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1. 发明申请

US20150277491A1 MAGNETIC ATTACHMENT MECHANISM FOR AN ELECTRONIC DEVICE 有权
标题翻译：用于电子设备的磁性附着机构
公开(公告)号：US20150277491A1
公开(公告)日：2015-10-01
申请号：US14229386
申请日：2014-03-28
申请人： David W. Browning , Jeremy Burr , Russell S. Aoki
发明人： David W. Browning , Jeremy Burr , Russell S. Aoki
IPC分类号： G06F1/16
CPC分类号： G06F1/1632 , G06F1/1654 , G06F1/1679 , H01R13/6205
摘要： Particular embodiments described herein provide for an electronic device, such as a notebook computer, laptop, or tablet that includes a circuit board coupled to a plurality of electronic components (which may include any type of components, elements, circuitry, etc.). One particular example implementation of a docking base comprises a base housing including at least one alignment pin disposed within the base housing. Each of the at least one alignment pin is configured to engage a corresponding alignment pin receptacle of a device housing of an electronic device. The base housing further includes an attachment mechanism coupled to the at least one first alignment pin, wherein the attachment mechanism is configured to cause the at least one first alignment pin to extend at least partially from the base housing when the device housing is within a predetermined proximity of the base housing.
摘要翻译：本文描述的特定实施例提供了一种电子设备，例如笔记本电脑，膝上型计算机或平板电脑，其包括耦合到多个电子组件（其可以包括任何类型的组件，元件，电路等）的电路板。对接基座的一个具体示例实施例包括基座壳体，其包括设置在基座壳体内的至少一个对准销。所述至少一个对准销中的每一个构造成与电子装置的装置壳体的对应的对准销插座接合。基座外壳还包括联接到至少一个第一对准销的连接机构，其中，当所述装置壳体处于预定的位置时，所述附接机构构造成使所述至少一个第一对准销至少部分地从所述基座壳体延伸靠近基座。

2. 发明申请

US20160091924A1 WIRELESS GIMBAL CONNECTION FOR ELECTRONIC DEVICES 审中-公开
标题翻译：用于电子设备的无线GIMBAL连接
公开(公告)号：US20160091924A1
公开(公告)日：2016-03-31
申请号：US14497534
申请日：2014-09-26
申请人： Russell S. Aoki , David W. Browning
发明人： Russell S. Aoki , David W. Browning
IPC分类号： G06F1/16 , F16M11/20
CPC分类号： G06F1/1616 , F16M11/2007 , G06F1/1662 , G06F1/1683 , G06F1/1698
摘要： A wireless gimbal connection of use with electronics devices such as computer notebooks relatively pivotable portions such as a lid and base. The gimbal includes a carriage on which transmitter and receiver chips are mounted, and further has a magnet whose magnetic forces may be used to bring the gimbaled carriage into a predetermined alignment with the base, which may be used to arrange the chips and any sensors as may be used into alignment as well. As the orientation of the lid varies with respect to the base, the carriage within seeks alignment with the base due to the magnetic forces present. Where the base is located on a flat surface, gravitational forces also contribute to the alignment.
摘要翻译：与诸如计算机笔记本电脑的电子设备一起使用的无线万向接口相对可枢转的部分，例如盖子和底座。万向架包括一个托架，发射器和接收器芯片安装在该托架上，并且还具有磁铁，其磁力可用于使万向架托架与基座预定对准，可用于将芯片和任何传感器布置为也可以用于对齐。随着盖的取向相对于基座的变化，由于存在磁力，托架将与底座对准。在基座位于平坦表面上的情况下，重力也有助于对准。

3. 发明授权

US06288911B1 Hot plug solution and adjustable retention bracket 有权
标题翻译：热插拔解决方案和可调固定支架
公开(公告)号：US06288911B1
公开(公告)日：2001-09-11
申请号：US09251751
申请日：1999-02-18
申请人： Russell S. Aoki , Mohammed N. Haq
发明人： Russell S. Aoki , Mohammed N. Haq
IPC分类号： H05K714
CPC分类号： H05K7/1409
摘要： Disclosed is structure and methods for engaging/disengaging a peripheral component interconnect compliant card with/from a slot therefor, without having to power down the system (e.g., computer) or remove any system chassis components. The structure includes a bracket to hold the card, which bracket can be adjustable to hold cards of different sizes. The structure also includes a frame member attached to the system chassis, the frame member having a guide rail to guide the bracket and peripheral component interconnect compliant card to engage/disengage the card with/from the slot therefor. The adjustable retention bracket can be used independently of use of the frame member, to hold peripheral component interconnect compliant cards rigid and stable.
摘要翻译：公开了用于使外围部件互连兼容卡与/从其插槽接合/分离的结构和方法，而不必将系统（例如，计算机）断电或移除任何系统机箱部件。该结构包括一个用于固定卡片的支架，该托架可以调节以容纳不同尺寸的卡片。该结构还包括附接到系统底盘的框架构件，框架构件具有引导托架和引导支架和外围构件互连兼容卡以使卡与卡槽接合/脱离插槽。可调节的固定支架可以独立于框架构件的使用使用，以保持外围组件互连兼容卡刚性和稳定。

