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    • 3. 发明授权
    • Amplifying a signal using a current shared power amplifier
    • 使用当前的共享功率放大器放大信号
    • US07256654B2
    • 2007-08-14
    • US11104777
    • 2005-04-12
    • Mikel J. WhiteScott M. HestonJohn G. Heston
    • Mikel J. WhiteScott M. HestonJohn G. Heston
    • H03F3/68
    • H03F3/505
    • A power amplifier includes amplifier stages. An amplifier stage includes a transistor, and at least one amplifier stage comprises a driver stage. The amplifier stages include a first amplifier stage having a first transistor and associated with a first output power, and a second amplifier stage having a second transistor and associated with a second output power. A current sharing coupling couples the first amplifier stage and the second amplifier stage. The first amplifier stage and the second amplifier stage share a current through the current sharing coupling. The current sharing coupling facilitates scaling of the first output power and the second output power.
    • 功率放大器包括放大器级。 放大器级包括晶体管,并且至少一个放大器级包括驱动器级。 放大器级包括具有第一晶体管并与第一输出功率相关联的第一放大器级,以及具有第二晶体管并与第二输出功率相关联的第二放大器级。 电流分配耦合耦合第一放大器级和第二放大级。 第一放大器级和第二放大器级通过电流共享耦合共享电流。 电流共享耦合有助于缩放第一输出功率和第二输出功率。
    • 4. 发明申请
    • HIGH POWER RF SWITCH WITH ACTIVE DEVICE SIZE TAPERING
    • 具有主动设备大功率的大功率RF开关
    • US20110267154A1
    • 2011-11-03
    • US12772903
    • 2010-05-03
    • James M. CarrollJohn R. StantonJohn G. Heston
    • James M. CarrollJohn R. StantonJohn G. Heston
    • H01P1/15
    • H03K17/693H03K2217/0036
    • In an improved T/R switch configuration of a radio transceiver, the sizes of active switches coupled in series between the receive port and the common port are tapered such that the voltage referenced to ground across the active devices of the T/R switch is more evenly distributed among the switches which increases the power handling capability of that path. According to one embodiment of the present invention, an RF switch includes a plurality of first switches coupled in series between a transmit port and a common port for transmitting an RF signal, and a plurality of second switches coupled in series between a receive port and the common port. At least two of the plurality of second switches have different sizes such that the at least two of the second switches have substantially the same nodal impedance with respect to a frequency of the RF signal and an RF ground.
    • 在无线电收发器的改进的T / R开关配置中,在接收端口和公共端口之间串联耦合的有源开关的尺寸是锥形的,使得参考T / R开关的有源器件的接地电压更大 均匀地分布在交换机中,这增加了该路径的功率处理能力。 根据本发明的一个实施例,RF开关包括串联耦合在发射端口和用于发射RF信号的公共端口之间的多个第一开关,以及串联耦合在接收端口和 普通港口 多个第二开关中的至少两个具有不同的尺寸,使得至少两个第二开关相对于RF信号和RF地的频率具有基本上相同的节点阻抗。
    • 5. 发明授权
    • Power absorber system and method
    • 功率吸收系统及方法
    • US07385456B2
    • 2008-06-10
    • US11129262
    • 2005-05-12
    • David D. HestonJohn G. HestonThomas L. Middlebrook, III
    • David D. HestonJohn G. HestonThomas L. Middlebrook, III
    • H01P1/22
    • H03G11/025
    • According to one embodiment of the invention, a power absorber for receiving a signal having a fundamental frequency includes an input node for receiving the signal and a first PIN diode circuit having a first end electrically connected at the input node and a second end. The first PIN diode circuit includes at least one PIN diode. The absorber also includes a load resistance having a first end electrically connected to the second end of the PIN diode circuit and a second end electrically connected to a reference voltage. The absorber also includes a quarter wave transmission line having a first end electrically connected to the input node at a second end. The quarter wave transmission line has an electrical link that is one quarter of the wavelength of the fundamental frequency. The power absorber also includes a second PIN diode circuit having an input electrically connected to the second end of the quarter wave transmission line and an output electrically connected to the reference voltage. The first choke is provided in parallel with the load resistor.
