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1. 发明授权

US11597051B2 Method for polishing substrate including functional chip 有权
公开(公告)号：US11597051B2
公开(公告)日：2023-03-07
申请号：US16643124
申请日：2018-08-22
申请人： EBARA CORPORATION
发明人： Tetsuji Togawa , Hiroshi Sobukawa , Masahiro Hatakeyama
IPC分类号： B24B37/013 , B24B37/16
摘要： To terminate polishing at an appropriate position, an end point position of the polishing is sensed. According to one embodiment, a method that chemomechanically polishes a substrate including a functional chip is provided. The method includes: a step of disposing the functional chip on the substrate; a step of disposing an end point sensing element on the substrate; a step of sealing the substrate on which the functional chip and the end point sensing element are disposed with an insulating material; a step of polishing the insulating material; and a step of sensing an end point of the polishing based on the end point sensing element while the insulating material is polished.

2. 发明授权

US11583973B2 Polishing apparatus 有权
公开(公告)号：US11583973B2
公开(公告)日：2023-02-21
申请号：US16872622
申请日：2020-05-12
申请人： EBARA CORPORATION
发明人： Hiroyuki Shinozaki , Yuta Suzuki , Taro Takahashi , Seiji Katsuoka , Masahiro Hatakeyama
IPC分类号： B24B37/013 , B24B37/10 , B24B49/10 , B24B49/16 , B24B37/04 , B24B37/32
摘要： In a scheme in which a top ring is held to an end portion of a swing arm, the present invention improves accuracy of polishing end point detection. A polishing apparatus for polishing between a polishing pad 10 and a semiconductor wafer 16 disposed opposed to the polishing pad 10 includes a polishing table 30A for holding the polishing pad 10 and a top ring 31A for holding the semiconductor wafer 16. A swing shaft motor 14 swings a swing arm 110 for holding the top ring 31A. The arm torque detection section 26 detects arm torque applied to the swing arm 110. An end point detection section 28 detects a polishing end point indicating an end of polishing based on the detected arm torque.

3. 发明授权

US10446404B2 Electron-beam irradiated area adjustment method and adjustment system, electron-beam irradiated region correction method, and electron beam irradiation apparatus 有权
公开(公告)号：US10446404B2
公开(公告)日：2019-10-15
申请号：US15873108
申请日：2018-01-17
申请人： EBARA CORPORATION
发明人： Ryo Tajima , Masahiro Hatakeyama , Kenichi Suematsu , Kiwamu Tsukamoto , Kenji Watanabe , Shoji Yoshikawa , Shinichi Okada , Kenji Terao
IPC分类号： H01L37/00 , H01L21/3065 , H01J37/147 , H01J37/305 , H01J37/302 , H01L21/027
摘要： Provided is a method of adjusting an electron-beam irradiated area in an electron beam irradiation apparatus that deflects an electron beam with a deflector to irradiate an object with the electron beam, the method including: emitting an electron beam while changing an irradiation position on an adjustment plate by controlling the deflector in accordance with an electron beam irradiation recipe, the adjustment plate detecting a current corresponding to the emitted electron beam; acquiring a current value detected from the adjustment plate; forming image data corresponding to the acquired current value; determining whether the electron-beam irradiated area is appropriate based on the formed image data; and updating the electron beam irradiation recipe when the electron-beam irradiated area is determined not to be appropriate.

4. 发明授权

US09601302B2 Inspection apparatus 有权
公开(公告)号：US09601302B2
公开(公告)日：2017-03-21
申请号：US14813768
申请日：2015-07-30
申请人： EBARA CORPORATION
发明人： Shoji Yoshikawa , Kiwamu Tsukamoto , Takeshi Murakami , Masahiro Hatakeyama , Tsutomu Karimata
IPC分类号： H01J37/26 , H01J37/02 , G01N23/22 , H01J37/09 , H01J37/16 , H01J37/20 , H01J37/285 , G01N21/95
CPC分类号： H01J37/023 , G01N21/9501 , G01N23/2204 , H01J37/09 , H01J37/16 , H01J37/20 , H01J37/285 , H01J2237/022 , H01J2237/0264 , H01J2237/1501 , H01J2237/166 , H01J2237/20 , H01J2237/2007 , H01J2237/20221 , H01J2237/20278 , H01J2237/26
摘要： An inspection apparatus capable of facilitating reduction in cost of the apparatus is provided. The inspection apparatus includes: beam generation means for generating any of charged particles and electromagnetic waves as a beam; a primary optical system that guides the beam into an inspection object held on a movable stage in a working chamber and irradiates the inspection object with the beam; a secondary optical system that detects secondary charged particles occurring from the inspection object; and an image processing system that forms an image on the basis of the detected secondary charged particles. The inspection apparatus further includes: a linear motor that drives the movable stage; and a Helmholtz coil that causes a magnetic field for canceling a magnetic field caused by the linear motor when the movable stage is driven.

