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1. 发明授权

US5075940A Process for producing solid electrolytic capacitors 失效
标题翻译：生产固体电解电容器的方法
公开(公告)号：US5075940A
公开(公告)日：1991-12-31
申请号：US302022
申请日：1991-03-19
申请人： Chojiro Kuriyama , Tatsuhiko Oshima , Miki Hasegawa
发明人： Chojiro Kuriyama , Tatsuhiko Oshima , Miki Hasegawa
IPC分类号： B22F3/02 , B22F7/08 , H01G5/38 , H01G9/00 , H01G9/012 , H01G9/042 , H01G13/00
CPC分类号： H01G9/0029 , H01G9/042 , Y10S148/014 , Y10T29/417
摘要： The present invention provides a process which is particularly suited for mass-producing solid electrolytic capacitors. The process utilizes a combination of a mold and a presser member. The mold has a series of molding recesses, and a lead receiving groove extending along and through the series of molding recesses. The presser member has a corresponding series of pressing projections. A portion of a continuous lead wire is placed in the groove, and powdered electrode material is loaded in the molding recesses. The presser member is then moved toward the mold, so that the powdered material is compacted within the molding recesses by the pressing projections. The resulting compacts are removed from the mold together with the wire. The same process steps are repeated with respect to other portions of the wire.
摘要翻译：本发明提供一种特别适用于批量生产固体电解电容器的方法。该方法利用模具和压紧构件的组合。模具具有一系列模制凹口，以及沿着并且穿过该系列模制凹槽延伸的引线接收凹槽。按压构件具有相应的一系列按压突起。将连续引线的一部分放置在槽中，并将粉末状的电极材料装载到模制凹部中。然后将压紧构件移动到模具，使得粉末材料通过按压突起在模制凹部内压实。所得到的压块与线一起从模具中移除。相对于线的其它部分重复相同的工艺步骤。

2. 发明授权

US5538176A Method of forming a ball end for a solder wire 失效
公开(公告)号：US5538176A
公开(公告)日：1996-07-23
申请号：US361190
申请日：1994-12-21
申请人： Miki Hasegawa , Chojiro Kuriyama
发明人： Miki Hasegawa , Chojiro Kuriyama
IPC分类号： H01L21/60 , B23K35/02 , B23K35/14
CPC分类号： H01L24/85 , B23K35/0244 , H01L24/48 , H01L24/78 , H01L2224/05599 , H01L2224/45015 , H01L2224/451 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48599 , H01L2224/48799 , H01L2224/78301 , H01L2224/85043 , H01L2224/85075 , H01L2224/85181 , H01L2224/85205 , H01L24/45 , H01L2924/00011 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01018 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/3025 , Y10S228/902
摘要： A method is provided for forming a ball at a lower end of a material solder wire which is arranged generally vertically. The method comprises the steps of: forming an upward stream of an oxygen-free gas surrounding the solder wire; bringing a lateral flame of combustion to a ball forming position adjacent to the upward gas stream but short of the solder wire to thermally melt the lower end of the solder wire into a ball; and causing the lower ball end of the solder wire to solidify in the upward gas stream.

