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1. 发明申请

US20210111018A1 SUBSTRATE CLEANING APPARATUS AND CLEANING METHOD OF SUBSTRATE 有权
公开(公告)号：US20210111018A1
公开(公告)日：2021-04-15
申请号：US17068114
申请日：2020-10-12
申请人： EBARA CORPORATION
发明人： Fumitoshi OIKAWA , Tomoaki FUJIMOTO , Mitsuru MIYAZAKI , Koichi FUKAYA
IPC分类号： H01L21/02 , B08B3/10 , B08B1/04 , B08B13/00 , B08B7/04
摘要： A substrate cleaning apparatus has: a substrate rotating part that rotates a substrate; an edge cleaning member for cleaning an edge part of the substrate; an edge rotating part that rotates the edge cleaning member around an edge rotary shaft that extends in a direction orthogonal to a substrate rotary shaft; a moving part that moves a position of the edge cleaning member with respect to the edge part of the substrate; and a control part that controls the moving part to move the position of the edge cleaning member with respect to the edge part of the substrate, and causes the edge cleaning member to clean a one-side edge area including a face on one side, a side face area including a side face, and an another-side edge area including a face on another side in the edge part of the substrate.

2. 发明申请

US20190164769A1 SUBSTRATE CLEANING DEVICE AND SUBSTRATE CLEANING METHOD 审中-公开
公开(公告)号：US20190164769A1
公开(公告)日：2019-05-30
申请号：US16313442
申请日：2017-06-26
申请人： EBARA CORPORATION
发明人： Shinji KAJITA , Hisajiro NAKANO , Tomoatsu ISHIBASHI , Koichi FUKAYA , Yasuyuki MOTOSHIMA , Yohei ETO , Fumitoshi OIKAWA
IPC分类号： H01L21/304 , H01L21/02 , H01L21/67 , H01L21/687
摘要： An apparatus for cleaning a substrate has a holding unit 60 that holds a substrate W; a rotated unit 30 connected to the holding unit 60; a rotating unit 35 that is provided on a peripheral outer side of the rotated unit 30 and rotates the rotated unit 30; and a cleaning unit 10, 20 that physically cleans the substrate W held by the holding unit 60.

3. 发明公开

US20240321601A1 CLEANING APPARATUS, SUBSTRATE PROCESSING APPARATUS, AND CLEANING METHOD 审中-公开
公开(公告)号：US20240321601A1
公开(公告)日：2024-09-26
申请号：US18611156
申请日：2024-03-20
申请人： EBARA CORPORATION
发明人： Fumitoshi OIKAWA , Koichi FUKAYA , Hiroki TAKAHASHI , Akira IMAMURA
IPC分类号： H01L21/67 , B08B1/34 , B08B3/02 , B08B3/04 , H01L21/02
CPC分类号： H01L21/67051 , B08B1/34 , B08B3/022 , B08B3/041 , H01L21/02057 , H01L21/67034
摘要： A cleaning apparatus includes: a rotation support section that supports and rotates a substrate; a chemical liquid supply section that supplies a chemical liquid other than an organic solvent to a surface of the substrate; an organic solvent supply section that supplies an organic solvent to a surface of the substrate; and cleaning means that cleans a surface of the substrate supported by the rotation support section using a chemical liquid from the chemical liquid supply section, and then cleans a surface of the substrate using an organic solvent from the organic solvent supply section with the substrate being kept supported by the rotation support section.

4. 发明公开

US20240194498A1 CLEANING APPARATUS AND POLISHING APPARATUS 审中-公开
公开(公告)号：US20240194498A1
公开(公告)日：2024-06-13
申请号：US18444981
申请日：2024-02-19
申请人： EBARA CORPORATION
发明人： Mitsuru MIYAZAKI , Tomoaki FUJIMOTO , Koichi FUKAYA , Fumitoshi OIKAWA , Takuya INOUE
IPC分类号： H01L21/67 , B08B1/32 , B08B3/02 , B24B7/22 , H01L21/687
CPC分类号： H01L21/67051 , B08B1/32 , B08B3/024 , B24B7/228 , H01L21/67046 , H01L21/6719 , H01L21/67219 , H01L21/67253 , H01L21/68764
摘要： A cleaning apparatus includes: a cleaning tank that defines a cleaning space for cleaning a wafer; a wafer rotation mechanism that is arranged inside the cleaning tank and holds and rotates the wafer; a cleaning member that contacts and cleans a surface of the wafer, is rotatable around a central axis extending in a lateral direction, and has a length in an axial direction longer than a radius of the wafer; a swing mechanism that swings the cleaning member around a swing axis located inside the cleaning tank to move the cleaning member from a retracted position outside of the wafer to a cleaning position directly above the wafer; a second cleaning means that cleans the surface of the wafer; and a second swing mechanism that swings the second cleaning means around a second swing axis located inside the cleaning tank to pass directly above a center of the wafer.

