夹持销引导，使得粘合剂插入到工件和夹具销之间，固化辐射能通过夹持销传递到粘合剂上以固化粘合剂并将工件粘合到夹具上。因此，为了在制造后从夹具中除去工件，结构被削弱或脱粘。

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