3. 发明授权

US5431329A Method of forming a ball end for a solder wire 失效
标题翻译：形成用于焊丝的球端的方法
公开(公告)号：US5431329A
公开(公告)日：1995-07-11
申请号：US243933
申请日：1994-05-17
申请人： Miki Hasegawa , Chojiro Kuriyama
发明人： Miki Hasegawa , Chojiro Kuriyama
IPC分类号： H01L21/60 , B23K35/02 , B23K35/14
CPC分类号： H01L24/85 , B23K35/0244 , H01L24/48 , H01L24/78 , H01L2224/05599 , H01L2224/45015 , H01L2224/451 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48599 , H01L2224/48799 , H01L2224/78301 , H01L2224/85043 , H01L2224/85075 , H01L2224/85181 , H01L2224/85205 , H01L24/45 , H01L2924/00011 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01018 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/3025 , Y10S228/902
摘要： A method is provided for forming a ball at a lower end of a material solder wire which is arranged generally vertically. The method comprises the steps of: forming an upward stream of an oxygen-free gas surrounding the solder wire; bringing a lateral flame of combustion to a ball forming position adjacent to the upward gas stream but short of the solder wire to thermally melt the lower end of the solder wire into a ball; and causing the lower ball end of the solder wire to solidify in the upward gas stream.
摘要翻译：提供一种用于在大致垂直布置的材料焊丝的下端形成球的方法。该方法包括以下步骤：形成围绕焊丝的无氧气体向上流; 将侧向燃烧火焰引导到邻近上游气流的球形成位置，但短于焊丝以将焊丝的下端热熔融成球; 并使焊丝的下球端部在向上的气流中固化。

4. 发明授权

US06346127B1 Method of packaging solid electrolytic capacitor having terminatons formed on cut surfaces of a resin encapsulant 有权
标题翻译：包装固体电解电容器的方法，其具有形成在树脂密封剂的切割表面上的端子
公开(公告)号：US06346127B1
公开(公告)日：2002-02-12
申请号：US09580344
申请日：2000-05-25
申请人： Chojiro Kuriyama
发明人： Chojiro Kuriyama
IPC分类号： H01G900
CPC分类号： H01G9/08 , H01G2/065 , Y10T29/417
摘要： A solid electrolytic capacitor is provided which includes a capacitor element having an anode and a cathode, a sheet member for mounting the capacitor element, and a protection package formed on the sheet member to enclose the capacitor element. The sheet member is provided with an anode terminal and a cathode terminal which are connected to the anode and the cathode, respectively.
摘要翻译：提供一种固体电解电容器，其包括具有阳极和阴极的电容器元件，用于安装电容器元件的片状部件，以及形成在片状部件上以包围电容器元件的保护封装。片状部件设置有分别连接到阳极和阴极的阳极端子和阴极端子。

5. 发明授权

US06214060B1 Process of making a capacitor element for a solid electrolytic capacitor 有权
标题翻译：制作固体电解电容器的电容元件的工艺
公开(公告)号：US06214060B1
公开(公告)日：2001-04-10
申请号：US09207841
申请日：1998-12-08
申请人： Chojiro Kuriyama
发明人： Chojiro Kuriyama
IPC分类号： H01G900
CPC分类号： H01G9/15 , H01G2/02 , H01G4/236 , Y10T29/417
摘要： A process for making a capacitor element for a solid electrolytic capacitor is provided. The process includes the steps of compacting valve metal powder into a porous chip so that an anode wire projects from the porous chip via an end surface, fixing an anode plate to the anode wire, applying a synthetic resin material on the anode wire between the anode plate and the end surface of the porous chip, and forming a dielectric layer, a solid electrolytic layer and a cathode terminal layer on the porous chip.
摘要翻译：提供一种制造用于固体电解电容器的电容器元件的工艺。该方法包括将阀金属粉末压实成多孔芯片的步骤，使得阳极线经由端面从多孔芯片突出，将阳极板固定到阳极线上，将合成树脂材料施加在阳极线之间的阳极并且在多孔芯片上形成电介质层，固体电解质层和阴极端子层。

