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1. 发明申请

US20060116010A1 Latching structure and a method of making an electrical interconnect 有权
标题翻译：闭锁结构和制造电气互连的方法
公开(公告)号：US20060116010A1
公开(公告)日：2006-06-01
申请号：US10997931
申请日：2004-11-29
申请人： David Fork , Jurgen Daniel , Gordon Jagerson , Thomas Di Stefano
发明人： David Fork , Jurgen Daniel , Gordon Jagerson , Thomas Di Stefano
IPC分类号： H01R12/00
CPC分类号： H01R4/4809
摘要： An electrical interconnect device attaches electrical devices with a cantilever spring with out the use of solder or adhesive. The cantilever spring latches to a contact structure such that there are a plurality of contact points between the spring and the contact structure. The cantilever spring has two tines at a tip end that define an opening in the spring. The contact structure is received by the opening between the two tines so that the spring and the contact structure mate. The spring may engage the contact structure by latching to the contact structure or by a post that urges the tip end of the spring against the contact structure.
摘要翻译：电互连装置使用焊料或粘合剂将电气装置与悬臂弹簧连接。悬臂弹簧锁定到接触结构，使得在弹簧和接触结构之间存在多个接触点。悬臂弹簧在尖端具有两个尖端，在该弹簧中限定开口。接触结构由两个齿之间的开口接收，使得弹簧和接触结构配合。弹簧可以通过闩锁到接触结构或通过将弹簧的尖端抵靠接触结构的柱子卡合而接合接触结构。

2. 发明申请

US20060075633A1 Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof 审中-公开
标题翻译：具有凹槽或延伸分离片的单层或多层印刷电路板及其制造方法
公开(公告)号：US20060075633A1
公开(公告)日：2006-04-13
申请号：US11288477
申请日：2005-11-29
申请人： Alan Wang , Kevin Olson , Thomas Di Stefano
发明人： Alan Wang , Kevin Olson , Thomas Di Stefano
IPC分类号： H05K3/36
CPC分类号： H05K1/0231 , H01L2224/16225 , H05K1/056 , H05K3/002 , H05K3/0052 , H05K3/44 , H05K3/4641 , H05K3/4644 , H05K2201/0166 , H05K2201/0397 , H05K2201/0909 , H05K2201/0919 , H05K2201/09309 , H05K2201/09554 , H05K2201/10446 , H05K2203/135 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156
摘要： A circuit board layer 2 in accordance with the present invention includes a conductive sheet 4 sandwiched between an insulating top layer 10 and an insulating bottom layer 14. The top and bottom layers 10 and 14 and the conductive sheet 4 define the circuit board layer 2 having an edge that includes an edge 20 of the conductive sheet 4. An insulating edge layer 18 covers substantially all of the edge 20 of the conductive sheet 4.
摘要翻译：根据本发明的电路板层2包括夹在绝缘顶层10和绝缘底层14之间的导电片4.顶层10和底层14以及导电片4限定电路板层2，其具有包括导电片4的边缘20的边缘。绝缘边缘层18几乎覆盖导电片4的所有边缘20。

3. 发明申请

US20050006138A1 Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof 失效
公开(公告)号：US20050006138A1
公开(公告)日：2005-01-13
申请号：US10910022
申请日：2004-08-03
申请人： Alan Wang , Kevin Olson , Thomas Di Stefano
发明人： Alan Wang , Kevin Olson , Thomas Di Stefano
IPC分类号： H05K1/05 , H05K1/02 , H05K3/00 , H05K3/44 , H05K3/46 , H05K7/06
CPC分类号： H05K1/0231 , H01L2224/16225 , H05K1/056 , H05K3/002 , H05K3/0052 , H05K3/44 , H05K3/4641 , H05K3/4644 , H05K2201/0166 , H05K2201/0397 , H05K2201/0909 , H05K2201/0919 , H05K2201/09309 , H05K2201/09554 , H05K2201/10446 , H05K2203/135 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156
摘要： A circuit board layer 2 in accordance with the present invention includes a conductive sheet 4 sandwiched between an insulating top layer 10 and an insulating bottom layer 14. The top and bottom layers 10 and 14 and the conductive sheet 4 define the circuit board layer 2 having an edge that includes an edge 20 of the conductive sheet 4. An insulating edge layer 18 covers substantially all of the edge 20 of the conductive sheet 4.

