会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 4. 发明授权
    • Method of making a thick-film patch antenna structure
    • 制作厚膜贴片天线结构的方法
    • US5245745A
    • 1993-09-21
    • US799264
    • 1991-11-27
    • Paul C. JensenDavid W. Paananen
    • Paul C. JensenDavid W. Paananen
    • H01Q9/04
    • H01Q9/0407H01Q9/0442Y10T29/49016
    • Method and structure are disclosed for production of a thick-film antenna. A thick-film microwave patch element (26) is patterned onto one surface of a dielectric substrate (32) and a thick-film reference surface (24) disposed onto the opposite surface. The patch element may be placed in different locations on the substrate relative to the feed hole to adjust the impedance and resonant frequency of the antenna before it has been dried and fired while tuning tabs (30) may abut the patch element for use in adjusting the impedance and resonant frequency of the antenna (20) after it has been dried and fired. In one embodiment, the substrate (24) is a ceramic material having an alumina content of about 96%. A multiple-frequency antenna can be created by stacking patch elements and dielectric layers above the reference surface.
    • 公开了制造厚膜天线的方法和结构。 将厚膜微波贴片元件(26)图案化到介电基片(32)的一个表面和设置在相对表面上的厚膜参考表面(24)。 贴片元件可以相对于馈电孔放置在衬底上的不同位置,以在天线干燥和点火之前调整天线的阻抗和谐振频率,同时调谐片(30)可以邻接贴片元件以用于调整 天线(20)在干燥和点火之后的阻抗和谐振频率。 在一个实施方案中,基材(24)是具有约96%的氧化铝含量的陶瓷材料。 可以通过在参考表面上方堆叠贴片元件和电介质层来创建多频天线。
    • 6. 发明授权
    • Method of manufacture of high dielectric antenna structure
    • 高介电天线结构的制造方法
    • US5315753A
    • 1994-05-31
    • US13590
    • 1993-02-04
    • Paul C. JensenDavid W. Paananen
    • Paul C. JensenDavid W. Paananen
    • H01Q9/04H01P11/06
    • H01Q9/0407H01Q9/0442Y10T29/49016
    • The present invention discloses a method for manufacturing a high dielectric antenna structure. In one embodiment, one or more high dielectric film layers are applied to a dielectric base layer by silk-screening to yield a dielectric structure having a dielectric constant greater than that of the dielectric base layer. After firing, a patch antenna element having a predetermined configuration is disposed on the top surface of the dielectric structure by silk-screening a conductive paste thereupon and firing. A ground plane is disposed on the bottom surface of the dielectric structure by silk-screening a conductive paste thereupon and firing. A pre-drilled dielectric base layer may be employed with registered holes defined in the various silk-screened layers to provide access for an RF feed means, or alternatively, a feed hole can be bored through the antenna structure to permit interconnection between an RF feed means and the patch antenna element. For multiple-frequency applications, additional stacked dielectric structures and patch antenna elements can be manufactured according to the disclosed method, with the uppermost patch antenna element being interconnected with the RF feed means.
    • 本发明公开了一种高介电天线结构的制造方法。 在一个实施例中,通过丝网筛选将一个或多个高电介质膜层施加到电介质基底层,以产生介电常数大于介电基底层的介电常数的电介质结构。 在烧制之后,通过丝网印刷导电膏并进行烧制,将具有预定构造的贴片天线元件设置在电介质结构的顶表面上。 通过丝网印刷导电膏并进行烧制,将接地平面设置在电介质结构的底表面上。 可以使用预先钻孔的电介质基层,其中限定在各种丝网层中的注册孔以提供对RF馈送装置的访问,或者可以通过天线结构钻出馈送孔,以允许RF馈送 装置和贴片天线元件。 对于多频应用,可以根据所公开的方法制造附加的堆叠介质结构和贴片天线元件,其中最上面的贴片天线元件与RF馈送装置互连。