5. 发明授权

US09368314B2 Inspection system by charged particle beam and method of manufacturing devices using the system 有权
标题翻译：带电粒子束的检测系统及使用该系统的制造装置的方法
公开(公告)号：US09368314B2
公开(公告)日：2016-06-14
申请号：US14319620
申请日：2014-06-30
申请人： EBARA CORPORATION
发明人： Mamoru Nakasuji , Nobuharu Noji , Tohru Satake , Masahiro Hatakeyama , Toshifumi Kimba , Hirosi Sobukawa , Shoji Yoshikawa , Takeshi Murakami , Kenji Watanabe , Tsutomu Karimata , Shin Oowada , Mutsumi Saito , Yuichiro Yamazaki , Takamitsu Nagai , Ichirota Nagahama
IPC分类号： G01N23/225 , H01J29/70 , H01J37/06 , H01J37/073 , H01J37/18 , H01J37/20 , H01J37/22 , H01J37/244 , H01J37/28 , H01L21/67 , G01N23/227 , H01J37/26 , H01J37/141
CPC分类号： H01J29/70 , G01N23/225 , G01N23/2251 , G01N23/227 , H01J37/06 , H01J37/073 , H01J37/141 , H01J37/185 , H01J37/20 , H01J37/222 , H01J37/244 , H01J37/266 , H01J37/28 , H01J2237/082 , H01J2237/202 , H01J2237/20228 , H01J2237/204 , H01J2237/22 , H01J2237/24564 , H01J2237/2806 , H01J2237/2816 , H01J2237/2817 , H01L21/6719 , H01L21/67213
摘要： An inspection apparatus by an electron beam comprises: an electron-optical device 70 having an electron-optical system for irradiating the object with a primary electron beam from an electron beam source, and a detector for detecting the secondary electron image projected by the electron-optical systems; a stage system 50 for holding and moving the object relative to the electron-optical system; a mini-environment chamber 20 for supplying a clean gas to the object to prevent dust from contacting the object; a working chamber 31 for accommodating the stage device, the working chamber being controllable so as to have a vacuum atmosphere; at least two loading chambers 41, 42 disposed between the mini-environment chamber and the working chamber, adapted to be independently controllable so as to have a vacuum atmosphere; and a loader 60 for transferring the object to the stage system through the loading chambers.
摘要翻译：电子束检查装置包括：电子光学装置70，具有用于从电子束源向一个电子束照射物体的电子 - 光学系统;以及用于检测由电子束投射的二次电子图像的检测器，光学系统; 用于相对于电子 - 光学系统保持和移动物体的平台系统50; 小型环境室20，用于向物体供给清洁气体，以防止灰尘与物体接触; 用于容纳平台装置的工作室31，工作室可控制为具有真空气氛; 设置在微环境室和工作室之间的至少两个装载室41,42适于独立控制以具有真空气氛; 以及用于通过装载室将物体传送到舞台系统的装载器60。

