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1. 发明授权

US06227585B1 Apparatus and methods for handling a substrate 有权
公开(公告)号：US06227585B1
公开(公告)日：2001-05-08
申请号：US09206087
申请日：1998-12-04
申请人： Boris Govzman , Konstantin Volodarsky , Leon Volfovski
发明人： Boris Govzman , Konstantin Volodarsky , Leon Volfovski
IPC分类号： B25J1506
摘要： Substrate handling apparatus and methods are described. In one aspect, the substrate handling apparatus includes a clamping member having an extended condition wherein substrate movement relative to the transfer arm is substantially restricted and a retracted condition wherein substrate movement relative to the transfer arm is substantially free. The substrate handling apparatus further includes a sense mechanism (e.g., a vacuum sensor) constructed to determine whether a substrate is properly positioned on the support arm and to trigger the mode of operation of the clamping member between extended and retracted conditions. The sense mechanism also provides information relating to the operating condition of the clamping member.

2. 发明授权

US06454332B1 Apparatus and methods for handling a substrate 失效
标题翻译：用于处理衬底的装置和方法
公开(公告)号：US06454332B1
公开(公告)日：2002-09-24
申请号：US09206087
申请日：1998-12-04
申请人： Boris Govzman , Konstantin Volodarsky , Leon Volfovski
发明人： Boris Govzman , Konstantin Volodarsky , Leon Volfovski
IPC分类号： B25J1506
CPC分类号： H01L21/681 , Y10S294/907 , Y10S414/141
摘要： Substrate handling apparatus and methods are described. In one aspect, the substrate handling apparatus includes a clamping member having an extended condition wherein substrate movement relative to the transfer arm is substantially restricted and a retracted condition wherein substrate movement relative to the transfer arm is substantially free. The substrate handling apparatus further includes a sense mechanism (e.g., a vacuum sensor) constructed to determine whether a substrate is properly positioned on the support arm and to trigger the mode of operation of the clamping member between extended and retracted conditions. The sense mechanism also provides information relating to the operating condition of the clamping member.
摘要翻译：基板处理装置和方法进行说明。在一个方面，基板处理装置包括具有延伸状态的夹紧构件，其中相对于传送臂的基板移动被基本上限制，并且其中相对于传送臂的基板移动基本上是空闲的缩回状态。衬底处理装置还包括感测机构（例如，真空传感器），其被构造成确定衬底是否被适当地定位在支撑臂上并且在延伸和缩回状态之间触发夹紧构件的操作模式。感测机构还提供与夹紧构件的操作状态有关的信息。

3. 发明授权

US06604988B2 Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein 失效
公开(公告)号：US06604988B2
公开(公告)日：2003-08-12
申请号：US10252149
申请日：2002-09-20
申请人： Homayoun Talieh , Konstantin Volodarsky , Jalal Ashjaee , Douglas W. Young
发明人： Homayoun Talieh , Konstantin Volodarsky , Jalal Ashjaee , Douglas W. Young
IPC分类号： B24B2100
CPC分类号： B24B21/04 , B24B21/08 , B24B21/22 , B24B37/013 , B24B37/04 , B24B37/205 , B24B47/04 , B24B49/16
摘要： The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt as it polishes the wafer provides superior planarity and uniformity across the wafer surface. When a fresh portion of the pad is required, the pad is moved through a drive system containing rollers, such that the rollers only touch a back side of the pad, thereby minimizing sources of friction other than the wafer that is being polished from the polishing side of the pad, and maximizing the lifetime of the polishing pad.

4. 发明授权

US06468139B1 Polishing apparatus and method with a refreshing polishing belt and loadable housing 有权
标题翻译：抛光装置和方法具有清爽的抛光带和可装载的外壳
公开(公告)号：US06468139B1
公开(公告)日：2002-10-22
申请号：US09684059
申请日：2000-10-06
申请人： Homayoun Talieh , Konstantin Volodarsky , Jalal Ashjaee , Douglas W. Young
发明人： Homayoun Talieh , Konstantin Volodarsky , Jalal Ashjaee , Douglas W. Young
IPC分类号： B24B2100
CPC分类号： B24B37/205 , B24B21/04 , B24B37/04 , B24B47/04
摘要： The present invention is directed to methods and apparatus for polishing a surface of a semiconductor wafer using a pad or belt moveable in both forward and reverse directions. In both VLSI and ULSI applications, polishing the wafer surface to complete flatness is highly desirable. The forward and reverse movement of the polishing pad or belt provides superior planarity and uniformity to the surface of the wafer. The wafer surface is pressed against the polishing pad or belt as the pad or belt moves in both forward and reverse directions while polishing the wafer surface. During polishing, the wafer is supported by a wafer housing having novel wafer loading and unloading methods.
摘要翻译：本发明涉及使用可沿前后方向移动的垫或带来抛光半导体晶片的表面的方法和装置。在VLSI和ULSI应用中，非常需要抛光晶片表面以完成平坦度。抛光垫或带的向前和向后移动为晶片的表面提供了优异的平面性和均匀性。当抛光晶片表面时，衬垫或带沿正向和反向移动，晶片表面被压靠在抛光垫或带上。在抛光期间，晶片由具有新颖的晶片装载和卸载方法的晶片壳体支撑。

