专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07765682B2 Apparatus for attaching substrates 有权
标题翻译：用于安装基板的装置
公开(公告)号：US07765682B2
公开(公告)日：2010-08-03
申请号：US11866892
申请日：2007-10-03
申请人： Jae Seok Hwang , Dong Gun Kim
发明人： Jae Seok Hwang , Dong Gun Kim
IPC分类号： B23P19/00 , H01L21/10
CPC分类号： H01L21/67092 , G02F2001/133354 , Y10T29/5313 , Y10T29/53191
摘要： An apparatus for attaching substrates is provided with a buffering member between an upper chamber and a lower chamber. The buffering member reduces a load applied to a lifting device during vacuum exhaustion of a sealing space between the chambers. Therefore, it is possible to reduce a force applied to a lifting screw and a frame supporting a chamber, thereby extending the lifetime of the substrate attaching apparatus and component replacement. Also, it is possible to increase a lower chamber supporting force of a lifting part by coupling the lifting part to an external frame with a fixing device. As the result, the lower chamber is stably fixed and thus it is possible to reduce failures in a substrate attaching process.
摘要翻译：用于安装基板的装置在上室和下室之间设置有缓冲构件。缓冲构件减小了在室之间的密封空间的真空耗尽期间施加到提升装置的负载。因此，可以减小施加在提升螺钉和支撑室的框架上的力，从而延长基板安装装置的寿命和部件更换。此外，通过用提升部件将定位装置连接到外部框架，可以增加提升部件的下室支撑力。结果，下室稳定地固定，因此可以减少基板附着过程中的故障。

2. 发明申请

US20080124199A1 APPARATUS FOR ATTACHING SUBSTRATES 有权
标题翻译：用于连接基板的装置
公开(公告)号：US20080124199A1
公开(公告)日：2008-05-29
申请号：US11866892
申请日：2007-10-03
申请人： Jae Seok Hwang , Dong Gun Kim
发明人： Jae Seok Hwang , Dong Gun Kim
IPC分类号： H01L21/67
CPC分类号： H01L21/67092 , G02F2001/133354 , Y10T29/5313 , Y10T29/53191
摘要： An apparatus for attaching substrates is provided with a buffering member between an upper chamber and a lower chamber. The buffering member reduces a load applied to a lifting device during vacuum exhaustion of a sealing space between the chambers. Therefore, it is possible to reduce a force applied to a lifting screw and a frame supporting a chamber, thereby extending the lifetime of the substrate attaching apparatus and component replacement. Also, it is possible to increase a lower chamber supporting force of a lifting part by coupling the lifting part to an external frame with a fixing device. As the result, the lower chamber is stably fixed and thus it is possible to reduce failures in a substrate attaching process.
摘要翻译：用于安装基板的装置在上室和下室之间设置有缓冲构件。缓冲构件减小了在室之间的密封空间的真空耗尽期间施加到提升装置的负载。因此，可以减小施加在提升螺钉和支撑室的框架上的力，从而延长基板安装装置的寿命和部件更换。此外，通过用提升部件将定位装置连接到外部框架，可以增加提升部件的下室支撑力。结果，下室稳定地固定，因此可以减少基板附着过程中的故障。

3. 发明授权

US07640960B2 Apparatus for attaching substrates 失效
标题翻译：用于安装基板的装置
公开(公告)号：US07640960B2
公开(公告)日：2010-01-05
申请号：US11866843
申请日：2007-10-03
申请人： Dong Gun Kim , Jae Seok Hwang
发明人： Dong Gun Kim , Jae Seok Hwang
IPC分类号： B29C65/00 , B32B37/00 , B31F5/00 , B65H29/00 , G02F1/13
CPC分类号： H01L21/67092 , G02F2001/133354 , Y10T156/1744
摘要： An apparatus for attaching two substrates to one another includes a lower chamber that holds a first substrate and an upper chamber that holds a second substrate. The upper and lower chambers are brought together to provide a space in which an attaching process is performed. Chamber transportation mechanisms are located at corners of the lower chamber and serve to move the lower chamber up toward the upper chamber so that it can be coupled with the upper chamber. Guide parts are also formed on side surfaces of the lower chamber to guide movement, and to reduce deformation of the chamber when pressure differentials act to deform the sides of the chamber.
摘要翻译：用于将两个基板彼此附接的装置包括保持第一基板的下室和保持第二基板的上室。将上腔室和下室置于一起以提供进行附着过程的空间。腔室运输机构位于下腔室的角落处，用于将下腔室向上移动以使其能够与上腔室联接。引导部件还形成在下腔室的侧表面上以引导运动，并且当压差作用使腔的侧面变形时，减小腔室的变形。