4. 发明申请

US20180307275A1 DOCKING STATION 审中-公开
公开(公告)号：US20180307275A1
公开(公告)日：2018-10-25
申请号：US15770984
申请日：2015-11-24
申请人： Nithyananda Siva JEGANATHAN , Daria A. LOI , James W. EDWARDS , Nicholas W. OAKLEY , Don J. NGUYEN , Brian R. PEIL , Aleksander MAGI , Russell S. AOKI , Meenakshi GUPTA , Intel Corporation
发明人： Brian R. Peil , Russell S. Aoki , Aleksander Magi , James W. Edwards , Don J. Nguyen , Nicholas W. Oakley , Daria A. Loi , Meenakshi Gupta , Nithyananda S. Jeganathan
IPC分类号： G06F1/16 , H02J50/80 , H02J7/00 , H02J7/02
摘要： Particular embodiments described herein provide for an electronic system that includes a docking station configured to wirelessly couple to an electronic device and a wireless charging element removably coupled to the docking station. The wireless charging element includes a power receiving unit and is configured to wireless charge the electronic device. In an example, the docking station is configured for high speed input/output.

5. 发明申请

US20170179069A1 BALL GRID ARRAY SOLDER ATTACHMENT 审中-公开
公开(公告)号：US20170179069A1
公开(公告)日：2017-06-22
申请号：US14974807
申请日：2015-12-18
申请人： Jonathon R. Carstens , Michael S. Brazel , Russell S. Aoki , Laura S. Mortimer
发明人： Jonathon R. Carstens , Michael S. Brazel , Russell S. Aoki , Laura S. Mortimer
IPC分类号： H01L23/00 , B23K3/06 , B23K1/00 , B23K3/08 , H01L23/498 , H01L23/34
CPC分类号： H01L24/81 , B23K1/0016 , B23K1/008 , B23K1/19 , B23K1/206 , B23K3/06 , B23K3/0638 , B23K3/082 , B23K2101/42 , H01L23/345 , H01L23/49816 , H01L24/75 , H01L2224/81007 , H01L2224/81024 , H01L2224/81035 , H01L2224/81234 , H01L2224/81815 , H01L2924/15321 , H05K3/1225 , H05K3/3436 , H05K2201/10378 , H05K2203/166
摘要： Reflow Grid Array (RGA) technology may be implemented on an interposer device, where the interposer is placed between a motherboard and a ball grid array (BGA) package. The interposer may provide a controlled heat source to reflow solder between the interposer and the BGA package. A technical problem faced by an interposer using RGA technology is application of solder to the RGA interposer. Technical solutions described herein provide processes and equipment for application of solder and formation of solder balls to connect an RGA interposer to a BGA package.

6. 发明申请

US20140162473A1 MOBILE INDEPENDENT LOADING MECHANISM 审中-公开
标题翻译：移动独立装载机构
公开(公告)号：US20140162473A1
公开(公告)日：2014-06-12
申请号：US13711345
申请日：2012-12-11
申请人： Russell S. Aoki , Anthony P. Valpiani
发明人： Russell S. Aoki , Anthony P. Valpiani
IPC分类号： H01R12/16 , H05K3/30
CPC分类号： H05K3/30 , H05K3/301 , H05K7/1061 , H05K2201/10325 , H05K2201/2018 , Y10T29/4913
摘要： A mobile device assembly comprising a land grid array (LGA) socket configured to couple with a board of a mobile device. The LGA socket may be configured to couple with a component of the mobile device. A mobile independent loading mechanism (ILM) may at least partially overlap the component and couple with the board of the mobile device via one or more fasteners. By coupling with the board of the mobile device, the mobile ILM may therefore apply pressure to the component, securely holding the component to the LGA socket.
摘要翻译：一种移动设备组件，包括被配置为与移动设备的板耦合的平面栅格阵列（LGA）插座。 LGA插座可以被配置为与移动设备的组件耦合。移动式独立装载机构（ILM）可以至少部分地与部件重叠并且经由一个或多个紧固件与移动装置的板耦合。通过与移动设备的板耦合，移动ILM可以因此向组件施加压力，将组件牢固地保持在LGA插座上。

7. 发明申请

US20170179066A1 BULK SOLDER REMOVAL ON PROCESSOR PACKAGING 审中-公开
公开(公告)号：US20170179066A1
公开(公告)日：2017-06-22
申请号：US14974881
申请日：2015-12-18
申请人： Russell S. Aoki , John W. Jaeger , Michael S. Brazel , Daniel P. Carter , Anthony P. Valpiani , Michael R. Hui , Rashelle Yee , Joseph J. Jasniewski , Shelby A. Ferguson , Thomas A. Boyd , Jonathan W. Thibado , Penny K. Woodcock , Rachel G. Taylor , Laura S. Mortimer
发明人： Russell S. Aoki , John W. Jaeger , Michael S. Brazel , Daniel P. Carter , Anthony P. Valpiani , Michael R. Hui , Rashelle Yee , Joseph J. Jasniewski , Shelby A. Ferguson , Thomas A. Boyd , Jonathan W. Thibado , Penny K. Woodcock , Rachel G. Taylor , Laura S. Mortimer
IPC分类号： H01L23/00 , B23K3/02
CPC分类号： B23K3/029 , H01L2924/15311
摘要： Reflow Grid Array technology may be implemented on an interposer device, where the interposer is placed between a motherboard and a BGA package. The interposer may provide a controlled heat source to reflow solder between the interposer and the BGA package. A technical problem faced by an interposer using RGA technology is solder cleaning and removal when removing a BGA package. Technical solutions described herein provide processes and equipment for bulk solder removal from a BGA package that can be executed in the field.

