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1. 发明授权

US09791112B2 Serial and parallel LED configurations for linear lighting modules 有权
公开(公告)号：US09791112B2
公开(公告)日：2017-10-17
申请号：US14582194
申请日：2014-12-24
申请人： Bridgelux, Inc.
发明人： Jesus Del Castillo , Vladimir Odnoblyudov
IPC分类号： F21S4/00 , F21V21/00 , F21K9/278 , F21Y103/10 , F21Y115/10 , H05K1/18
CPC分类号： F21K9/278 , F21Y2103/10 , F21Y2115/10 , H05K1/189 , H05K2201/10106
摘要： A linear lighting module includes a first string of series-connected LED dies and a second string of series-connected LED dies. The first string of LED dies is coupled in parallel with the second string of LED dies. All of the LED dies of the first and second strings are aligned with respect to one another. The LED dies of the first string and the second string form a combined string of interleaved LED dies such that an LED die of the second string is disposed between every successive pair of LED dies of the first string. The LED dies of the combined string are mounted on a flexible substrate. Each LED die of the combined string is electrically connected to two conductors. Except for the two end LED dies of the combined string, each successive LED die must be accessed by both conductors from alternating sides of the combined string.

2. 发明授权

US09756697B2 Monolithic LED chip in an integrated control module with active circuitry 有权
公开(公告)号：US09756697B2
公开(公告)日：2017-09-05
申请号：US15186343
申请日：2016-06-17
申请人： Bridgelux, Inc.
发明人： Vladimir Odnoblyudov , Jesus Del Castillo
IPC分类号： H05B33/08 , H01L25/075 , H01L33/62 , H01L25/16 , H01L33/50 , H01L33/56 , H01L33/32 , H05B37/02
CPC分类号： H05B33/0869 , H01L25/0753 , H01L25/167 , H01L33/32 , H01L33/50 , H01L33/504 , H01L33/507 , H01L33/56 , H01L33/62 , H01L2924/0002 , H05B33/0812 , H05B33/0815 , H05B33/0827 , H05B33/083 , H05B37/0227 , H01L2924/00
摘要： A lighting device includes a monolithic LED chip flip-chip mounted onto an interconnect structure. The monolithic chip includes LED junctions formed from a single LED junction. An active electronic component is also mounted onto the interconnect structure at a distance from the monolithic chip that is less than five times the maximum dimension of the monolithic chip. The active electronic component controls LED drive currents independently supplied to the LED junctions. Different types of phosphor are disposed laterally above the various LED junctions. A color sensor measures the light emitted from the lighting device when drive currents are supplied to first and second LED junctions. The active electronic component then supplies more drive current to the first LED junction than to the second LED junction in response to the color sensor measuring the light emitted when the prior LED drive currents are supplied to the first and second LED junctions.

3. 发明申请

US20160186940A1 Serial and Parallel LED Configurations for Linear Lighting Modules 有权
标题翻译：线性照明模块的串行和并行LED配置
公开(公告)号：US20160186940A1
公开(公告)日：2016-06-30
申请号：US14582194
申请日：2014-12-24
申请人： Bridgelux, Inc.
发明人： Jesus Del Castillo , Vladimir Odnoblyudov
IPC分类号： F21S4/00
CPC分类号： F21K9/278 , F21Y2103/10 , F21Y2115/10 , H05K1/189 , H05K2201/10106
摘要： A linear lighting module includes a first string of series-connected LED dies and a second string of series-connected LED dies. The first string of LED dies is coupled in parallel with the second string of LED dies. All of the LED dies of the first and second strings are aligned with respect to one another. The LED dies of the first string and the second string form a combined string of interleaved LED dies such that an LED die of the second string is disposed between every successive pair of LED dies of the first string. The LED dies of the combined string are mounted on a flexible substrate. Each LED die of the combined string is electrically connected to two conductors. Except for the two end LED dies of the combined string, each successive LED die must be accessed by both conductors from alternating sides of the combined string.
摘要翻译：线性照明模块包括串联连接的LED管芯的第一串和串联连接的LED管芯的第二串。第一串LED管芯与第二串LED管并联。第一和第二串的所有LED管芯相对于彼此对准。第一串和第二串的LED管芯形成交错的LED管芯的组合串，使得第二串的LED管芯设置在第一串的每个连续的一对LED管芯之间。组合灯串的LED管芯安装在柔性基板上。组合串的每个LED管芯电连接到两个导体。除了组合串的两端LED芯片，每个连续的LED管芯必须由组合串的交替侧的两个导体访问。

4. 发明授权

US10066792B2 Serial and parallel LED configurations for linear lighting modules 有权
公开(公告)号：US10066792B2
公开(公告)日：2018-09-04
申请号：US15650900
申请日：2017-07-15
申请人： Bridgelux, Inc.
发明人： Jesus Del Castillo , Vladimir Odnoblyudov
IPC分类号： F21K9/278 , F21Y103/10 , F21Y115/10 , H05K1/18
摘要： A linear lighting module includes a first string of series-connected LED dies and a second string of series-connected LED dies. The first string of LED dies is coupled in parallel with the second string of LED dies. All of the LED dies of the first and second strings are aligned with respect to one another. The LED dies of the first string and the second string form a combined string of interleaved LED dies such that an LED die of the second string is disposed between every successive pair of LED dies of the first string. The LED dies of the combined string are mounted on a flexible substrate. Each LED die of the combined string is electrically connected to two conductors. Except for the two end LED dies of the combined string, each successive LED die must be accessed by both conductors from alternating sides of the combined string.