4. 发明申请

US20050121758A1 Thin package for stacking integrated circuits 有权
标题翻译：用于堆叠集成电路的薄封装
公开(公告)号：US20050121758A1
公开(公告)日：2005-06-09
申请号：US10729557
申请日：2003-12-04
申请人： Thomas Di Stefano
发明人： Thomas Di Stefano
IPC分类号： H05K1/14 , H01L23/31 , H01L23/48 , H01L23/495 , H01L25/065 , H01L27/00 , H01L23/02
CPC分类号： H01L25/0657 , H01L23/3128 , H01L23/49555 , H01L24/72 , H01L2225/0651 , H01L2225/06527 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/14 , H01L2924/351 , H01L2924/00
摘要： An improved structure and method for making interconnects for a thin package of stacked integrated circuits is described. The structure uses a spring contact to replace traditional solder balls in a stacked structure. The spring contacts are incorporated in an integrated circuit layer and may be made from stressed metal or physical bending of a metal structure. The spring contacts enable electrical coupling to adjacent circuit layers immediately above or immediately below the integrated circuit layer.
摘要翻译：描述了用于制造用于堆叠集成电路的薄封装的互连的改进的结构和方法。该结构使用弹簧接触件来代替堆叠结构中的传统焊球。弹簧触点结合在集成电路层中，并且可以由金属结构的应力金属或物理弯曲制成。弹簧触点使电耦合到集成电路层正上方或紧挨着集成电路层正下方的相邻电路层。

5. 发明授权

US06420661B1 Connector element for connecting microelectronic elements 有权
标题翻译：用于连接微电子元件的连接器元件
公开(公告)号：US06420661B1
公开(公告)日：2002-07-16
申请号：US09388718
申请日：1999-09-02
申请人： Thomas Di Stefano , John W. Smith
发明人： Thomas Di Stefano , John W. Smith
IPC分类号： H05K116
CPC分类号： H01L24/81 , H01L23/49811 , H01L23/49827 , H01L2224/81801 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01R12/52 , H01R13/24
摘要： A connector element for connecting microelectronic elements includes a dielectric sheet having pairs of elongated, flexible leads in registry on opposite surfaces of the sheet. The leads are connected at their terminal ends which are in registry with each other. The terminal ends are offset from the tip ends in a horizontal direction. The tip ends are releasably attached to the surfaces of the dielectric sheet. The tip ends may be connected to microelectronic elements, which may be displaced relative to each other in a vertical direction.
摘要翻译：用于连接微电子元件的连接器元件包括具有成对的细长柔性引线的电介质片，其在片材的相对表面上对准。引线在它们的终端处相互连接，这些终端彼此对准。终端在水平方向上偏离尖端。末端可释放地附着在电介质片的表面上。尖端可以连接到微电子元件，微电子元件可以在垂直方向上相对于彼此移位。

6. 发明授权

US06570101B2 Lead configurations 有权
标题翻译：引线配置
公开(公告)号：US06570101B2
公开(公告)日：2003-05-27
申请号：US09858847
申请日：2001-05-16
申请人： Thomas Di Stefano , John W. Smith
发明人： Thomas Di Stefano , John W. Smith
IPC分类号： H01R1204
CPC分类号： H01L24/81 , H01L23/49811 , H01L23/49827 , H01L2224/81801 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01R12/52 , H01R13/24
摘要： A microelectronic lead element includes an elongated first leg having a surface releasably attached to a substrate. The first leg has a tip end and a base end. An elongated second leg includes a surface releasably attached to a substrate, the second leg having a tip end and a base end. The base end of the first leg is arranged adjacent the base end of the second leg. A body of conductive material is adapted for electrically connecting the base ends of the first and second legs together. The first and second legs extend away from their respective base ends and said body of conductive material in a common direction. Movement of the tip ends relative to each other in a vertical direction relative to the substrate causes flexure of the first and second legs in opposite directions upon release from the substrate.
摘要翻译：微电子引线元件包括细长的第一支脚，其具有可释放地附接到基板的表面。第一条腿有一个尖端和一个基端。细长的第二腿包括可释放地附接到基底的表面，第二腿具有尖端和基端。第一腿的基端布置成邻近第二腿的基端。导电材料体适于将第一和第二腿的基端电连接在一起。第一和第二支腿沿相同的方向延伸远离它们各自的基端和导电材料的主体。相对于基板在垂直方向上的端部相对于彼此的移动在从基板释放时引起第一和第二支腿沿相反方向的挠曲。

7. 发明申请

US20070256810A1 Cooling apparatus for microelectronic devices 有权
标题翻译：微电子器件冷却装置
公开(公告)号：US20070256810A1
公开(公告)日：2007-11-08
申请号：US11415901
申请日：2006-05-02
申请人： Peter Di Stefano , Thomas Di Stefano
发明人： Peter Di Stefano , Thomas Di Stefano
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , H01L2224/73253 , H01L2924/09701
摘要： One embodiment of the present invention is an apparatus for cooling a microelectronic device including: (a) a rigid support ring having a top surface and a bottom surface; (b) a mechanically resilient, thermally conductive bottom membrane having a top and a bottom surface, wherein the top surface of the membrane is attached to the bottom surface of the ring; and (c) a multiplicity of thermally conductive posts having top and bottom surfaces, the posts being disposed with their bottom surfaces in thermal contact with the top surface of the bottom membrane over an area, wherein the posts are arrayed in the area with spaces therebetween so that heat transferred from the microelectronic device to the bottom surface of the membrane may be transferred to the multiplicity of thermally conductive posts.
摘要翻译：本发明的一个实施例是一种用于冷却微电子装置的装置，包括：（a）具有顶表面和底表面的刚性支撑环; （b）具有顶表面和底表面的机械弹性导热底膜，其中所述膜的顶表面附接到所述环的底表面; 和（c）具有顶表面和底表面的多个导热柱，所述柱设置成其底表面与底膜的顶表面在一个区域上热接触，其中柱被排列在具有间隔的区域中使得从微电子器件传递到膜的底表面的热可以转移到多个导热柱。

