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1. 发明授权

US08324722B2 Packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity 有权
标题翻译：用于矩阵阵列的高功率和高方向性的半导体发光元件的封装装置
公开(公告)号：US08324722B2
公开(公告)日：2012-12-04
申请号：US12657161
申请日：2010-01-14
申请人： Cheng Ju Wu , Hung-Che Chen , I Han Wu , Shang-Cheng Liu , Jin Shan Pan
发明人： Cheng Ju Wu , Hung-Che Chen , I Han Wu , Shang-Cheng Liu , Jin Shan Pan
IPC分类号： H01L23/12
CPC分类号： H01L33/486 , H01L27/156 , H01L33/64 , H01L2224/45144 , H01L2224/48247 , H01L2224/49111 , H01L2924/19107 , H01S5/02216 , H01S5/423 , H01L2924/00
摘要： A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two.
摘要翻译：用于矩阵排列的高功率和高方向性的半导体发光元件的封装装置包括金属基底，阵列芯片和多个金属线。金属基底是高度导热的铜或铝，并且电绝缘的第一电极区域和至少一个第二电极区域设置在金属基底上。阵列芯片设置在第一电极区域上，多个矩阵排列的半导体发光元件和与发光元件相邻的至少一个引线接合焊盘设置在该第一电极区域上。发光元件是VCSEL元件，HCSEL元件或RCLED元件。金属线连接在引线接合焊盘和第二电极区之间以传输功率信号。在底表面和第一电极区域之间设置导电粘合剂以结合并促进两者之间的电连接。

2. 发明申请

US20110121323A1 Packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity 有权
标题翻译：用于矩阵阵列的高功率和高方向性的半导体发光元件的封装装置
公开(公告)号：US20110121323A1
公开(公告)日：2011-05-26
申请号：US12657161
申请日：2010-01-14
申请人： Cheng Ju Wu , Hung-Che Chen , I Han Wu , Shang-Cheng Liu , Jin Shan Pan
发明人： Cheng Ju Wu , Hung-Che Chen , I Han Wu , Shang-Cheng Liu , Jin Shan Pan
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L27/156 , H01L33/64 , H01L2224/45144 , H01L2224/48247 , H01L2224/49111 , H01L2924/19107 , H01S5/02216 , H01S5/423 , H01L2924/00
摘要： A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two.
摘要翻译：用于矩阵排列的高功率和高方向性的半导体发光元件的封装装置包括金属基底，阵列芯片和多个金属线。金属基底是高度导热的铜或铝，并且电绝缘的第一电极区域和至少一个第二电极区域设置在金属基底上。阵列芯片设置在第一电极区域上，多个矩阵排列的半导体发光元件和与发光元件相邻的至少一个引线接合焊盘设置在该第一电极区域上。发光元件是VCSEL元件，HCSEL元件或RCLED元件。金属线连接在引线接合焊盘和第二电极区之间以传输功率信号。在底表面和第一电极区域之间设置导电粘合剂以结合并促进两者之间的电连接。

3. 发明申请

US20090279894A1 TRIPLE WAVELENGTH BIDIRECTIONAL OPTICAL COMMUNICATION SYSTEM 审中-公开
标题翻译：三重波长双向光通信系统
公开(公告)号：US20090279894A1
公开(公告)日：2009-11-12
申请号：US12432935
申请日：2009-04-30
申请人： Jin-Shan Pan , Shang-Cheng Liu , Cheng-Ju Wu
发明人： Jin-Shan Pan , Shang-Cheng Liu , Cheng-Ju Wu
IPC分类号： H04J14/02 , H04B10/04 , H04B10/06
CPC分类号： G02B6/4246 , H04B10/40
摘要： A triple wavelength bidirectional optical communication system includes an optical fiber, a transmitter optical subassembly and a receiver optical subassembly. The transmitter optical subassembly includes a first filter, a dual wavelength laser device and a first detector device. The dual wavelength laser device emits a first and a second laser beam to the optical fiber. The first detector device receives a third laser beam emitted from the optical fiber and propagated via the first filter. The receiver optical subassembly includes a second filter, a transceiver device and a second detector device. The transceiver device emits the third laser beam propagated via the second filter and reached to the optical fiber and also receives the first laser beam emitted from the optical fiber and propagated via the second filter. The second detector device receives the second laser beam emitted from the second facet and propagated via the second filter.
摘要翻译：三波长双向光通信系统包括光纤，发射机光学子组件和接收机光学子组件。发射机光学子组件包括第一滤光器，双波长激光器件和第一检测器器件。双波长激光装置向光纤发射第一和第二激光束。第一检测器装置接收从光纤发射并经由第一滤波器传播的第三激光束。接收机光学子组件包括第二滤波器，收发器设备和第二检测器设备。收发器装置发射通过第二滤波器传播的第三激光束并到达光纤并且还接收从光纤发射并经由第二滤波器传播的第一激光束。第二检测器装置接收从第二小面发射并经由第二滤波器传播的第二激光束。

