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    • 1. 发明授权
    • Planarization of metal layers on a semiconductor wafer through non-contact de-plating and control with endpoint detection
    • 通过非接触式去镀层和端点检测来控制半导体晶片上的金属层的平面化
    • US06720263B2
    • 2004-04-13
    • US09981505
    • 2001-10-16
    • Donald J. K. OlgadoJoseph J. StevensAlexander Lerner
    • Donald J. K. OlgadoJoseph J. StevensAlexander Lerner
    • H01L21302
    • H01L21/32115C25F7/00H01L21/32134H01L21/6708H01L21/7684
    • A non-contact apparatus and method for removing a metal layer from a substrate are provided. The apparatus includes a rotatable anode substrate support member configured to support a substrate in a face-up position and to electrically contact the substrate positioned thereon. A pivotally mounted cathode fluid dispensing nozzle assembly positioned above the anode substrate support member is also provided. A power supply in electrical communication with the anode substrate support member and the cathode fluid dispensing nozzle is provided, and a system controller configured to regulate at least one of a rate of rotation of the anode substrate support member, a radial position of the cathode fluid dispensing nozzle, and an output power of the power supply is provided. The method provides for the removal of a metal layer from a substrate by rotating the substrate in a face up position on a rotatable substrate support member. A cathode fluid dispensing nozzle is positioned over a central portion of the substrate and a metal removing solution is dispensed from the cathode fluid dispensing nozzle onto the central portion of the substrate. An electrical bias is applied between the substrate and the cathode fluid dispensing nozzle, which operates to deplate the metal layer below the fluid dispensing nozzle.
    • 提供了一种用于从基板去除金属层的非接触式设备和方法。 该装置包括可旋转的阳极基板支撑构件,其构造成将基板支撑在面朝上的位置并且电接触定位在其上的基板。 还提供了一种位于阳极基板支撑构件上方的枢转安装的阴极流体分配喷嘴组件。 提供与阳极基板支撑构件和阴极流体分配喷嘴电连通的电源,以及系统控制器,被配置为调节阳极基板支撑构件的旋转速率,阴极流体的径向位置 分配喷嘴,并且提供电源的输出功率。 该方法通过在可旋转的基板支撑构件上面向上的位置旋转基板来提供从基板移除金属层。 阴极流体分配喷嘴位于衬底的中心部分上方,金属去除溶液从阴极流体分配喷嘴分配到衬底的中心部分上。 在衬底和阴极流体分配喷嘴之间施加电偏压,其用于使流体分配喷嘴下方的金属层脱落。
    • 5. 发明授权
    • Rapid thermal processing lamphead with improved cooling
    • 快速热处理灯头具有改进的冷却
    • US08294068B2
    • 2012-10-23
    • US12207711
    • 2008-09-10
    • Joseph M. RanishKhurshed SorabjiKedarnath SangamAlexander Lerner
    • Joseph M. RanishKhurshed SorabjiKedarnath SangamAlexander Lerner
    • A21B1/22F26B19/00
    • F27B17/0025F27D5/0037F27D21/0014H01L21/67109H01L21/67115
    • Embodiments of a lamphead and apparatus utilizing same are provided herein. In some embodiments, a lamphead for use in thermal processing may include a monolithic member having a plurality of coolant passages and a plurality of lamp passages and reflector cavities, wherein each lamp passage is configured to accommodate a lamp and each reflector cavity is shaped to act as a reflector or to receive a replaceable reflector for the lamp, and wherein the plurality of coolant passages are disposed proximate to the plurality of lamp passages; and at least one heat transfer member extending from the monolithic member into each coolant passage. In some embodiments, the lamphead may be disposed in an apparatus comprising a process chamber having a substrate support, wherein the lamphead is positioned to provide energy to the substrate support.
    • 本发明提供了一种灯头及其使用装置的实施例。 在一些实施例中,用于热处理的灯头可以包括具有多个冷却剂通道和多个灯通道和反射器腔的整体构件,其中每个灯通道被配置成容纳灯,并且每个反射器空腔成形为能够起作用 作为反射器或接收用于灯的可更换反射器,并且其中所述多个冷却剂通道设置成靠近所述多个灯通道; 以及至少一个传热构件,其从所述整体构件延伸到每个冷却剂通道中。 在一些实施例中,灯头可以设置在包括具有基板支撑件的处理室的设备中,其中灯头被定位成向基板支撑件提供能量。