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    • 1. 发明授权
    • Thin film semiconductor solar cell array and method of making
    • 薄膜半导体太阳能电池阵列及其制造方法
    • US4892592A
    • 1990-01-09
    • US270443
    • 1988-11-08
    • Charles R. DicksonBarry J. JohnsonDavid B. Gerhardt
    • Charles R. DicksonBarry J. JohnsonDavid B. Gerhardt
    • H01L27/142
    • B23K26/364B23K26/40H01L31/0463B23K2203/172Y02E10/50Y10S438/94
    • A method of forming laser-patterned conductive elements on a thin film of semiconductor material in a semiconductor device by fabricating a thin film of metal on the semiconductor material and scribing the semiconductor film along a desired pattern with a laser operated at a power density sufficient to ablate the semiconductor material along the desired pattern. The ablation of the semiconductor material produces gases that structurally weaken and burst through the metal film along the desired pattern to form gaps separating the metal film into a plurality of conductive elements, for example, back electrodes on a thin-film photovoltaic module. In a second embodiment, a method of forming a multi-cell thin-film semiconductor device with laser-patterned back electrodes includes the steps of fabricating a plurality of spaced-apart front electrodes on a substrate, fabricating a thin film of semiconductor material on the front electrodes, fabricating a thin film of metal on the semiconductor film, and scribing the metal film along a pattern of lines with a laser operated at a power density sufficient to melt the metal through the underlying semiconductor film and form electrical connections between the metal film and the front electrodes along the scribe lines. Multi-cell, thin-film amorphous silicon photovoltaic modules having back electrodes formed by the above methods also are disclosed.
    • 一种在半导体器件的半导体材料薄膜上形成激光图案化的导电元件的方法,该方法是通过在半导体材料上制造金属薄膜并沿着期望的图案划线半导体膜,并以足够的功率密度 沿所需图案烧蚀半导体材料。 半导体材料的烧蚀产生气体,其沿着所需图案结构地削弱并突破金属膜,以形成将金属膜分离成多个导电元件的间隙,例如薄膜光伏模块上的背电极。 在第二实施例中,形成具有激光图案的背电极的多单元薄膜半导体器件的方法包括以下步骤:在衬底上制造多个间隔开的前电极,在其上制造半导体材料薄膜 前电极,在半导体膜上制造金属薄膜,并且沿着线图案划线金属膜,其中激光以足以使金属通过下面的半导体膜熔化的功率密度进行操作,并形成金属膜之间的电连接 和沿着划痕线的前电极。 还公开了具有通过上述方法形成的背面电极的多单元,薄膜非晶硅光伏模块。
    • 3. 发明授权
    • Apparatus for producing high purity silicon from flames of sodium and
silicon tetrachloride
    • 用于从钠和四氯化硅的火焰中生产高纯度硅的装置
    • US5021221A
    • 1991-06-04
    • US938049
    • 1986-12-04
    • Robert K. GouldCharles R. Dickson
    • Robert K. GouldCharles R. Dickson
    • B01J12/00B01J19/26C01B33/033C30B11/12
    • C30B11/12B01J12/005B01J19/26C01B33/033B01J2219/00058B01J2219/00132B01J2219/00153B01J2219/00159
    • Vaporized silicon halide is mixed with a vaporized alkali metala in a reactor chamber in an exothermic reaction producing liquid silicon droplets and gaseous alkali metal halide, and then passed out of the reactor chamber through a nozzle in a supersonic jet. The supersonic jet is produced by utilizing vacuum means to maintain the exit chamber at a lower pressure than the reactor chamber. Separation of the silicon from the salt by-products is performed by shock wave impaction separation technique wherein the products of the complete reaction between the alkali metal and silicon halide are made to impinge upon an unrestricted, flat surface so that the direction of flow of the gas changes abruptly and a shock zone is created above the flat surface. The silicon droplets are carried by their large forward momentum through the shock zone onto the separating surface where they are deposited. The gaseous alkali metal halide flows across the surface and is thus separated from the silicon product. The silicon droplets are removed in a variety of physical configurations to produce silicon in pellet form, sheet form, ingot form, or single crystal silicon.
