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    • 7. 发明授权
    • Microwave monolithic integrated circuit (MMIC) carrier interface
    • 微波单片集成电路(MMIC)载波接口
    • US06653916B2
    • 2003-11-25
    • US10254051
    • 2002-09-24
    • Danny F. AmmarGavin Clark
    • Danny F. AmmarGavin Clark
    • H01P308
    • H01L23/562H01L23/66H01L2223/6622H01L2924/0002H01L2924/09701H01L2924/1423H01L2924/3011H01L2924/00
    • A microwave monolithic integrated circuit (MMIC) assembly and related method are disclosed. A dielectric substrate has a surface on which radio frequency circuits and microstrip lines are formed. At least one MMIC chip opening is dimensioned for receiving therethrough a MMIC chip. A metallic carrier is mismatched as to coefficient of thermal expansion to the dielectric substrate and includes a component surface adhesively secured to the dielectric substrate on the surface opposing the radio frequency circuits and microstrip lines. At least one raised pedestal is on the component surface that is positioned at the MMIC chip opening. A MMIC chip is secured on the pedestal and extends through the MMIC chip opening for connection to the radio frequency circuits and microstrip lines. Stress relief portions are formed in the metallic carrier that segment the carrier into subcarriers and provide stress relief during expansion and contraction created by temperature changes.
    • 公开了一种微波单片集成电路(MMIC)组件及相关方法。 电介质基板具有形成射频电路和微带线的表面。 至少一个MMIC芯片开口的尺寸用于通过MMIC芯片接收MMIC芯片。 金属载体与介电基片的热膨胀系数不匹配,并且包括在与射频电路和微带线相对的表面上粘附地固定到电介质基板的部件表面。 位于MMIC芯片开口处的部件表面上至少有一个凸起的基座。 MMIC芯片固定在基座上并延伸穿过MMIC芯片开口,以连接到射频电路和微带线。 应力消除部分形成在金属载体中,该载体将载体分成副载体,并在通过温度变化产生的膨胀和收缩期间提供应力释放。
    • 8. 发明授权
    • Highly integrated microwave outdoor unit (ODU)
    • 高度集成的微波室外机(ODU)
    • US07050765B2
    • 2006-05-23
    • US10338773
    • 2003-01-08
    • Danny F. AmmarDavid BassGavin ClarkRonald D. GrahamConrad JordanStephen A. Stahly
    • Danny F. AmmarDavid BassGavin ClarkRonald D. GrahamConrad JordanStephen A. Stahly
    • H04B1/38
    • H01Q1/02H01Q1/088H01Q1/42H01Q21/0025H01Q21/0087
    • A lightweight millimeter wave outdoor unit includes a lightweight housing with a heat sink and mounting member configured for mounting on the antenna to form a wireless link. A millimeter wave transceiver board is formed of ceramic material and mounted within the housing. It includes a millimeter wave transceiver circuit that has microwave monolithic integrated circuit (MMIC) chips and operable with the transmit and receive boards. An intermediate frequency (IF) board has components forming an intermediate frequency circuit operable with the millimeter wave transceiver circuit. A frequency synthesizer board has a signal generating circuit for generating local oscillator signals to the transceiver circuit. A controller board has surface mounted DC and low frequency discrete devices thereon forming power and control circuits that supply respective power and control signals to other circuits on other boards. A quick connect/disconnect assembly is operative with the housing for allowing the housing to be rapidly connected and disconnected to the antenna circuit contact members interconnect circuits between boards.
    • 轻量级的毫米波室外机包括具有散热器和配置成安装在天线上以形成无线链路的安装构件的轻质外壳。 毫米波收发器板由陶瓷材料形成并安装在壳体内。 它包括一个毫米波收发器电路,它具有微波单片集成电路(MMIC)芯片,可与发射和接收板一起使用。 中频(IF)板具有形成可与毫米波收发器电路一起工作的中频电路的元件。 频率合成器板具有用于向收发器电路产生本地振荡器信号的信号发生电路。 控制板在其上形成有表面安装的DC和低频离散器件,形成功率和控制电路,其向其它板上的其它电路提供相应的功率和控制信号。 快速连接/断开组件与壳体一起工作,以允许壳体与板之间的天线电路接触件互连电路快速连接和断开。