6. 发明授权

US5716420A Process for making package-type fused solid electrolytic capacitor 失效
标题翻译：制造包装型熔融固体电解电容器的工艺
公开(公告)号：US5716420A
公开(公告)日：1998-02-10
申请号：US650844
申请日：1996-05-20
申请人： Chojiro Kuriyama
发明人： Chojiro Kuriyama
IPC分类号： H01G9/012 , H01G9/00 , H01G9/08 , H01G9/12 , H01G9/15
CPC分类号： H01G9/15 , Y10T29/417
摘要： A process is provided for making a package-type fused solid electrolytic capacitor. In the process, a capacitor element having a chip body and an anode wire is first mounted between an opposed pair of anode and cathode leads with the anode wire attached to the anode lead, the cathode lead having a tip cutout. Then, a material fuse wire is connected to the chip body and the cathode lead with an intermediate portion of the material fuse wire located in the tip cutout of the cathode lead. Then, a resin package is molded to enclose the capacitor element together with the material fuse wire. Then, the resin package is separated from the anode and cathode leads by cutting. Then, an anode terminal electrode and a cathode terminal electrode are formed on the resin package in electrical conduction with the anode wire and the fuse wire, respectively.
摘要翻译：提供了一种用于制造封装型熔融固体电解电容器的工艺。在该过程中，具有芯片体和阳极线的电容器元件首先安装在相对的一对阳极和阴极引线之间，阳极线连接到阳极引线，阴极引线具有尖端切口。然后，材料熔丝与芯片本体和阴极引线连接，其中材料熔丝的中间部分位于阴极引线的尖端切口中。然后，树脂封装被模制以将电容器元件与材料熔丝连在一起。然后，通过切割将树脂封装与阳极和阴极引线分离。然后，阳极端子电极和阴极端子电极分别形成在树脂封装上，与阳极线和熔丝连接。

7. 发明授权

US5693104A Process for making capacitor element for solid electrolytic capacitor 失效
标题翻译：制作固体电解电容器电容元件的工艺
公开(公告)号：US5693104A
公开(公告)日：1997-12-02
申请号：US518362
申请日：1995-08-23
申请人： Chojiro Kuriyama
发明人： Chojiro Kuriyama
IPC分类号： H01G9/00 , H01G9/15
CPC分类号： H01G9/15 , Y10T29/417
摘要： A process of making a capacitor element for a solid electrolytic capacitor is provided which comprises the steps of preparing at least one capacitor piece which includes a chip of a sintered mass of metal powder and an anode wire projecting from the chip, forming a dielectric layer on the chip, forming a solid electrolyte layer on the chip, forming a metal layer on the chip, and cutting the metal wire at a position spaced from the chip. A water-repellent member is fitted on the anode wire and located close to the chip at least up to finishing the step of forming the solid electrolyte layer. Further, the water-repellent member is shifted along the anode wire away from the chip at least before cutting the anode wire, whereas the anode wire is cut at a position between the chip and the shifted water-repellent member.
摘要翻译：提供一种制造用于固体电解电容器的电容器元件的方法，其包括以下步骤：制备至少一个电容器片，该电容器片包括金属粉末烧结块的芯片和从芯片突出的阳极线，以形成电介质层在芯片上形成固体电解质层，在芯片上形成金属层，并且在与芯片间隔开的位置切割金属线。防水构件安装在阳极线上并且靠近芯片至少直到完成形成固体电解质层的步骤。此外，防水构件至少在切割阳极线之前沿着阳极线移动离开芯片，而阳极线在芯片和移位的防水构件之间的位置被切割。