5. 发明申请

US20210202273A1 CLEANING APPARATUS AND POLISHING APPARATUS 有权
公开(公告)号：US20210202273A1
公开(公告)日：2021-07-01
申请号：US17128643
申请日：2020-12-21
申请人： EBARA CORPORATION
发明人： Mitsuru MIYAZAKI , Tomoaki FUJIMOTO , Koichi FUKAYA , Fumitoshi OIKAWA , Takuya INOUE
IPC分类号： H01L21/67 , B08B3/02 , B08B1/04 , B08B13/00 , B08B7/04 , B24B7/22 , H01L21/687
摘要： A cleaning apparatus includes: a cleaning tank that defines a cleaning space for cleaning a wafer; a wafer rotation mechanism that is arranged inside the cleaning tank and holds and rotates the wafer; a cleaning member that contacts and cleans a surface of the wafer, is rotatable around a central axis extending in a lateral direction, and has a length in an axial direction longer than a radius of the wafer; a swing mechanism that swings the cleaning member around a swing axis located inside the cleaning tank to move the cleaning member from a retracted position outside of the wafer to a cleaning position directly above the wafer; a second cleaning means that cleans the surface of the wafer; and a second swing mechanism that swings the second cleaning means around a second swing axis located inside the cleaning tank to pass directly above a center of the wafer.

6. 发明公开

US20240075503A1 SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD 审中-公开
公开(公告)号：US20240075503A1
公开(公告)日：2024-03-07
申请号：US18261697
申请日：2021-12-14
申请人： EBARA CORPORATION
发明人： Fumitoshi OIKAWA , Koichi FUKAYA , Mitsuru MIYAZAKI
IPC分类号： B08B1/04 , B08B1/02 , B08B3/04
CPC分类号： B08B1/04 , B08B1/02 , B08B3/041 , H01L21/67046
摘要： A substrate cleaning apparatus includes a substrate rotation supporting section that supports and rotates a substrate; a roll holding section that rotatably holds a first roll cleaning member and a second roll cleaning member each having a length almost equal to a radius of the substrate; a roll rotation drive section that rotates the first roll cleaning member and the second roll cleaning member about respective axes of rotation parallel to a front surface of the substrate; and a roll pressing section that brings the first roll cleaning member and the second roll cleaning member that are rotating into sliding contact with the front surface of the substrate. The first roll cleaning member and the second roll cleaning member are disposed so as to cover different radial parts of the front surface of the substrate.

7. 发明申请

US20150287617A1 METHOD AND APPARATUS FOR CLEANING SUBSTRATE 审中-公开
标题翻译：清洗基板的方法和装置
公开(公告)号：US20150287617A1
公开(公告)日：2015-10-08
申请号：US14747288
申请日：2015-06-23
申请人： EBARA CORPORATION
发明人： Xinming WANG , Fumitoshi OIKAWA , Haruko ONO , Teruaki HOMBO
IPC分类号： H01L21/67 , B08B1/04
CPC分类号： H01L21/67046 , B08B1/04
摘要： A substrate is cleaned by performing a scrubbing process on a surface to be cleaned of the rotating substrate with a roll-shaped cleaning member while holding an outer circumferential surface of the roll-shaped cleaning member in contact with the surface to be cleaned of the substrate across a predetermined contact width. During at least a part of the scrubbing process, the roll-shaped cleaning member is placed at an offset cleaning position where the central axis of the roll-shaped cleaning member is spaced from the central axis of the substrate by a distance which is 0.14 to 0.5 times the contact width. The surface to be cleaned of the substrate is scrubbed with more uniform cleaning intensity while taking into account the cleaning intensity at each position (area) along the radial direction of the surface to be cleaned of the substrate.
摘要翻译：通过在保持辊状清洁部件的外周面与基板的待清洗表面接触的同时用辊状清洁部件在旋转基板的待清洁表面上进行擦洗处理来清洁基板跨越预定的接触宽度。在洗涤过程的至少一部分期间，辊状清洁部件被放置在偏移清洁位置，其中辊状清洁部件的中心轴线与基板的中心轴线间隔开0.14至接触宽度的0.5倍。要清洁基材的表面，在考虑到沿基材待清洁表面的径向的每个位置（区域）处的清洁强度时，以更均匀的清洁强度进行擦洗。

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