6. 发明申请

US20150060666A1 SPECIMEN OBSERVATION METHOD AND DEVICE USING SECONDARY EMISSION ELECTRON AND MIRROR ELECTRON DETECTION 有权
标题翻译：使用二次发射电子和物镜电子检测的样本观测方法和装置
公开(公告)号：US20150060666A1
公开(公告)日：2015-03-05
申请号：US14533974
申请日：2014-11-05
申请人： EBARA CORPORATION
发明人： Masahiro Hatakeyama , Takeshi Murakami , Yoshihiko Naito , Kenji Terao , Norio Kimura , Kenji Watanabe
IPC分类号： H01J37/28 , H01J37/22
CPC分类号： H01J37/28 , H01J37/22 , H01J37/244 , H01J37/29 , H01J2237/24475 , H01J2237/24585 , H01J2237/24592 , H01J2237/2805 , H01J2237/2806 , H01J2237/2817 , H01L22/12
摘要： A technique capable of improving the ability to observe a specimen using an electron beam in an energy region which has not been conventionally given attention is provided. This specimen observation method comprises: irradiating the specimen with an electron beam; detecting electrons to be observed which have been generated and have obtained information on the specimen by the electron beam irradiation; and generating an image of the specimen from the detected electrons to be observed. The electron beam irradiation comprises irradiating the specimen with the electron beam with a landing energy set in a transition region between a secondary emission electron region in which secondary emission electrons are detected and a mirror electron region in which mirror electrons are detected, thereby causing the secondary emission electrons and the mirror electrons to be mixed as the electrons to be observed. The detection of the electrons to be observed comprises performing the detection in a state where the secondary emission electrons and the mirror electrons are mixed. Observation and inspection can be quickly carried out for a fine foreign material and pattern of 100 nm or less.
摘要翻译：提供了一种技术，其能够提高在未经常被注意的能量区域中使用电子束观察样本的能力。该样本观察方法包括：用电子束照射样本; 检测已经产生的待观察的电子，并通过电子束照射获得关于样品的信息; 以及从所检测的电子产生待观察的样本的图像。电子束照射包括用电子束照射样本，其中在其中检测到二次发射电子的二次发射电子区域和其中检测到反射镜电子的镜电子区域之间的过渡区域中设置的着陆能量，从而使次级发射电子和镜电子作为待观察的电子进行混合。要观察的电子的检测包括在二次发射电子和镜电子混合的状态下进行检测。对于100nm以下的细小异物和图案，可以快速进行观察和检查。

7. 发明授权

US08803103B2 Inspection system by charged particle beam and method of manufacturing devices using the system 有权
标题翻译：带电粒子束的检测系统及使用该系统的制造装置的方法
公开(公告)号：US08803103B2
公开(公告)日：2014-08-12
申请号：US13732897
申请日：2013-01-02
申请人： Ebara Corporation , Kabushiki Kaisha Toshiba
发明人： Mamoru Nakasuji , Nobuharu Noji , Tohru Satake , Masahiro Hatakeyama , Toshifumi Kimba , Hirosi Sobukawa , Shoji Yoshikawa , Takeshi Murakami , Kenji Watanabe , Tsutomu Karimata , Shin Oowada , Mutsumi Saito , Yuichiro Yamazaki , Takamitsu Nagai , Ichirota Nagahama
IPC分类号： G21K5/04 , H01J37/26 , H01J29/70 , H01J37/141
CPC分类号： H01J29/70 , G01N23/225 , G01N23/2251 , G01N23/227 , H01J37/06 , H01J37/073 , H01J37/141 , H01J37/185 , H01J37/20 , H01J37/222 , H01J37/244 , H01J37/266 , H01J37/28 , H01J2237/082 , H01J2237/202 , H01J2237/20228 , H01J2237/204 , H01J2237/22 , H01J2237/24564 , H01J2237/2806 , H01J2237/2816 , H01J2237/2817 , H01L21/6719 , H01L21/67213
摘要： An inspection apparatus by an electron beam comprises: an electron-optical device 70 having an electron-optical system for irradiating the object with a primary electron beam from an electron beam source, and a detector for detecting the secondary electron image projected by the electron-optical system; a stage system 50 for holding and moving the object relative to the electron-optical system; a mini-environment chamber 20 for supplying a clean gas to the object to prevent dust from contacting to the object; a working chamber 31 for accommodating the stage device, the working chamber being controllable so as to have a vacuum atmosphere; at least two loading chambers 41, 42 disposed between the mini-environment chamber and the working chamber, adapted to be independently controllable so as to have a vacuum atmosphere; and a loader 60 for transferring the object to the stage system through the loading chambers.
摘要翻译：电子束检查装置包括：电子光学装置70，具有用于从电子束源向一个电子束照射物体的电子 - 光学系统;以及用于检测由电子束投射的二次电子图像的检测器，光学系统; 用于相对于电子 - 光学系统保持和移动物体的平台系统50; 微型环境室20，用于向物体供应清洁气体，以防止灰尘与物体接触; 用于容纳平台装置的工作室31，工作室可控制为具有真空气氛; 设置在迷你环境室和工作室之间的至少两个装载室41,42适于独立控制以具有真空气氛; 以及用于通过装载室将物体传送到舞台系统的装载器60。

