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    • 1. 发明申请
    • CARRIER SYSTEM FOR AN ELECTRICAL CONNECTOR ASSEMBLY
    • 用于电气连接器总成的承载系统
    • US20110250788A1
    • 2011-10-13
    • US12758083
    • 2010-04-12
    • ANDREW CHARLES DAVISONCRAIG WARREN HORNUNGJOHN JOSEPH CONSOLI
    • ANDREW CHARLES DAVISONCRAIG WARREN HORNUNGJOHN JOSEPH CONSOLI
    • H01R13/60
    • H01R13/518H01R12/724
    • An electrical connector assembly includes a first connector module including pins configured to be terminated to a circuit board and a second connector module including pins configured to be terminated to the circuit board. The electrical connector assembly also includes a carrier system including an organizer having openings therethrough in a predetermined pattern. The organizer is coupled to the first and second connector modules such that at least some of the pins of the first connector module extend through the openings of the organizer and such that at least some of the pins of the second connector module extend through the openings of the organizer. The first connector module, the second connector module and the organizer are configured to be mounted to the circuit board as a bundled unit.
    • 电连接器组件包括第一连接器模块,该第一连接器模块包括被配置为端接到电路板的引脚,以及包括被配置为端接到电路板的引脚的第二连接器模块。 电连接器组件还包括载体系统,其包括具有以预定图案穿过的开口的组织器。 组织器耦合到第一和第二连接器模块,使得第一连接器模块的至少一些销延伸穿过组织器的开口,并且使得第二连接器模块的至少一些销延伸穿过 组织者。 第一连接器模块,第二连接器模块和组织器被配置为作为捆绑单元安装到电路板。
    • 2. 发明申请
    • LAND GRID ARRAY INTERCONNECT
    • US20120156899A1
    • 2012-06-21
    • US12973071
    • 2010-12-20
    • MYOUNGSOO JEONATTALEE SNARR TAYLORCRAIG WARREN HORNUNG
    • MYOUNGSOO JEONATTALEE SNARR TAYLORCRAIG WARREN HORNUNG
    • H01R12/52
    • H01R12/52H01R12/57
    • A land grid array interconnect has a substrate that has a first surface and a second surface. The substrate has a plurality of vias extending therethrough. The substrate has first pads on the first surface electrically connected to corresponding vias and has second pads on the second surface electrically connected to corresponding vias and corresponding first pads. A contact array is coupled to the first surface of the substrate. The contact array has a metal plate that defines a carrier and a plurality of contacts formed from the metal plate and held by the carrier. The contacts have contact heels and beams extending from corresponding contact heels. The contact heels are soldered to corresponding first pads. The contacts are singulated from the carrier after the contact heels are soldered to the first pads. The carrier is removed from the substrate after the contacts are singulated leaving the individual contacts soldered to corresponding first pads.
    • 地面阵列互连具有具有第一表面和第二表面的基底。 衬底具有穿过其中延伸的多个通孔。 衬底在第一表面上具有电连接到对应的通孔的第一焊盘,并且在第二表面上具有电连接到相应的通孔和对应的第一焊盘的第二焊盘。 接触阵列耦合到衬底的第一表面。 接触阵列具有限定载体的金属板和由金属板形成并由载体保持的多个触点。 触点具有从相应的接触脚跟延伸的接触脚跟和梁。 接触脚跟被焊接到相应的第一垫。 在将接触脚跟焊接到第一衬垫之后,将触头从载体上分离出来。 在将触点分开之后,将载体从基板上移除,使各个触点焊接到相应的第一焊盘。