8. 发明申请

US20060005995A1 Circuit board and method of manufacture thereof 有权
标题翻译：电路板及其制造方法
公开(公告)号：US20060005995A1
公开(公告)日：2006-01-12
申请号：US11224197
申请日：2005-09-12
申请人： Alan Wang , Kevin Olson , Thomas Di Stefano
发明人： Alan Wang , Kevin Olson , Thomas Di Stefano
IPC分类号： H05K1/03
CPC分类号： H05K1/0231 , H01L2224/16225 , H05K1/056 , H05K3/002 , H05K3/0052 , H05K3/44 , H05K3/4641 , H05K3/4644 , H05K2201/0166 , H05K2201/0397 , H05K2201/0909 , H05K2201/0919 , H05K2201/09309 , H05K2201/09554 , H05K2201/10446 , H05K2203/135 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156
摘要： Provided is a method of forming a circuit board including (a) providing a first conductive sheet; (b) selectively removing one or more portions of the first conductive sheet to form a first panel having a first circuit board that is coupled to a disposable part of the first panel by at least one tab that extends from an edge of the first circuit board to an edge of the disposable part of the first panel; (c) applying an insulating coating to the first circuit board so that at least each edge of the first circuit board is covered thereby; and (d) separating the first circuit board from the disposable part in a manner whereupon at least part of the tab remains attached to the first circuit board and includes an exposed edge of the conductive sheet of the first circuit board. Circuit boards formed by the method are also provided.
摘要翻译：提供一种形成电路板的方法，包括：（a）提供第一导电片; （b）选择性地去除所述第一导电片的一个或多个部分以形成具有第一电路板的第一面板，所述第一电路板通过从所述第一电路板的边缘延伸的至少一个接片连接到所述第一面板的一次性部分到所述第一面板的一次性部分的边缘; （c）向第一电路板施加绝缘涂层，使得第一电路板的至少每个边缘被覆盖; 以及（d）以一种方式将第一电路板与一次性部分分开，由此至少部分突片保持附接到第一电路板并且包括第一电路板的导电片的暴露边缘。还提供了通过该方法形成的电路板。

9. 发明授权

US06281588B1 Lead configurations 有权
标题翻译：引线配置
公开(公告)号：US06281588B1
公开(公告)日：2001-08-28
申请号：US09531051
申请日：2000-03-20
申请人： Thomas Di Stefano , John W. Smith
发明人： Thomas Di Stefano , John W. Smith
IPC分类号： H01L2348
CPC分类号： H01L24/81 , H01L23/49811 , H01L23/49827 , H01L2224/81801 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01R12/52 , H01R13/24
摘要： A microelectronic assembly includes two microelectronic elements and a number of lead elements connecting the microelectronic elements. Each lead element has two elongated, flexible leads connected to the microelectronic elements at tip ends and connected to each other at terminal ends. The tip ends and terminal ends are offset in a horizontal direction, and the tip end of one lead is in registry with the tip end of the other. The microelectronic elements may be moved away from each other in a vertical direction.
摘要翻译：微电子组件包括两个微电子元件和连接微电子元件的多个引线元件。每个引线元件具有两个细长的柔性引线，其末端连接到微电子元件，并在端部彼此连接。尖端和末端在水平方向上偏移，一个引线的尖端与另一个引线的末端对齐。微电子元件可以在垂直方向上彼此远离。

10. 发明授权

US06191368B1 Flexible, releasable strip leads 失效
标题翻译：柔性，可剥离的带状导线
公开(公告)号：US06191368B1
公开(公告)日：2001-02-20
申请号：US08712855
申请日：1996-09-12
申请人： Thomas Di Stefano , John W. Smith
发明人： Thomas Di Stefano , John W. Smith
IPC分类号： H05K116
CPC分类号： H01L24/81 , H01L23/49811 , H01L23/49827 , H01L2224/81801 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01R12/52 , H01R13/24
摘要： A lead element for a microelectronic connection has a rigid body section connected to two parallel strip-like flexible leg sections. The leg sections each have tip ends that are offset from the rigid body section in a horizontal direction. The tip end of one leg section is permanently connected to a first microelectronic element. The tip end of the other leg section is releasably connected to the first microelectronic element and permanently connected to a second microelectronic element. Moving the first tip end relative to the second tip end in a vertical direction causes flexure of the leg sections in opposite directions.
摘要翻译：用于微电子连接的引线元件具有连接到两个平行的条状柔性支脚部分的刚体部分。腿部各自具有在水平方向上偏离刚体部分的尖端。一个腿部的末端永久地连接到第一微电子元件。另一个腿部的末端可释放地连接到第一微电子元件并且永久地连接到第二微电子元件。沿着垂直方向相对于第二末端移动第一末端使得腿部在相反方向上弯曲。

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