4. 发明授权

US08121167B2 Dual wavelength laser device for optical communication 有权
标题翻译：双波长激光器件用于光通信
公开(公告)号：US08121167B2
公开(公告)日：2012-02-21
申请号：US12436324
申请日：2009-05-06
申请人： Jin-Shan Pan , Shang-Cheng Liu , Cheng-Ju Wu , Chang-Cherng Wu
发明人： Jin-Shan Pan , Shang-Cheng Liu , Cheng-Ju Wu , Chang-Cherng Wu
IPC分类号： H01S5/00
CPC分类号： H01S5/02288 , H01S5/02212 , H01S5/02252 , H01S5/4087
摘要： A dual wavelength laser device including a cap, a header, a first laser chip and a second laser chip. The cap includes a cap body and a lens embedded on the cap body. The header forms an accommodating space with the cap. The first laser chip is arranged in the accommodating space and emitting a first laser beam toward the lens. The second laser chip is arranged in the accommodating space and emitting a second laser beam toward the lens.
摘要翻译：一种双波长激光装置，包括盖，头，第一激光芯片和第二激光芯片。盖包括盖体和埋在盖体上的透镜。头部与帽盖形成容纳空间。第一激光芯片布置在容纳空间中并朝向透镜发射第一激光束。第二激光芯片布置在容纳空间中并朝向透镜发射第二激光束。

5. 发明申请

US20090279898A1 Bi-directional optical device for use in fiber-optic communications 审中-公开
标题翻译：用于光纤通信的双向光学设备
公开(公告)号：US20090279898A1
公开(公告)日：2009-11-12
申请号：US12387797
申请日：2009-05-07
申请人： Jin-Shan Pan , Shang-Cheng Liu , Cheng-Ju Wu
发明人： Jin-Shan Pan , Shang-Cheng Liu , Cheng-Ju Wu
IPC分类号： H04B10/24
CPC分类号： G02B6/4246 , H04B10/40
摘要： A bi-directional optical device includes: a TO cap; a TO header defining a receiving space together with the TO cap; a laser chip provided on the TO header and in the receiving space; and a light-receiving chip provided on the TO header and in the receiving space. The TO cap has a cap body and a lens embeddedly mounted on the cap body. The laser chip emits a first laser beam toward the lens. The light-receiving chip faces the lens and receives a second laser beam transmitted through the lens. The laser chip and the light-receiving chip are packaged together within the receiving space defined by the TO cap and the TO header, so as to effectuate a bi-directional optical device for emitting and receiving light of different wavelengths.
摘要翻译：双向光学装置包括：TO盖; TO头与TO帽一起定义接收空间; 设置在TO头部和接收空间中的激光芯片; 以及设置在TO头部和接收空间中的光接收芯片。 TO盖具有盖体和嵌入式安装在盖体上的透镜。激光芯片朝向透镜发射第一激光束。光接收芯片面向透镜并接收透过透镜的第二激光束。激光芯片和光接收芯片在由TO盖和TO头限定的接收空间内封装在一起，以实现用于发射和接收不同波长的光的双向光学装置。

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