8. 发明申请

US20140158885A1 TESTING APPARATUS USING CHARGED PARTICLES AND DEVICE MANUFACTURING METHOD USING THE TESTING APPARATUS 有权
标题翻译：使用充电颗粒的测试装置和使用测试装置的设备制造方法
公开(公告)号：US20140158885A1
公开(公告)日：2014-06-12
申请号：US14156140
申请日：2014-01-15
申请人： EBARA CORPORATION
发明人： Nobuharu Noji , Tohru Satake , Hirosi Sobukawa , Toshifumi Kimba , Masahiro Hatakeyama , Shoji Yoshikawa , Takeshi Murakami , Kenji Watanabe , Tsutomu Karimata , Kenichi Suematsu , Yutaka Tabe , Ryo Tajima , Keiichi Tohyama
IPC分类号： G01N23/225
CPC分类号： H01J37/20 , G01N23/2204 , G01N23/225 , H01J37/05 , H01J37/28 , H01J2237/202 , H01J2237/2441 , H01J2237/2446 , H01J2237/2801 , H01J2237/2817 , H01L21/6833 , H01L2223/54466
摘要： A system for further enhancing speed, i.e. improving throughput in a SEM-type inspection apparatus is provided. An inspection apparatus for inspecting a surface of a substrate produces a crossover from electrons emitted from an electron beam source 25•1, then forms an image under a desired magnification in the direction of a sample W to produce a crossover. When the crossover is passed, electrons as noises are removed from the crossover with an aperture, an adjustment is made so that the crossover becomes a parallel electron beam to irradiate the substrate in a desired sectional form. The electron beam is produced such that the unevenness of illuminance is 10% or less. Electrons emitted from the sample W are detected by a detector 25•11.
摘要翻译：提供了一种用于进一步提高速度的系统，即提高SEM型检查装置中的生产量。用于检查基板的表面的检查装置产生从电子束源25·1发射的电子的交叉，然后在样品W的方向上以期望的倍率形成图像以产生交叉。当交叉通过时，作为噪声的电子从具有孔的交叉点移除，进行调整，使得交叉成为平行电子束以以期望的分段形式照射基板。产生电子束，使照度不均匀为10％以下。从样品W发射的电子被检测器25·11检测。

9. 发明公开

US20230158632A1 POLISHING APPARATUS 审中-公开
公开(公告)号：US20230158632A1
公开(公告)日：2023-05-25
申请号：US18154689
申请日：2023-01-13
申请人： EBARA CORPORATION
发明人： Hiroyuki Shinozaki , Yuta Suzuki , Taro Takahashi , Seiji Katsuoka , Masahiro Hatakeyama
IPC分类号： B24B37/013 , B24B37/04 , B24B37/10 , B24B37/32 , B24B49/10 , B24B49/16
CPC分类号： B24B37/013 , B24B37/042 , B24B37/10 , B24B37/32 , B24B49/10 , B24B49/16
摘要： In a scheme in which a top ring is held to an end portion of a swing arm, the present invention improves accuracy of polishing end point detection. A polishing apparatus for polishing between a polishing pad 10 and a semiconductor wafer 16 disposed opposed to the polishing pad 10 includes a polishing table 30A for holding the polishing pad 10 and a top ring 31A for holding the semiconductor wafer 16. A swing shaft motor 14 swings a swing arm 110 for holding the top ring 31A. The arm torque detection section 26 detects arm torque applied to the swing arm 110. An end point detection section 28 detects a polishing end point indicating an end of polishing based on the detected arm torque.

10. 发明申请

US20200269381A1 POLISHING APPARATUS 审中-公开
公开(公告)号：US20200269381A1
公开(公告)日：2020-08-27
申请号：US16872622
申请日：2020-05-12
申请人： EBARA CORPORATION
发明人： Hiroyuki Shinozaki , Yuta Suzuki , Taro Takahashi , Seiji Katsuoka , Masahiro Hatakeyama
IPC分类号： B24B37/013 , B24B49/10 , B24B37/04 , B24B49/16 , B24B37/10 , B24B37/32
摘要： In a scheme in which a top ring is held to an end portion of a swing arm, the present invention improves accuracy of polishing end point detection. A polishing apparatus for polishing between a polishing pad 10 and a semiconductor wafer 16 disposed opposed to the polishing pad 10 includes a polishing table 30A for holding the polishing pad 10 and a top ring 31A for holding the semiconductor wafer 16. A swing shaft motor 14 swings a swing arm 110 for holding the top ring 31A. The arm torque detection section 26 detects arm torque applied to the swing arm 110. An end point detection section 28 detects a polishing end point indicating an end of polishing based on the detected arm torque.

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