    • 根据本发明的一个实施例,用于接收具有基频的信号的功率吸收器包括用于接收信号的输入节点和具有在输入节点处电连接的第一端和第二端的第一PIN二极管电路。 第一PIN二极管电路包括至少一个PIN二极管。 吸收器还包括负载电阻,其具有电连接到PIN二极管电路的第二端的第一端和电连接到参考电压的第二端。 吸收器还包括四分之一波长传输线,其具有在第二端电连接到输入节点的第一端。 四分之一波长传输线具有基频的四分之一的电连接。 功率吸收器还包括第二PIN二极管电路,其具有电连接到四分之一波长传输线的第二端的输入端和与参考电压电连接的输出。 第一个扼流圈与负载电阻并联提供。
    • 6. 发明授权
    • High power RF switch with active device size tapering
    • 大功率RF开关,有源器件尺寸逐渐减小
    • US08390395B2
    • 2013-03-05
    • US12772903
    • 2010-05-03
    • James M. CarrollJohn R. StantonJohn G. Heston
    • James M. CarrollJohn R. StantonJohn G. Heston
    • H01P1/15H03L5/00
    • H03K17/693H03K2217/0036
    • In an improved T/R switch configuration of a radio transceiver, the sizes of active switches coupled in series between the receive port and the common port are tapered such that the voltage referenced to ground across the active devices of the T/R switch is more evenly distributed among the switches which increases the power handling capability of that path. According to one embodiment of the present invention, an RF switch includes a plurality of first switches coupled in series between a transmit port and a common port for transmitting an RF signal, and a plurality of second switches coupled in series between a receive port and the common port. At least two of the plurality of second switches have different sizes such that the at least two of the second switches have substantially the same nodal impedance with respect to a frequency of the RF signal and an RF ground.
    • 在无线电收发器的改进的T / R开关配置中,在接收端口和公共端口之间串联耦合的有源开关的尺寸是锥形的,使得参考T / R开关的有源器件的接地电压更大 均匀地分布在交换机中,这增加了该路径的功率处理能力。 根据本发明的一个实施例,RF开关包括串联耦合在发射端口和用于发射RF信号的公共端口之间的多个第一开关,以及串联耦合在接收端口和 普通港口 多个第二开关中的至少两个具有不同的尺寸,使得至少两个第二开关相对于RF信号和RF地的频率具有基本上相同的节点阻抗。
    • 8. 发明授权
    • Method and apparatus for combining multiple integrated circuits
    • 用于组合多个集成电路的方法和装置
    • US07253517B2
    • 2007-08-07
    • US10694873
    • 2003-10-28
    • John G. Heston
    • John G. Heston
    • H01L23/34H01L23/02
    • H01L25/0655H01L2224/16H01L2225/06513H01L2225/06517Y10T29/53174
    • An apparatus includes a circuit having first, second and third circuit portions, the first and third circuit portions each including at least one semiconductor circuit component. The second circuit portion includes at least one non-semiconductor circuit component, and is free of semiconductor circuit components. A first substrate has the first and second circuit portions disposed adjacent one side thereof. A second substrate is physically separate from the first substrate, and has the third circuit portion disposed adjacent a side thereof which faces the one side of the first substrate. The second and third circuit portions have electrically conductive parts which are coupled by thermo-formed bonds.
    • 一种装置包括具有第一,第二和第三电路部分的电路,第一和第三电路部分各自包括至少一个半导体电路部件。 第二电路部分包括至少一个非半导体电路部件,并且不含半导体电路部件。 第一基板具有邻近其一侧设置的第一和第二电路部分。 第二基板在物理上与第一基板分开,并且第三电路部分邻近其面向第一基板的一侧的一侧设置。 第二和第三电路部分具有通过热成形接合耦合的导电部件。