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1. 发明申请

US20080209723A1 FEEDTHROUGH FOR ELECTRICAL CONNECTORS 有权
标题翻译：电气连接器
公开(公告)号：US20080209723A1
公开(公告)日：2008-09-04
申请号：US12025180
申请日：2008-02-04
申请人： Derek Ian Darley , Desmond McCusker , Dusan Milojevic , John L. Parker
发明人： Derek Ian Darley , Desmond McCusker , Dusan Milojevic , John L. Parker
IPC分类号： H01R43/00 , A61N1/00
CPC分类号： A61N1/0541 , A61N1/05 , H01R13/5224 , H01R43/24 , H01R2201/12 , Y10S439/909 , Y10T29/49002 , Y10T29/49073 , Y10T29/49117 , Y10T29/49169 , Y10T29/49174 , Y10T29/49204 , Y10T29/4922 , Y10T29/5149
摘要： A method (10) of forming an electrically conducting feedthrough. The method (10) comprises a first step (11) of forming an electrically conductive structure (21) comprising a sacrificial component and a non-sacrificial component. At least a portion of the non-sacrificial component can then be coated with a relatively electrically insulating material (35) prior to removal of at least a portion of the sacrificial component from the electrically conductive structure. The structure of the feedthrough provides electrical connection through the wall of a housing of an implantable component while preventing unwanted transfer of materials between the interior of the component and the surrounding environment.
摘要翻译：一种形成导电馈通的方法（10）。方法（10）包括形成包括牺牲部件和非牺牲部件的导电结构（21）的第一步骤（11）。在从导电结构去除至少一部分牺牲部件之前，非牺牲部件的至少一部分可以被相对电绝缘的材料（35）涂覆。馈通的结构提供通过可植入组件的壳体的壁的电连接，同时防止材料在组件的内部与周围环境之间的不期望的转移。

2. 发明申请

US20110300764A1 FEEDTHROUGH FOR ELECTRICAL CONNECTORS 有权
标题翻译：电气连接器
公开(公告)号：US20110300764A1
公开(公告)日：2011-12-08
申请号：US13196207
申请日：2011-08-02
申请人： Derek Ian Darley , Desmond McCusker , Dusan Milojevic , John L. Parker
发明人： Derek Ian Darley , Desmond McCusker , Dusan Milojevic , John L. Parker
IPC分类号： H01R13/02
CPC分类号： A61N1/0541 , A61N1/05 , H01R13/5224 , H01R43/24 , H01R2201/12 , Y10S439/909 , Y10T29/49002 , Y10T29/49073 , Y10T29/49117 , Y10T29/49169 , Y10T29/49174 , Y10T29/49204 , Y10T29/4922 , Y10T29/5149
摘要： A method (10) of forming an electrically conducting feedthrough. The method (10) comprises a first step (11) of forming an electrically conductive structure (21) comprising a sacrificial component and a non-sacrificial component. At least a portion of the non-sacrificial component can then be coated with a relatively electrically insulating material (35) prior to removal of at least a portion of the sacrificial component from the electrically conductive structure. The structure of the feedthrough provides electrical connection through the wall of a housing of an implantable component while preventing unwanted transfer of materials between the interior of the component and the surrounding environment.
摘要翻译：一种形成导电馈通的方法（10）。方法（10）包括形成包括牺牲部件和非牺牲部件的导电结构（21）的第一步骤（11）。在从导电结构去除至少一部分牺牲部件之前，非牺牲部件的至少一部分可以被相对电绝缘的材料（35）涂覆。馈通的结构提供通过可植入组件的壳体的壁的电连接，同时防止材料在组件的内部与周围环境之间的不期望的转移。