5. 发明申请

US20160143110A1 Monolithic LED Chip in an Integrated Control Module with Active Circuitry 有权
公开(公告)号：US20160143110A1
公开(公告)日：2016-05-19
申请号：US15008358
申请日：2016-01-27
申请人： Bridgelux, Inc.
发明人： Vladimir Odnoblyudov , Jesus Del Castillo
IPC分类号： H05B33/08 , H01L33/62 , H01L33/50
CPC分类号： H05B33/0869 , H01L25/0753 , H01L25/167 , H01L33/32 , H01L33/50 , H01L33/504 , H01L33/507 , H01L33/56 , H01L33/62 , H01L2924/0002 , H05B33/0812 , H05B33/0815 , H05B33/0827 , H05B33/083 , H05B37/0227 , H01L2924/00
摘要： A lighting device includes a monolithic LED chip flip-chip mounted onto an interconnect structure. The monolithic chip includes LED junctions formed from a single LED junction. An active electronic component is also mounted onto the interconnect structure at a distance from the monolithic chip that is less than five times the maximum dimension of the monolithic chip. The active electronic component controls LED drive currents independently supplied to the LED junctions. Different types of phosphor are disposed laterally above the various LED junctions. A color sensor measures the light emitted from the lighting device when drive currents are supplied to first and second LED junctions. The active electronic component then supplies more drive current to the first LED junction than to the second LED junction in response to the color sensor measuring the light emitted when the prior LED drive currents are supplied to the first and second LED junctions.

6. 发明申请

US20150382426A1 Monolithic LED Chip in an Integrated Control Module with Active Circuitry 有权
标题翻译：具有主动电路的集成控制模块中的单片LED芯片
公开(公告)号：US20150382426A1
公开(公告)日：2015-12-31
申请号：US14318383
申请日：2014-06-27
申请人： BRIDGELUX, INC.
发明人： Vladimir Odnoblyudov , Jesus Del Castillo
IPC分类号： H05B33/08 , H01L33/62 , H01L33/32 , H01L33/50 , H01L33/56 , H01L25/075 , H01L25/16
CPC分类号： H05B33/0869 , H01L25/0753 , H01L25/167 , H01L33/32 , H01L33/50 , H01L33/504 , H01L33/507 , H01L33/56 , H01L33/62 , H01L2924/0002 , H05B33/0812 , H05B33/0815 , H05B33/0827 , H05B33/083 , H05B37/0227 , H01L2924/00
摘要： A lighting device includes a monolithic LED chip flip-chip mounted onto an interconnect structure. The monolithic chip includes LED junctions formed from a single LED junction. An active electronic component is also mounted onto the interconnect structure at a distance from the monolithic chip that is less than five times the maximum dimension of the monolithic chip. The active electronic component controls LED drive currents independently supplied to the LED junctions. Different types of phosphor are disposed laterally above the various LED junctions. A color sensor measures the light emitted from the lighting device when drive currents are supplied to first and second LED junctions. The active electronic component then supplies more drive current to the first LED junction than to the second LED junction in response to the color sensor measuring the light emitted when the prior LED drive currents are supplied to the first and second LED junctions.
摘要翻译：照明装置包括安装在互连结构上的单片LED芯片倒装芯片。单片芯片包括由单个LED结形成的LED结。有源电子部件也被安装到互连结构上距离单片芯片一小距离的单片芯片的最大尺寸的五倍。有源电子部件控制独立提供给LED结的LED驱动电流。不同类型的荧光体被布置在各个LED结的横向上方。当驱动电流被提供给第一和第二LED结时，颜色传感器测量从照明装置发射的光。响应于颜色传感器测量当将现有LED驱动电流提供给第一和第二LED结时所发射的光，有源电子部件随后向第一LED结提供更多的驱动电流而不是第二LED结。

