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1. 发明授权

US08777694B2 Polishing endpoint detection method 有权
标题翻译：抛光端点检测方法
公开(公告)号：US08777694B2
公开(公告)日：2014-07-15
申请号：US14036321
申请日：2013-09-25
申请人： Ebara Corporation , Kabushiki Kaisha Toshiba
发明人： Shinrou Ohta , Atsushi Shigeta
IPC分类号： B24B1/00 , B24B49/00 , B24B51/00
CPC分类号： B24B37/013 , B24B37/042
摘要： Method and apparatus for detecting an accurate polishing endpoint of a substrate based on a change in polishing rate are provided. The method includes: applying a light to the surface of the substrate and receiving a reflected light from the substrate; obtaining a plurality of spectral profiles at predetermined time intervals, each spectral profile indicating reflection intensity at each wavelength of the reflected light; selecting at least one pair of spectral profiles, including a latest spectral profile, from the plurality of spectral profiles obtained; calculating a difference in the reflection intensity at a predetermined wavelength between the spectral profiles selected; determining an amount of change in the reflection intensity from the difference; and determining a polishing endpoint based on the amount of change.
摘要翻译：提供了用于基于抛光速率的变化来检测基板的精确抛光终点的方法和装置。该方法包括：将光施加到衬底的表面并接收来自衬底的反射光; 以预定的时间间隔获得多个光谱轮廓，每个光谱轮廓指示反射光的每个波长处的反射强度; 从所获得的多个光谱分布中选择至少一对光谱分布，包括最新的光谱分布; 计算所选择的光谱轮廓之间的预定波长处的反射强度的差; 从所述差确定反射强度的变化量; 以及基于变化量确定抛光端点。

2. 发明授权

US08585460B2 Method of making diagram for use in selection of wavelength of light for polishing endpoint detection, method and apparatus for selecting wavelength of light for polishing endpoint detection, polishing endpoint detection method, polishing endpoint detection apparatus, and polishing monitoring method 有权
标题翻译：用于选择用于抛光终点检测的光的波长的图的制作方法，用于选择用于抛光终点检测的光的波长的选择方法和装置，抛光终点检测方法，抛光终点检测装置和抛光监测方法
公开(公告)号：US08585460B2
公开(公告)日：2013-11-19
申请号：US13712014
申请日：2012-12-12
申请人： Ebara Corporation
发明人： Yoichi Kobayashi , Shinrou Ohta , Toshifumi Kimba , Masaki Kinoshita
IPC分类号： B24B49/00 , B24B51/00
CPC分类号： B24B49/12 , B24B37/013
摘要： A method of polishing end point detection includes polishing a surface of a substrate; applying light to the surface of the substrate and receiving reflected light from the substrate during the polishing of the substrate; measuring reflection intensities of the reflected light at respective wavelengths; creating a spectral profile indicating a relationship between reflection intensity and wavelength from the reflection intensities measured; extracting at least one extremal point indicating extremum of the reflection intensities from the spectral profile; during polishing of the substrate, repeating the creating of the spectral profile and the extracting of the at least one extremal point to obtain plural spectral profiles and plural extremal points; and detecting the polishing end point based on an amount of relative change in the extremal point between the plural spectral profiles.
摘要翻译：抛光终点检测的方法包括抛光基底的表面; 在基板的研磨过程中将光施加到基板的表面并接收来自基板的反射光; 测量各波长的反射光的反射强度; 从测量的反射强度产生指示反射强度和波长之间的关系的光谱分布; 从光谱轮廓提取表示反射强度的极值的至少一个极值点; 在衬底的抛光期间，重复产生光谱轮廓和提取至少一个极值点以获得多个光谱曲线和多个极值点; 并且基于多个光谱轮廓之间的极值点的相对变化量来检测抛光终点。

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