    • 将蒸发的卤化硅与反应室中的汽化碱金属在放热反应中混合,产生液体硅液滴和气态碱金属卤化物,然后通过超声波喷嘴的喷嘴从反应室中排出。 通过利用真空装置将出口室保持在比反应器室低的压力下来产生超音速喷射。 通过冲击波冲击分离技术进行硅与盐副产物的分离,其中将碱金属和卤化硅之间的完全反应的产物撞击在无限制的平坦表面上,使得流动方向 气体突然变化,并且在平坦表面上方产生冲击区域。 硅液滴通过其较大的向前动量通过冲击区承载在其沉积的分离表面上。 气态碱金属卤化物流过表面,因此与硅产物分离。 以各种物理构型去除硅液滴,以产生粒状,片状,锭状或单晶硅的硅。
    • 4. 发明授权
    • Deposition feedstock and dopant materials useful in the fabrication of
hydrogenated amorphous silicon alloys for photovoltaic devices and
other semiconductor devices
    • 用于制造用于光伏器件和其他半导体器件的氢化非晶硅合金的沉积原料和掺杂剂材料
    • US4910153A
    • 1990-03-20
    • US315172
    • 1989-02-24
    • Charles R. Dickson
    • Charles R. Dickson
    • H01L31/20
    • H01L31/202H01L31/204Y02E10/50Y02P70/521
    • Compounds having the formula (MX.sub.3).sub.n M'X.sub.4-n wherein M and M' are different Group 4A atoms, at least one of M and M' is silicon, X is hydrogen, halogen or mixtures thereof, and n is an integer between 1 and 4, inclusive, are useful as deposition feedstock materials in the formation of hydrogenated amorphous silicon alloys useful in the fabrication of photovoltaic and other electronically active devices.Dopants having the formula (SiX.sub.3).sub.m L X.sub.3-m wherein L is a Group 5A atom selected from the group of phosphorous, arsenic, antimony and bismuth, X is hydrogen, halogen or mixtures thereof and m is an integer between 1 and 3, inclusive, are useful in the fabrication of negatively-doped hydrogenated amorphous silicon alloys useful in the fabrication of photovoltaic and other electronically active devices.Dopants having the formula YJX.sub.2 wherein Y is halogen or carbonyl, J is a Group 3A atom and X is hydrogen, halogen or mixtures thereof, are useful in the formation of positively-doped hydrogenated amorphous silicon alloys useful in the fabrication of photovoltaic and other electronically active devices.
    • 具有式(MX3)n M'X4-n的化合物,其中M和M'不同于4A族原子,M和M'中的至少一个为硅,X为氢,卤素或其混合物,n为 包括1和4在用于制造光伏和其它电子有源器件的氢化非晶硅合金的形成中可用作沉积原料。 具有式(SiX 3)m L X3-m的掺杂剂,其中L是选自磷,砷,锑和铋的5A族原子,X是氢,卤素或其混合物,m是1和3之间的整数, 包括在内,可用于制造用于制造光伏和其它电子有源器件的负掺杂氢化非晶硅合金。 具有式YJX2的掺杂剂,其中Y是卤素或羰基,J是3A族原子,X是氢,卤素或其混合物,可用于形成用于制造光伏和其他电子的正掺杂氢化非晶硅合金 有源设备。
    • 6. 发明授权
    • Activation by dehydrogenation or dehalogenation of deposition feedstock
and dopant materials useful in the fabrication of hydrogenated
amorphous silicon alloys for photovoltaic devices and other
semiconductor devices
    • 用于制造用于光伏器件和其他半导体器件的氢化非晶硅合金的沉积原料和掺杂剂材料的脱氢或脱卤化活化
    • US4690830A
    • 1987-09-01
    • US830072
    • 1986-02-18
    • Charles R. DicksonDavid E. Carlson
    • Charles R. DicksonDavid E. Carlson
    • H01L21/205H01L29/16H01L31/075H01L31/20B05D3/06
    • H01L31/075H01L21/0245H01L21/02532H01L21/02576H01L21/02579H01L21/0262H01L29/1604H01L31/202H01L31/204Y02E10/548Y02P70/521
    • Compounds having the formula (MX.sub.3).sub.n M'X.sub.4-n wherein M and M' are different Group 4A atoms, at least one of M and M' is silicon, X is hydrogen, halogen or mixtures thereof, and n is an integer between 1 and 4, inclusive, can be activated by dehydrogenation or dehalogenation. These compounds are useful as deposition feedstock materials in the formation of hydrogenated amorphous silicon alloys useful in the fabrication of photovoltaic and other electronically active devices.Dopants having the formula (SiX.sub.3).sub.m L X.sub.3-m wherein L is a Group 5A atom selected from the group of phosphorus, arsenic, antimony and bismuth, X is hydrogen, halogen or mixtures thereof and m is an integer between 1 and 3, inclusive, can be activated by dehydrogenation or dehalogenation. These compounds are useful in the fabrication of negatively-doped hydrogenated amorphous silicon alloys useful in the fabrication of photovoltaic and other electronically active devices.Dopants having the formula YJX.sub.2 wherein Y is halogen or carbonyl, J is a Group 3A atom and X is hydrogen, halogen or mixtures thereof, can be activated by dehydrogenation or dehalogenation. These compounds are useful in the formation of positively-doped hydrogenated amorphous silicon alloys useful in the fabrication of photovoltaic and other electronically active devices.
    • 具有式(MX3)n M'X4-n的化合物,其中M和M'不同于4A族原子,M和M'中的至少一个为硅,X为氢,卤素或其混合物,n为 1和4(包括端值)可以通过脱氢或脱卤激活。 这些化合物可用作形成用于制造光伏和其它电子有源器件的氢化非晶硅合金中的沉积原料。 具有式(SiX 3)m L X3-m的掺杂剂,其中L是选自磷,砷,锑和铋的5A族原子,X是氢,卤素或其混合物,m是1和3之间的整数, 包括,可以通过脱氢或脱卤激活。 这些化合物可用于制造用于制造光伏和其它电子有源器件的负掺杂氢化非晶硅合金。 具有式YJX2的掺杂剂,其中Y是卤素或羰基,J是3A族原子,X是氢,卤素或其混合物,可以通过脱氢或脱卤化来活化。 这些化合物可用于形成用于制造光伏和其它电子有源器件的正掺杂氢化非晶硅合金。