4. 发明申请

US20080124198A1 APPARATUS FOR ATTACHING SUBSTRATES 失效
标题翻译：用于连接基板的装置
公开(公告)号：US20080124198A1
公开(公告)日：2008-05-29
申请号：US11866843
申请日：2007-10-03
申请人： Dong Gun KIM , Jae Seok Hwang
发明人： Dong Gun KIM , Jae Seok Hwang
IPC分类号： H01L21/67
CPC分类号： H01L21/67092 , G02F2001/133354 , Y10T156/1744
摘要： An apparatus for attaching two substrates to one another includes a lower chamber that holds a first substrate and an upper chamber that holds a second substrate. The upper and lower chambers are brought together to provide a space in which an attaching process is performed. Chamber transportation mechanisms are located at corners of the lower chamber and serve to move the lower chamber up toward the upper chamber so that it can be coupled with the upper chamber. Guide parts are also formed on side surfaces of the lower chamber to guide movement, and to reduce deformation of the chamber when pressure differentials act to deform the sides of the chamber.
摘要翻译：用于将两个基板彼此附接的装置包括保持第一基板的下室和保持第二基板的上室。将上腔室和下室置于一起以提供进行附着过程的空间。腔室运输机构位于下腔室的角落处，用于将下腔室向上移动以使其能够与上腔室联接。引导部件还形成在下腔室的侧表面上以引导运动，并且当压差作用使腔的侧面变形时，减小腔室的变形。

5. 发明授权

US08072573B2 Apparatus and method for attaching substrates 有权
标题翻译：用于安装基板的装置和方法
公开(公告)号：US08072573B2
公开(公告)日：2011-12-06
申请号：US12957780
申请日：2010-12-01
申请人： Jae Seok Hwang , Kyung Mi Kim
发明人： Jae Seok Hwang , Kyung Mi Kim
IPC分类号： G02F1/1339 , B23K37/00
CPC分类号： G02F1/1333 , G02F1/1303 , G02F2001/133354
摘要： An apparatus for attaching substrates includes an upper chamber for holding an upper substrate and a lower chamber for holding a lower substrate which is to be attached to the upper substrate. The lower chamber is moved up and down so as to come together with the upper chamber to form a sealed attaching space. A substrate receiving part is fixed to a frame of the apparatus so that it does not move as the lower chamber is raised and lowered. The substrate receiving part alternatively projects from the lower chamber is the lower chamber is moved down, or is recessed into the top of the lower chamber when the lower chamber is lifted up.
摘要翻译：用于安装基板的装置包括用于保持上基板的上室和用于保持要附接到上基板的下基板的下室。下腔上下移动，与上腔一起形成密封的安装空间。衬底接收部分固定到设备的框架上，使得其在下室升高和降低时不移动。当下室被提升时，基底接收部分从下腔室交替地突出，下腔室向下移动，或者凹入下腔室的顶部。

6. 发明授权

US08245751B2 Substrate bonding apparatus 失效
标题翻译：基板接合装置
公开(公告)号：US08245751B2
公开(公告)日：2012-08-21
申请号：US12260529
申请日：2008-10-29
申请人： Jae Seok Hwang
发明人： Jae Seok Hwang
IPC分类号： B32B37/10
CPC分类号： B32B37/1018 , B32B37/0046 , B32B2457/20 , G02F1/1303 , G02F1/1339 , Y10T156/1126 , Y10T156/15 , Y10T156/17 , Y10T156/1928
摘要： A substrate bonding apparatus and method are provided. The substrate bonding apparatus may include a board having a receiving surface opposite to a substrate fixed at one side thereof, a plurality of chucking members located between the receiving surface of the board and the substrate, and a substrate separation device to separate the substrate from the chucking members. The substrate separation device includes a pusher for pushing the substrate to separate the substrate from the chucking members, and a base plate installed at the receiving surface of the board, the base plate having an installation space to install the pusher formed therein. The pusher protrudes out of the base plate through an inlet and outlet port located at one end of the installation space to pressurize the substrate.
摘要翻译：提供了一种基板接合装置和方法。基板接合装置可以包括具有与固定在其一侧的基板相对的接收表面的板，位于板的接收表面和基板之间的多个夹紧构件，以及将基板与基板分离的基板分离装置夹紧构件。基板分离装置包括用于推动基板以将基板与夹紧构件分离的推动器以及安装在基板的接收表面上的基板，该基板具有安装在其中的推动器的安装空间。推动器通过位于安装空间一端的入口和出口突出出基板，以对基板加压。

7. 发明授权

US07864289B2 Apparatus and method for attaching substrates 有权
公开(公告)号：US07864289B2
公开(公告)日：2011-01-04
申请号：US11866877
申请日：2007-10-03
申请人： Jae Seok Hwang , Kyung Mi Kim
发明人： Jae Seok Hwang , Kyung Mi Kim
IPC分类号： G02F1/1339 , B23K37/00
CPC分类号： G02F1/1333 , G02F1/1303 , G02F2001/133354
摘要： An apparatus for attaching substrates includes an upper chamber for holding an upper substrate and a lower chamber for holding a lower substrate which is to be attached to the upper substrate. The lower chamber is moved up and down so as to come together with the upper chamber to form a sealed attaching space. A substrate receiving part is fixed to a frame of the apparatus so that it does not move as the lower chamber is raised and lowered. The substrate receiving part alternatively projects from the lower chamber is the lower chamber is moved down, or is recessed into the top of the lower chamber when the lower chamber is lifted up.

