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1. 发明申请

US20090212790A1 METHOD OF ESTIMATING CHANNEL BANDWIDTH FROM A TIME DOMAIN REFLECTOMETER (TDR) MEASUREMENT 审中-公开
标题翻译：估计来自时域反射计（TDR）测量的通道带宽的方法
公开(公告)号：US20090212790A1
公开(公告)日：2009-08-27
申请号：US12431037
申请日：2009-04-28
申请人： Charles A. Miller , Jim Chih-Chiang Tseng
发明人： Charles A. Miller , Jim Chih-Chiang Tseng
IPC分类号： G01R27/06
CPC分类号： G01R27/04
摘要： Bandwidth of a test channel is determined from a single port Time Domain Reflectometer (TDR) measurement with the channel terminated in a short or an open circuit. Bandwidth is estimated by: (1) making a TDR measurement of a channel terminated in a short or open circuit; (2) determining a maximum slope of the reflection from the TDR measurement; (2) calculating an interpolated rise or fall time, for example by taking 80% of the applied voltage between the 10% and 90% points, and then dividing the applied voltage by the maximum slope determined; (3) dividing the overall interpolated rise time by the square root of two to account for the TDR signal proceeding through the channel twice; (4) removing the contribution of rise time from measurement equipment; and (5) completing calculation of channel bandwidth using a formula to relate bandwidth to rise time, such as: bandwidth=0.35/rise time.
摘要翻译：测试通道的带宽由单端口时域反射计（TDR）测量确定，通道以短路或开路端接。带宽通过以下方式估计：（1）使TDR测量在短路或开路中终止; （2）从TDR测量确定反射的最大斜率; （2）例如通过将所施加的电压的80％乘以10％和90％之间的点来计算内插的上升或下降时间，然后将所施加的电压除以所确定的最大斜率; （3）将整体内插上升时间除以二的平方根以考虑通过信道进行的TDR信号两次; （4）消除测量设备上升时间的贡献; 并且（5）使用公式来完成信道带宽的计算，以将带宽与上升时间相关联，例如：带宽= 0.35 /上升时间。

2. 发明授权

US07525302B2 Method of estimating channel bandwidth from a time domain reflectometer (TDR) measurement using rise time and maximum slope 失效
标题翻译：使用上升时间和最大斜率从时域反射计（TDR）测量中估计通道带宽的方法
公开(公告)号：US07525302B2
公开(公告)日：2009-04-28
申请号：US11048383
申请日：2005-01-31
申请人： Charles A. Miller , Jim Chih-Chiang Tseng
发明人： Charles A. Miller , Jim Chih-Chiang Tseng
IPC分类号： G01R27/04
CPC分类号： G01R27/04
摘要： Bandwidth of a test channel is determined from a single port Time Domain Reflectometer (TDR) measurement with the channel terminated in a short or an open circuit. Bandwidth is estimated by: (1) making a TDR measurement of a channel terminated in a short or open circuit; (2) determining a maximum slope of the reflection from the TDR measurement; (3) calculating an interpolated rise or fall time, for example by taking 80% of the applied voltage between the 10% and 90% points, and then dividing the applied voltage by the maximum slope determined; (4) dividing the overall interpolated rise time by the square root of two to account for the TDR signal proceeding through the channel twice; (5) removing the contribution of rise time from measurement equipment; and (6) completing calculation of channel bandwidth using a formula to relate bandwidth to rise time, such as: bandwidth=0.35/rise time.
摘要翻译：测试通道的带宽由单端口时域反射计（TDR）测量确定，通道以短路或开路端接。带宽通过以下方式估计：（1）使TDR测量在短路或开路中终止; （2）从TDR测量确定反射的最大斜率; （3）例如通过将所施加的电压的80％乘以10％至90％的点来计算内插的上升或下降时间，然后将所施加的电压除以所确定的最大斜率; （4）将整体内插上升时间除以二的平方根以考虑通过通道进行的TDR信号两次; （5）消除测量设备上升时间的贡献; 和（6）使用公式来完成信道带宽的计算，以将带宽与上升时间相关联，例如：带宽= 0.35 /上升时间。

3. 发明授权

US07196531B2 Method of manufacturing a probe card 有权
公开(公告)号：US07196531B2
公开(公告)日：2007-03-27
申请号：US11073187
申请日：2005-03-04
申请人： Gary W. Grube , Igor Y. Khandros , Benjamin N. Eldridge , Gaetan L. Mathieu , Poya Lotfizadeh , Jim Chih-Chiang Tseng
发明人： Gary W. Grube , Igor Y. Khandros , Benjamin N. Eldridge , Gaetan L. Mathieu , Poya Lotfizadeh , Jim Chih-Chiang Tseng
IPC分类号： G01R31/02 , G01R31/26 , G06F17/50
CPC分类号： G01R31/2886 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R1/07378 , G01R3/00 , Y10T29/49126
摘要： A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.

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