3. 发明授权

US08277227B2 Feedthrough for electrical connectors 有权
标题翻译：电连接器馈通
公开(公告)号：US08277227B2
公开(公告)日：2012-10-02
申请号：US13196207
申请日：2011-08-02
申请人： Derek Ian Darley , Desmond A. Mccusker , Dusan Milojevic , John L. Parker
发明人： Derek Ian Darley , Desmond A. Mccusker , Dusan Milojevic , John L. Parker
IPC分类号： H01R12/00
CPC分类号： A61N1/0541 , A61N1/05 , H01R13/5224 , H01R43/24 , H01R2201/12 , Y10S439/909 , Y10T29/49002 , Y10T29/49073 , Y10T29/49117 , Y10T29/49169 , Y10T29/49174 , Y10T29/49204 , Y10T29/4922 , Y10T29/5149
摘要： A method (10) of forming an electrically conducting feedthrough. The method (10) comprises a first step (11) of forming an electrically conductive structure (21) comprising a sacrificial component and a non-sacrificial component. At least a portion of the non-sacrificial component can then be coated with a relatively electrically insulating material (35) prior to removal of at least a portion of the sacrificial component from the electrically conductive structure. The structure of the feedthrough provides electrical connection through the wall of a housing of an implantable component while preventing unwanted transfer of materials between the interior of the component and the surrounding environment.
摘要翻译：一种形成导电馈通的方法（10）。方法（10）包括形成包括牺牲部件和非牺牲部件的导电结构（21）的第一步骤（11）。在从导电结构去除至少一部分牺牲部件之前，非牺牲部件的至少一部分可以被相对电绝缘的材料（35）涂覆。馈通的结构提供通过可植入组件的壳体的壁的电连接，同时防止材料在组件的内部与周围环境之间的不期望的转移。

4. 发明申请

US20100287770A1 MANUFACTURING AN ELECTRODE CARRIER FOR AN IMPLANTABLE MEDICAL DEVICE 审中-公开
标题翻译：制造用于可植入医疗装置的电极载体
公开(公告)号：US20100287770A1
公开(公告)日：2010-11-18
申请号：US12466254
申请日：2009-05-14
申请人： Fysh Dadd , Derek Ian Darley , Dusan Milojevic , Peter Gibson , John L. Parker , Claudiu Treaba , Miroslaw Mackiewicz
发明人： Fysh Dadd , Derek Ian Darley , Dusan Milojevic , Peter Gibson , John L. Parker , Claudiu Treaba , Miroslaw Mackiewicz
IPC分类号： H01R43/00
CPC分类号： A61N1/0541 , A61B2562/125 , Y10T29/4921
摘要： According to one aspect of the present invention, there is provided a method for manufacturing an electrode carrier comprising one or more electrode contacts of an implantable medical device, comprising: coupling at least one electrode to a base plate, securing the base plate in a mold, injecting the mold with injection material at least partially around the at least one electrode coupled to the base plate, curing the injected material, and decoupling the at least one electrode from the base plate such that the cured injection material is separated from the base plate.
摘要翻译：根据本发明的一个方面，提供了一种用于制造电极载体的方法，该电极载体包括可植入医疗装置的一个或多个电极触点，包括：将至少一个电极耦合到基板，将基板固定在模具至少部分地围绕耦合到所述基板的所述至少一个电极注入注射材料，固化所注入的材料，以及使所述至少一个电极与所述基板分离，使得所述固化的注入材料与所述基板分离。

5. 发明申请

US20080208289A1 FEEDTHROUGH FOR ELECTRICAL CONNECTORS 有权
公开(公告)号：US20080208289A1
公开(公告)日：2008-08-28
申请号：US12025145
申请日：2008-02-04
申请人： Derek Ian Darley , Desmond A. Mccusker , Dusan Milojevic , John Parker
发明人： Derek Ian Darley , Desmond A. Mccusker , Dusan Milojevic , John Parker
IPC分类号： A61N1/00 , H01R3/00
CPC分类号： A61N1/0541 , A61N1/05 , H01R13/5224 , H01R43/24 , H01R2201/12 , Y10S439/909 , Y10T29/49002 , Y10T29/49073 , Y10T29/49117 , Y10T29/49169 , Y10T29/49174 , Y10T29/49204 , Y10T29/4922 , Y10T29/5149
摘要： A method (10) of forming an electrically conducting feedthrough. The method (10) comprises a first step (11) of forming an electrically conductive structure (21) comprising a sacrificial component and a non-sacrificial component. At least a portion of the non-sacrificial component can then be coated with a relatively electrically insulating material (35) prior to removal of at least a portion of the sacrificial component from the electrically conductive structure. The structure of the feedthrough provides electrical connection through the wall of a housing of an implantable component while preventing unwanted transfer of materials between the interior of the component and the surrounding environment.