7. 发明授权

US11448381B2 Light-emitting device with reflective ceramic substrate 有权
公开(公告)号：US11448381B2
公开(公告)日：2022-09-20
申请号：US17346966
申请日：2021-06-14
申请人： BRIDGELUX, INC.
发明人： Jesus Del Castillo , Scott West , Vladimir Odnoblyudov
IPC分类号： F21K9/64 , F21V7/00 , F21V23/00 , F21V29/503 , F21K9/60 , F21V9/32 , F21V13/08 , F21Y115/10
摘要： A light-emitting device may include a ceramic substrate having a reflective component, a light-emitting diode on the ceramic substrate, and a light-converting material over the light-emitting diode. A lighting system may include a ceramic substrate having a reflective component, a plurality of light-emitting diodes connected together in series, wherein the plurality of light-emitting diodes are on the ceramic substrate, and a light-converting material over the plurality of light-emitting diodes. The ceramic substrate may provide electrical insulation between the light-emitting diode and the aluminum carrier. The ceramic substrate may provide thermal conductivity between the light-emitting diode and the aluminum carrier. The reflective component may include zirconium oxide. The ceramic substrate may include aluminum oxide and/or aluminum nitride. The light-converting material may include phosphor. The light-emitting diode may have an epitaxial diode structure.

8. 发明申请

US20160302283A1 Monolithic LED Chip in an Integrated Control Module with Active Circuitry 有权
公开(公告)号：US20160302283A1
公开(公告)日：2016-10-13
申请号：US15186343
申请日：2016-06-17
申请人： Bridgelux, Inc.
发明人： Vladimir Odnoblyudov , Jesus Del Castillo
IPC分类号： H05B33/08 , H01L33/62 , H01L33/50 , H05B37/02 , H01L33/56
CPC分类号： H05B33/0869 , H01L25/0753 , H01L25/167 , H01L33/32 , H01L33/50 , H01L33/504 , H01L33/507 , H01L33/56 , H01L33/62 , H01L2924/0002 , H05B33/0812 , H05B33/0815 , H05B33/0827 , H05B33/083 , H05B37/0227 , H01L2924/00
摘要： A lighting device includes a monolithic LED chip flip-chip mounted onto an interconnect structure. The monolithic chip includes LED junctions formed from a single LED junction. An active electronic component is also mounted onto the interconnect structure at a distance from the monolithic chip that is less than five times the maximum dimension of the monolithic chip. The active electronic component controls LED drive currents independently supplied to the LED junctions. Different types of phosphor are disposed laterally above the various LED junctions. A color sensor measures the light emitted from the lighting device when drive currents are supplied to first and second LED junctions. The active electronic component then supplies more drive current to the first LED junction than to the second LED junction in response to the color sensor measuring the light emitted when the prior LED drive currents are supplied to the first and second LED junctions.

9. 发明授权

US11060697B2 Light-emitting device with reflective ceramic substrate 有权
公开(公告)号：US11060697B2
公开(公告)日：2021-07-13
申请号：US16879498
申请日：2020-05-20
申请人： BRIDGELUX, INC.
发明人： Jesus Del Castillo , Scott West , Vladimir Odnoblyudov
IPC分类号： F21K9/64 , F21V7/00 , F21V23/00 , F21V29/503 , F21K9/60 , F21V9/32 , F21V13/08 , F21Y115/10
摘要： A light-emitting device may include a ceramic substrate having a reflective component, a light-emitting diode on the ceramic substrate, and a light-converting material over the light-emitting diode. A lighting system may include a ceramic substrate having a reflective component, a plurality of light-emitting diodes connected together in series, wherein the plurality of light-emitting diodes are on the ceramic substrate, and a light-converting material over the plurality of light-emitting diodes. The ceramic substrate may provide electrical insulation between the light-emitting diode and the aluminum carrier. The ceramic substrate may provide thermal conductivity between the light-emitting diode and the aluminum carrier. The reflective component may include zirconium oxide. The ceramic substrate may include aluminum oxide and/or aluminum nitride. The light-converting material may include phosphor. The light-emitting diode may have an epitaxial diode structure.

10. 发明授权

US10663142B2 Light-emitting device with reflective ceramic substrate 有权
公开(公告)号：US10663142B2
公开(公告)日：2020-05-26
申请号：US14231657
申请日：2014-03-31
申请人： BRIDGELUX, INC.
发明人： Jesus Del Castillo , Scott West , Vladimir Odnoblyudov
IPC分类号： F21K9/64 , F21V7/00 , F21V23/00 , F21V29/503 , F21V9/30 , F21K9/60 , F21Y115/10
摘要： A light-emitting device may include a ceramic substrate having a reflective component, a light-emitting diode on the ceramic substrate, and a light-converting material over the light-emitting diode. A lighting system may include a ceramic substrate having a reflective component, a plurality of light-emitting diodes connected together in series, wherein the plurality of light-emitting diodes are on the ceramic substrate, and a light-converting material over the plurality of light-emitting diodes. The ceramic substrate may provide electrical insulation between the light-emitting diode and the aluminum carrier. The ceramic substrate may provide thermal conductivity between the light-emitting diode and the aluminum carrier. The reflective component may include zirconium oxide. The ceramic substrate may include aluminum oxide and/or aluminum nitride. The light-converting material may include phosphor. The light-emitting diode may have an epitaxial diode structure.

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