8. 发明申请

US20140098474A1 LOCKING HINGE ASSEMBLY FOR ELECTRONIC DEVICE 有权
标题翻译：用于电子设备的锁定铰链组件
公开(公告)号：US20140098474A1
公开(公告)日：2014-04-10
申请号：US13976173
申请日：2011-12-28
申请人： Achintya K. Bhowmik , Russell S. Aoki , Shmuel M. Eden , Ravji K. Mongia
发明人： Achintya K. Bhowmik , Russell S. Aoki , Shmuel M. Eden , Ravji K. Mongia
IPC分类号： G06F1/16
CPC分类号： G06F1/1681 , E05D11/1078 , E05Y2900/606 , G06F1/1616 , G06F1/1679 , H04M1/0216 , Y10T16/5403
摘要： In one embodiment an electronic device comprises a housing having a first section and a second section comprising a display coupled to the first section by a hinge assembly, a rotation control assembly to control rotation of the hinge assembly, and a controller to activate the rotation control assembly in response to detection of a force condition at a second section of the housing of an electronic device. Other embodiments may be described.
摘要翻译：在一个实施例中，电子设备包括具有第一部分的壳体和包括通过铰链组件联接到第一部分的显示器的第二部分，用于控制铰链组件的旋转的旋转控制组件，以及用于启动旋转控制的控制器响应于在电子设备的壳体的第二部分处的力条件的检测而进行的组装。可以描述其他实施例。

9. 发明申请

US20080282775A1 CHAMBER SEALING VALVE 有权
标题翻译：室密封阀
公开(公告)号：US20080282775A1
公开(公告)日：2008-11-20
申请号：US12180733
申请日：2008-07-28
申请人： Russell S. Aoki , Michael T. Crocker , Daniel P. Carter
发明人： Russell S. Aoki , Michael T. Crocker , Daniel P. Carter
IPC分类号： G01M3/32 , F16K1/44
CPC分类号： H05K7/20272 , G01M3/228 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： According to some embodiments, a test fluid may be provided into a chamber associated with a cooling system for an electronic integrated circuit. Moreover, a valve may be partially inserted into an opening of the chamber to seal the chamber. The valve may include a first sealing portion to seal the chamber at the opening when the valve shaft is inserted the first distance. The valve may then be inserted an intermediate distance, between the first distance and a second distance, to unseal the chamber. Note that the valve may include a second sealing portion, offset from the first sealing portion, to seal the chamber at the opening when the valve is inserted the second distance. The valve may further define a passage, between the first and second sealing portions, to permit a flow of the test fluid when the valve is inserted the intermediate distance.
摘要翻译：根据一些实施例，可以将测试流体提供到与用于电子集成电路的冷却系统相关联的室中。此外，阀可以部分地插入到腔室的开口中以密封腔室。阀可以包括第一密封部分，以在阀轴插入第一距离时将腔室密封在开口处。然后，阀可以在第一距离和第二距离之间插入中间距离以开启腔室。注意，阀可以包括从第一密封部分偏移的第二密封部分，以在阀插入第二距离时将腔室密封在开口处。阀可以进一步限定在第一和第二密封部分之间的通道，以允许当阀插入中间距离时测试流体的流动。

10. 发明授权

US06477041B2 Computer assembly with captivated screw carrier 有权
标题翻译：电脑组合带有螺丝托架
公开(公告)号：US06477041B2
公开(公告)日：2002-11-05
申请号：US09783167
申请日：2001-02-13
申请人： Russell S. Aoki , Eric D. McAfee , Grant F. Steen
发明人： Russell S. Aoki , Eric D. McAfee , Grant F. Steen
IPC分类号： H01B103
CPC分类号： G06F1/184 , H05K7/142
摘要： A computer assembly is described. That computer assembly includes a plate that contains a plurality of receptacles for receiving a plurality of fasteners, and that has a plurality of openings for enabling components to pass through it. The computer assembly also includes a plurality of fasteners, each being coupled to a receptacle, and a printed circuit board. The printed circuit board is attached to the plate by the plurality of fasteners, and a plurality of components pass through the openings formed in the plate.
摘要翻译：描述了计算机组件。该计算机组件包括一个板，该板包含多个容纳多个紧固件的容器，并且具有多个用于使部件能够通过的开口。计算机组件还包括多个紧固件，每个紧固件联接到插座和印刷电路板。印刷电路板通过多个紧固件附接到板上，并且多个部件通过形成在板中的开口。

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