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1. 发明授权

US09969048B2 Polishing apparatus 有权
公开(公告)号：US09969048B2
公开(公告)日：2018-05-15
申请号：US14808252
申请日：2015-07-24
申请人： EBARA CORPORATION
发明人： Itsuki Kobata , Yoichi Kobayashi , Katsutoshi Ono , Masaki Kinoshita , Toshifumi Kimba
IPC分类号： B24B49/12 , B24B37/013 , B24B37/10 , B24B37/26 , H01L21/67 , H01L21/687 , B24B37/04 , B24B37/005 , H01L21/3105 , H01L21/66
CPC分类号： B24B37/26 , B24B37/005 , B24B37/013 , B24B37/04 , B24B37/042 , B24B37/10 , B24B49/12 , H01L21/31053 , H01L21/67075 , H01L21/67092 , H01L21/67253 , H01L21/68721 , H01L22/26
摘要： A polishing apparatus for polishing a substrate is provided. The polishing apparatus includes: a polishing table holding a polishing pad; a top ring configured to press the substrate against the polishing pad; first and second optical heads each configured to apply the light to the substrate and to receive reflected light from the substrate; spectroscopes each configured to measure at each wavelength an intensity of the reflected light received; and a processor configured to produce a spectrum indicating a relationship between intensity and wavelength of the reflected light. The first optical head is arranged so as to face a center of the substrate, and the second optical head is arranged so as to face a peripheral portion of the substrate.

2. 发明授权

US09440327B2 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US09440327B2
公开(公告)日：2016-09-13
申请号：US13859496
申请日：2013-04-09
申请人： Ebara Corporation
发明人： Yasumasa Hiroo , Yoichi Kobayashi , Katsutoshi Ono
IPC分类号： B24B1/00 , B24B49/10 , B24B49/12 , B24B49/16 , B24B37/013
CPC分类号： B24B37/013 , B24B1/002 , B24B49/10 , B24B49/12 , B24B49/16
摘要： The present invention provides an apparatus and a method for polishing a substrate having a film formed thereon. The method includes: rotating a polishing table supporting a polishing pad by a table motor; pressing the substrate against the polishing pad by a top ring; obtaining a signal containing a thickness information of the film; producing from the signal a polishing index value that varies in accordance with a thickness of the film; monitoring a torque current value of the table motor and the polishing index value; and determining a polishing end point based on a point of time when the torque current value has reached a predetermined threshold value or a point of time when a predetermined distinctive point of the polishing index value has appeared, whichever comes first.
摘要翻译：本发明提供一种用于研磨其上形成有膜的基板的装置和方法。该方法包括：通过台式马达旋转支撑抛光垫的抛光台; 通过顶环将衬底压在抛光垫上; 获得包含胶片厚度信息的信号; 从所述信号产生根据所述膜的厚度而变化的抛光指数值; 监测台式电动机的转矩电流值和抛光指标值; 并且基于当转矩电流值已经达到预定阈值的时间点或抛光指标值的预定特征点出现的时间点（以先到者为准），确定抛光终点。

3. 发明授权

US10343255B2 Polishing apparatus 有权
公开(公告)号：US10343255B2
公开(公告)日：2019-07-09
申请号：US15949960
申请日：2018-04-10
申请人： EBARA CORPORATION
发明人： Itsuki Kobata , Yoichi Kobayashi , Katsutoshi Ono , Masaki Kinoshita , Toshifumi Kimba
IPC分类号： B24B49/12 , B24B37/013 , B24B37/10 , B24B37/26 , H01L21/67 , H01L21/687 , B24B37/04 , B24B37/20 , B24B37/005 , H01L21/3105 , H01L21/66
摘要： A polishing apparatus for polishing a substrate is provided. The polishing apparatus includes: a polishing table holding a polishing pad; a top ring configured to press the substrate against the polishing pad; first and second optical heads each configured to apply the light to the substrate and to receive reflected light from the substrate; spectroscopes each configured to measure at each wavelength an intensity of the reflected light received; and a processor configured to produce a spectrum indicating a relationship between intensity and wavelength of the reflected light. The first optical head is arranged so as to face a center of the substrate, and the second optical head is arranged so as to face a peripheral portion of the substrate.

4. 发明申请

US20130344773A1 POLISHING APPARATUS AND POLISHING METHOD 有权
标题翻译：抛光装置和抛光方法
公开(公告)号：US20130344773A1
公开(公告)日：2013-12-26
申请号：US13859496
申请日：2013-04-09
申请人： Ebara Corporation
发明人： Yasumasa Hiroo , Yoichi Kobayashi , Katsutoshi Ono
IPC分类号： B24B37/013
CPC分类号： B24B37/013 , B24B1/002 , B24B49/10 , B24B49/12 , B24B49/16
摘要： The present invention provides an apparatus and a method for polishing a substrate having a film formed thereon. The method includes: rotating a polishing table supporting a polishing pad by a table motor; pressing the substrate against the polishing pad by a top ring; obtaining a signal containing a thickness information of the film; producing from the signal a polishing index value that varies in accordance with a thickness of the film; monitoring a torque current value of the table motor and the polishing index value; and determining a polishing end point based on a point of time when the torque current value has reached a predetermined threshold value or a point of time when a predetermined distinctive point of the polishing index value has appeared, whichever comes first.
摘要翻译：本发明提供一种用于研磨其上形成有膜的基板的装置和方法。该方法包括：通过台式马达旋转支撑抛光垫的抛光台; 通过顶环将衬底压在抛光垫上; 获得包含胶片厚度信息的信号; 从所述信号产生根据所述膜的厚度而变化的抛光指数值; 监测台式电动机的转矩电流值和抛光指标值; 并且基于当转矩电流值已经达到预定阈值的时间点或抛光指标值的预定特征点出现的时间点（以先到者为准），确定抛光终点。

5. 发明申请

US20130273814A1 POLISHING APPARATUS AND POLISHING METHOD 审中-公开
标题翻译：抛光装置和抛光方法
公开(公告)号：US20130273814A1
公开(公告)日：2013-10-17
申请号：US13864181
申请日：2013-04-16
申请人： EBARA CORPORATION
发明人： Yoichi Kobayashi , Katsutoshi Ono
IPC分类号： H01L21/302
CPC分类号： H01L21/302 , B24B37/013 , B24B37/205 , B24B49/105 , B24B49/12 , H01L22/12 , H01L22/26
摘要： A polishing apparatus polishes a substrate having a film formed thereon. A sensor is disposed in a polishing table that supports a polishing pad thereon. The polishing apparatus is configured to perform an idling process in which polishing of the substrate on the polishing pad does not progress substantially, while rotating the polishing table and the substrate. The sensor obtains the film thickness data, which varies in accordance with a thickness of the film, while the idling process is performed. A processor calculates, from the film thickness data, a polishing index value indicating the progress of polishing of the film.
摘要翻译：抛光装置抛光其上形成有膜的基板。传感器设置在其上支撑抛光垫的抛光台中。抛光装置被配置为执行怠速处理，其中在抛光台和基板旋转的同时抛光垫上的基板的抛光不会基本上进行。当执行空转处理时，传感器获得根据薄膜厚度而变化的薄膜厚度数据。处理器根据胶片厚度数据计算表示胶片的抛光进度的抛光指标值。

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