6. 发明授权

US07396265B2 Feedthrough for electrical connectors 有权
标题翻译：电连接器馈通
公开(公告)号：US07396265B2
公开(公告)日：2008-07-08
申请号：US10529063
申请日：2003-09-30
申请人： Derek Ian Darley , Desmond Andrew McCusker , Dusan Milojevic , John Parker
发明人： Derek Ian Darley , Desmond Andrew McCusker , Dusan Milojevic , John Parker
IPC分类号： H01R13/02
CPC分类号： A61N1/0541 , A61N1/05 , H01R13/5224 , H01R43/24 , H01R2201/12 , Y10S439/909 , Y10T29/49002 , Y10T29/49073 , Y10T29/49117 , Y10T29/49169 , Y10T29/49174 , Y10T29/49204 , Y10T29/4922 , Y10T29/5149
摘要： A method (10) of forming an electrically conducting feedthrough. The method (10) comprises a first step (11) of forming an electrically conductive structure (21) comprising a sacrificial component and a non-sacrificial component. At least a portion of the non-sacrificial component can then be coated with a relatively electrically insulating material (35) prior to removal of at least a portion of the sacrificial component from the electrically conductive structure. The structure of the feedthrough provides electrical connection through the wall of a housing of an implantable component while preventing unwanted transfer of materials between the interior of the component and the surrounding environment.
摘要翻译：一种形成导电馈通的方法（10）。方法（10）包括形成包括牺牲部件和非牺牲部件的导电结构（21）的第一步骤（11）。在从导电结构去除至少一部分牺牲部件之前，非牺牲部件的至少一部分可以被相对电绝缘的材料（35）涂覆。馈通的结构提供通过可植入组件的壳体的壁的电连接，同时防止材料在组件的内部与周围环境之间的不期望的转移。

7. 发明授权

US07996982B2 Method of making feedthroughs for electrical connectors 有权
标题翻译：电连接器馈通方法
公开(公告)号：US07996982B2
公开(公告)日：2011-08-16
申请号：US12025180
申请日：2008-02-04
申请人： Derek Ian Darley , Desmond A. Mccusker , Dusan Milojevic , John Parker
发明人： Derek Ian Darley , Desmond A. Mccusker , Dusan Milojevic , John Parker
IPC分类号： H01G4/00
CPC分类号： A61N1/0541 , A61N1/05 , H01R13/5224 , H01R43/24 , H01R2201/12 , Y10S439/909 , Y10T29/49002 , Y10T29/49073 , Y10T29/49117 , Y10T29/49169 , Y10T29/49174 , Y10T29/49204 , Y10T29/4922 , Y10T29/5149
摘要： A method (10) of forming an electrically conducting feedthrough. The method (10) comprises a first step (11) of forming an electrically conductive structure (21) comprising a sacrificial component and a non-sacrificial component. At least a portion of the non-sacrificial component can then be coated with a relatively electrically insulating material (35) prior to removal of at least a portion of the sacrificial component from the electrically conductive structure. The structure of the feedthrough provides electrical connection through the wall of a housing of an implantable component while preventing unwanted transfer of materials between the interior of the component and the surrounding environment.
摘要翻译：一种形成导电馈通的方法（10）。方法（10）包括形成包括牺牲部件和非牺牲部件的导电结构（21）的第一步骤（11）。在从导电结构去除至少一部分牺牲部件之前，非牺牲部件的至少一部分可以被相对电绝缘的材料（35）涂覆。馈通的结构提供通过可植入组件的壳体的壁的电连接，同时防止材料在组件的内部与周围环境之间的不期望的转移。

8. 发明授权

US07988507B2 Feedthrough for electrical connectors 有权
标题翻译：电连接器馈通
公开(公告)号：US07988507B2
公开(公告)日：2011-08-02
申请号：US12025145
申请日：2008-02-04
申请人： Derek Ian Darley , Desmond A. McCusker , Dusan Milojevicrg , John L. Parker
发明人： Derek Ian Darley , Desmond A. McCusker , Dusan Milojevicrg , John L. Parker
IPC分类号： H01R9/22
CPC分类号： A61N1/0541 , A61N1/05 , H01R13/5224 , H01R43/24 , H01R2201/12 , Y10S439/909 , Y10T29/49002 , Y10T29/49073 , Y10T29/49117 , Y10T29/49169 , Y10T29/49174 , Y10T29/49204 , Y10T29/4922 , Y10T29/5149
摘要： A method (10) of forming an electrically conducting feedthrough. The method (10) comprises a first step (11) of forming an electrically conductive structure (21) comprising a sacrificial component and a non-sacrificial component. At least a portion of the non-sacrificial component can then be coated with a relatively electrically insulating material (35) prior to removal of at least a portion of the sacrificial component from the electrically conductive structure. The structure of the feedthrough provides electrical connection through the wall of a housing of an implantable component while preventing unwanted transfer of materials between the interior of the component and the surrounding environment.
摘要翻译：一种形成导电馈通的方法（10）。方法（10）包括形成包括牺牲部件和非牺牲部件的导电结构（21）的第一步骤（11）。在从导电结构去除至少一部分牺牲部件之前，非牺牲部件的至少一部分可以被相对电绝缘的材料（35）涂覆。馈通的结构提供通过可植入组件的壳体的壁的电连接，同时防止材料在组件的内部与周围环境之间的不期望的转移。

