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1. 发明授权

US4708429A Optical fiber assembly and optically coupled device package including same 失效
标题翻译：光纤组件和包括其的光耦合器件封装
公开(公告)号：US4708429A
公开(公告)日：1987-11-24
申请号：US780311
申请日：1985-09-26
申请人： David W. Clark , Morton Freedman
发明人： David W. Clark , Morton Freedman
IPC分类号： G02B6/42 , G02B6/44 , G02B7/26
CPC分类号： G02B6/4202 , G02B6/4248 , G02B6/4428
摘要： An optically-coupled device package including a housing containing an optical device further includes an optical fiber assembly which comprises an optical cable with a support sleeve on its end. The support sleeve comprises a body with an axial opening therethrough and has a plurality of holes near a first end. The optical cable includes a first portion comprising a protective coating overlying an optical fiber, and a second portion comprising an optical fiber extending from said coating. The cable enters the first end of the sleeve and nodules integral with the protective coating extend into the plurality of holes. In one embodiment, the optical fiber is sealed to the inside of the sleeve through a solder window provided through the side of the sleeve. The second end of the sleeve extends through an aperture in said housing and is aligned to the device therein. The invention also includes a method for making such a fiber assembly which comprises inserting the optical cable into a first end of the sleeve, forming nodules integral with the protective coating which extend into the plurality of holes. The method may comprise sealing the optical fiber to the inside of the sleeve through a solder window in said sleeve. Fabrication of an optically-coupled device package further comprises inserting the fiber assembly through an aperture in said housing and aligning said fiber with the optical device therein.
摘要翻译：包括包含光学装置的外壳的光耦合器件封装还包括光纤组件，其包括在其端部具有支撑套筒的光缆。支撑套筒包括具有穿过其中的轴向开口的主体，并且在第一端附近具有多个孔。光缆包括第一部分，其包括覆盖在光纤上的保护涂层，第二部分包括从所述涂层延伸的光纤。电缆进入套筒的第一端，与保护涂层成一体的结节延伸到多个孔中。在一个实施例中，光纤通过穿过套筒一侧提供的焊接窗口密封到套筒的内部。套筒的第二端延伸穿过所述壳体中的孔并且与其中的装置对准。本发明还包括制造这种纤维组件的方法，该方法包括将光缆插入到套筒的第一端中，形成与延伸到多个孔中的保护涂层一体的结节。该方法可以包括通过所述套筒中的焊接窗将光纤密封到套筒的内部。光学耦合器件封装的制造还包括将光纤组件穿过所述壳体中的孔并将所述光纤与其中的光学器件对准。

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