8. 发明授权

US07929275B2 Solid electrolytic capacitor, electric circuit, and solid electrolytic capacitor mounting structure 有权
标题翻译：固体电解电容器，电路和固体电解电容器的安装结构
公开(公告)号：US07929275B2
公开(公告)日：2011-04-19
申请号：US12151703
申请日：2008-05-08
申请人： Chojiro Kuriyama
发明人： Chojiro Kuriyama
IPC分类号： H01G9/04 , H01G9/145 , H01G4/228
CPC分类号： H01G9/052 , H01G9/012 , H01G9/14
摘要： A solid electrolytic capacitor (A1) includes a porous sintered body (10) of metal particles or conductive ceramic particles, anode wires (11A, 11B) partially inserted in the porous sintered body (10), an anode terminal provided by portions of the anode wires (11A, 11B) which project from the porous sintered body (10), and a cathode (30) formed on an obverse surface of the porous sintered body (10). The anode terminal includes a first and a second anode terminals (11a, 11b), and circuit current flows from the first anode terminal (11a) toward the second anode terminal (11b) through the porous sintered body (10). Therefore, noise cancellation property can be enhanced with respect to a wide frequency band, and large electric power can be supplied with high responsiveness. In a circuit using the solid electrolytic capacitor (A1), the space efficiency on a board can be enhanced, and the cost can be reduced.
摘要翻译：固体电解电容器（A1）包括金属颗粒或导电陶瓷颗粒的多孔烧结体（10），部分插入多孔烧结体（10）中的阳极线（11A，11B），阳极端子，阳极端子由阳极部分从多孔烧结体（10）突出的导线（11A，11B）和形成在多孔烧结体（10）的正面上的阴极（30）。阳极端子包括第一和第二阳极端子（11a，11b），并且电路电流通过多孔烧结体（10）从第一阳极端子（11a）朝向第二阳极端子（11b）流动。因此，可以相对于宽频带提高噪声消除性，并且可以以高响应性提供大的电力。在使用固体电解电容器（A1）的电路中，可以提高电路板的空间效率，并且可以降低成本。

9. 发明授权

US07706131B2 Solid electrolytic capacitor and method for manufacturing same 有权
标题翻译：固体电解电容器及其制造方法
公开(公告)号：US07706131B2
公开(公告)日：2010-04-27
申请号：US11791568
申请日：2005-11-25
申请人： Chojiro Kuriyama
发明人： Chojiro Kuriyama
IPC分类号： H01G9/00
CPC分类号： H01G2/065 , H01G9/012 , H01G9/042 , H01G9/15 , Y10T29/417
摘要： A solid electrolytic capacitor (A) includes a first porous sintered body (1A) made of valve metal, anode conduction members (21A, 21B) electrically connected to the first porous sintered body (1A), surface-mounting anode terminals (3A, 3B) electrically connected to the anode conduction members (21A, 21B), surface-mounting cathode terminals, and a second porous sintered body (1B) made of valve metal and intervening between the first porous sintered body (1A) and the anode conduction members (21A, 21B).
摘要翻译：固体电解电容器（A）包括由阀金属制成的第一多孔烧结体（1A），与第一多孔烧结体（1A）电连接的阳极传导部件（21A，21B），表面安装阳极端子（3A，3B））电连接到阳极导电部件（21A，21B），表面安装阴极端子和由阀金属制成并插入在第一多孔烧结体（1A）和阳极传导部件之间的第二多孔烧结体（1B） 21A，21B）。

10. 发明授权

US07589955B2 Electric double layer capacitor and aggregation thereof 失效
标题翻译：电双层电容器及其聚集体
公开(公告)号：US07589955B2
公开(公告)日：2009-09-15
申请号：US11559715
申请日：2006-11-14
申请人： Chojiro Kuriyama , Hiroyuki Yanagisawa
发明人： Chojiro Kuriyama , Hiroyuki Yanagisawa
IPC分类号： H01G9/00
CPC分类号： H01G9/155 , H01G9/016 , H01G9/058 , H01G11/10 , H01G11/12 , H01G11/26 , H01G11/32 , H01G11/84 , Y02E60/13
摘要： An electric double layer capacitor includes an anode, a cathode, and an electrolytic solution provided between the anode and the cathode. The anode may be a niobium porous sintered body with an oxide film formed as a dielectric layer on a surface thereof. The cathode allows an electric double layer at an interface with the electrolytic solution. The electric double layer capacitor has a large capacitance and increased voltage.
摘要翻译：双电层电容器包括阳极，阴极和设置在阳极和阴极之间的电解液。阳极可以是在其表面上形成有电介质层的氧化膜的铌多孔烧结体。阴极允许在与电解液的界面处的双电层。双电层电容器具有大的电容和增加的电压。

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