9. 发明授权

US07269461B2 Double stylet insertion tool for a cochlear implant electrode array 有权
标题翻译：用于耳蜗植入电极阵列的双探针插入工具
公开(公告)号：US07269461B2
公开(公告)日：2007-09-11
申请号：US10070102
申请日：2001-09-28
申请人： Fysh Dadd , Derek Ian Darley , Peter Gibson , John L. Parker , Claudiu Treaba
发明人： Fysh Dadd , Derek Ian Darley , Peter Gibson , John L. Parker , Claudiu Treaba
IPC分类号： A61N1/05
CPC分类号： A61N1/0541 , A61F11/004
摘要： A cochlear implant electrode assembly device (10) comprising an elongate electrode carrier member (11), a first stiffening element (15a), and a second stiffening element (15b). The carrier member (11) is made of a resiliently flexible first material and has a plurality of electrodes (12) mounted thereon. The carrier member (11) has a first configuration selected to allow it to be inserted into an implantee's cochlea (30), a second configuration wherein it is curved in shape to match a surface of the cochlea (30), and at least one intermediate configuration between the first and second configurations. Both the first and second stiffening elements (15a, 15b) are made of a material relatively stiffer than said the material and in combination bias the elongate member into the first configuration. If either the first stiffening element (15a) or the second stiffening element (15b) are removed, the elongate member (11) adopts the at least one intermediate configuration.
摘要翻译：一种包括细长电极载体构件（11），第一加强元件（15A）和第二加强元件（15b）的耳蜗植入电极组件装置（10）。载体构件（11）由弹性柔性的第一材料制成并且具有安装在其上的多个电极（12）。载体构件（11）具有被选择为允许其插入到植入物的耳蜗（30）中的第一构型，第二构造，其弯曲形状以匹配耳蜗（30）的表面，并且至少一个中间体配置在第一和第二配置之间。第一和第二加强元件（15a，15b）都由比所述材料相对更硬的材料制成并且将细长构件组合地偏压到第一构造中。如果去除第一加强元件（15a）或第二加强元件（15b），细长构件（11）采用至少一个中间构造。

10. 发明授权

US06421569B1 Cochlear implant electrode array 有权
标题翻译：人工耳蜗植入电极阵列
公开(公告)号：US06421569B1
公开(公告)日：2002-07-16
申请号：US09454976
申请日：1999-12-03
申请人： Claudiu-Gheorghe Treaba , Fysh Dadd , Derek Ian Darley , John L. Parker
发明人： Claudiu-Gheorghe Treaba , Fysh Dadd , Derek Ian Darley , John L. Parker
IPC分类号： A61N105
CPC分类号： A61N1/0541 , A61F11/004
摘要： An electrode array for a cochlear implant is formed with a carrier made, for example from silicone, is preshaped and is formed with a lumen. The array is shaped to assume a first. The array can be straightened, and held in a straight configuration by inserting a stylet into the lumen. The array relaxes to a shape matching the curvature of the cochlea when the lumen is removed. The electrodes of the array are disposed on one side of the array to face the modiolus when the array is inserted into the cochlea.
摘要翻译：用于耳蜗植入物的电极阵列形成有由例如硅树脂制成的载体被预成形并且形成有内腔。阵列成形为假定第一。通过将管心针插入内腔，可以将阵列矫直并保持在直的构型。当去除管腔时，阵列放松到与耳蜗的曲率匹配的形状。当阵列插入耳蜗时，阵列的电极设置在阵列的一侧以面对模棱两可。

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