8. 发明申请

US20090114348A1 SUBSTRATE BONDING APPARATUS 失效
标题翻译：基板连接装置
公开(公告)号：US20090114348A1
公开(公告)日：2009-05-07
申请号：US12260529
申请日：2008-10-29
申请人： Jae Seok Hwang
发明人： Jae Seok Hwang
IPC分类号： B32B37/10
CPC分类号： B32B37/1018 , B32B37/0046 , B32B2457/20 , G02F1/1303 , G02F1/1339 , Y10T156/1126 , Y10T156/15 , Y10T156/17 , Y10T156/1928
摘要： A substrate bonding apparatus and method are provided. The substrate bonding apparatus may include a board having a receiving surface opposite to a substrate fixed at one side thereof, a plurality of chucking members located between the receiving surface of the board and the substrate, and a substrate separation device to separate the substrate from the chucking members. The substrate separation device includes a pusher for pushing the substrate to separate the substrate from the chucking members, and a base plate installed at the receiving surface of the board, the base plate having an installation space to install the pusher formed therein. The pusher protrudes out of the base plate through an inlet and outlet port located at one end of the installation space to pressurize the substrate.
摘要翻译：提供了一种基板接合装置和方法。基板接合装置可以包括具有与固定在其一侧的基板相对的接收表面的板，位于板的接收表面和基板之间的多个夹紧构件，以及将基板与基板分离的基板分离装置夹紧构件。基板分离装置包括用于推动基板以将基板与夹紧构件分离的推动器，以及安装在基板的接收表面处的基板，该基板具有用于安装其中形成的推动器的安装空间。推动器通过位于安装空间一端的入口和出口突出出基板，以对基板加压。

9. 发明授权

US08363377B2 Electrostatic chuck and apparatus having the same 失效
标题翻译：静电吸盘及其装置
公开(公告)号：US08363377B2
公开(公告)日：2013-01-29
申请号：US12255926
申请日：2008-10-22
申请人： Jae Seok Hwang
发明人： Jae Seok Hwang
IPC分类号： H01L21/683 , H01T23/00
CPC分类号： H01L21/6831 , H01L21/67092
摘要： An electrostatic chuck and an apparatus having the electrostatic chuck are provided. The electrostatic chuck may attract a substrate during a substrate assembling process for manufacturing a flat display panel. An elastic layer made of an elastic material may be provided in a base part of the electrostatic chuck, thus preventing non-uniform stress from being distributed on the substrate due to external force, therefore maintaining the flatness of the substrate and improving the quality of assembled substrates. The electrostatic chuck may include an electrostatic force generating part provided on an upper surface of the base part, the force generating part including an insulating layer, an electrode layer, a dielectric layer. The base part may be provided with the elastic layer made of the elastic material having elastic restoring force.
摘要翻译：提供一种静电卡盘和具有静电卡盘的装置。在用于制造平面显示面板的基板组装过程中，静电卡盘可以吸引基板。由弹性材料制成的弹性层可以设置在静电卡盘的基部中，从而防止由于外力而在基板上分布不均匀的应力，从而保持基板的平坦度并提高组装的质量底物。静电卡盘可以包括设置在基部的上表面上的静电力产生部分，力产生部分包括绝缘层，电极层，电介质层。基部可以设置有具有弹性恢复力的由弹性材料制成的弹性层。

10. 发明授权

US07980287B2 Adhesive chuck and substrate bonding apparatus 有权
标题翻译：胶粘剂卡盘和基材粘合装置
公开(公告)号：US07980287B2
公开(公告)日：2011-07-19
申请号：US12132100
申请日：2008-06-03
申请人： Jae Seok Hwang
发明人： Jae Seok Hwang
IPC分类号： B29C65/48 , B32B37/26 , B32B38/18
CPC分类号： B32B37/0046 , B32B37/12 , B32B38/18 , B32B38/1833 , B32B38/1858 , B32B2038/1891 , B32B2309/68 , B32B2457/202 , G02F1/1303 , G02F2001/133354 , G02F2202/28 , Y10T156/17 , Y10T156/1702 , Y10T156/1744 , Y10T156/19
摘要： A substrate bonding apparatus includes a first chamber including a first surface plate on which a first substrate is supported, a second chamber spaced from the first chamber and including a second surface plate on which a second substrate to be bonded to the first substrate is supported, an adhesive module provided on the first surface plate and including a plurality of adhesive rubber areas holding the first substrate, and a lift module for lifting at least one of the plurality of adhesive rubber areas.
摘要翻译：基板接合装置包括：第一室，其包括第一表面板，第一基板被支撑在第一表面板上;第二室，与第一室间隔开，并且包括第二表面板，第二基板被接合到第一基板上，设置在所述第一表面板上并且包括保持所述第一基板的多个粘合橡胶区域的粘合剂模块和用于提升所述多个粘合橡胶区域中的至少一个的提升模块。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式