5. 发明授权

US06464571B2 Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein 有权
公开(公告)号：US06464571B2
公开(公告)日：2002-10-15
申请号：US09880730
申请日：2001-06-12
申请人： Homayoun Talieh , Konstantin Volodarsky , Jalal Ashjaee , Douglas W. Young
发明人： Homayoun Talieh , Konstantin Volodarsky , Jalal Ashjaee , Douglas W. Young
IPC分类号： B24B2100
CPC分类号： B24B21/04 , B24B21/08 , B24B21/22 , B24B37/013 , B24B37/04 , B24B37/205 , B24B47/04 , B24B49/16
摘要： The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt as it polishes the wafer provides superior planarity and uniformity across the wafer surface. When a fresh portion of the pad is required, the pad is moved through a drive system containing rollers, such that the rollers only touch a back side of the pad, thereby minimizing sources of friction other than the wafer that is being polished from the polishing side of the pad, and maximizing the lifetime of the polishing pad.

6. 发明授权

US5913714A Method for dressing a polishing pad during polishing of a semiconductor wafer 失效
标题翻译：在抛光半导体晶片期间修整抛光垫的方法
公开(公告)号：US5913714A
公开(公告)日：1999-06-22
申请号：US153817
申请日：1998-09-15
申请人： Konstantin Volodarsky , Rahul Jairath
发明人： Konstantin Volodarsky , Rahul Jairath
IPC分类号： B24B37/04 , B24B41/047 , B24B53/007 , B24B1/00
CPC分类号： B24B37/30 , B24B37/04 , B24B41/047 , B24B53/017
摘要： A polishing pad dressing method uses a polishing head for polishing a semiconductor wafer. This polishing head includes a housing, a wafer carrier movably mounted to the housing, and a pad dressing element movably mounted to the housing. The wafer carrier forms a wafer-supporting surface, and the dressing element surrounds the wafer-supporting surface. A first fluid actuator is coupled to the dressing element to bias the pad dressing element with respect to the housing, and a second fluid actuator is coupled to the wafer carrier to bias the wafer carrier with respect to the housing. First and second fluid conduits are coupled to the first and second actuators, respectively, such that fluid pressures in the first and second actuators are separately and independently adjustable with respect to one another. Biasing forces on the dressing element can thereby be dynamically adjusted with respect to biasing forces on the carrier during a polishing operation.
摘要翻译：抛光垫修整方法使用用于抛光半导体晶片的抛光头。该抛光头包括壳体，可移动地安装到壳体的晶片载体和可移动地安装到壳体的垫修整元件。晶片载体形成晶片支撑表面，并且修整元件围绕晶片支撑表面。第一流体致动器联接到修整元件以相对于壳体偏置衬垫修整元件，并且第二流体致动器联接到晶片载体以相对于壳体偏置晶片载体。第一和第二流体管道分别联接到第一和第二致动器，使得第一和第二致动器中的流体压力彼此独立且可独立地调节。因此，可以在抛光操作期间相对于载体上的偏压力动态地调整修整元件上的偏压力。

7. 发明授权

US07316602B2 Constant low force wafer carrier for electrochemical mechanical processing and chemical mechanical polishing 失效
标题翻译：用于电化学机械加工和化学机械抛光的恒定低力晶片载体
公开(公告)号：US07316602B2
公开(公告)日：2008-01-08
申请号：US10654542
申请日：2003-09-02
申请人： Bulent M. Basol , Jalal Ashjaee , Konstantin Volodarsky
发明人： Bulent M. Basol , Jalal Ashjaee , Konstantin Volodarsky
IPC分类号： B24B1/00
CPC分类号： C25D17/002 , B23H5/08 , C25D7/123 , C25D17/001
摘要： A carrier head for holding a workpiece during processing of a workpiece surface is provided. The carrier head includes a carrier housing, a base and a pressure member. The base is configured to hold the workpiece and is movable with respect to the carrier housing. The pressure member is between the base and the carrier housing and is configured to induce the base to apply a predetermined force onto the process surface.
摘要翻译：提供了用于在工件表面的加工期间保持工件的承载头。载体头部包括载体壳体，基底和压力构件。基座构造成保持工件并且可相对于托架壳体移动。压力构件位于基座和托架壳体之间，并且构造成引导基座将预定的力施加到过程表面上。

8. 发明授权

US06939206B2 Method and apparatus of sealing wafer backside for full-face electrochemical plating 有权
标题翻译：用于全面电化学电镀的晶片背面密封方法和装置
公开(公告)号：US06939206B2
公开(公告)日：2005-09-06
申请号：US10159295
申请日：2002-05-31
申请人： Jalal Ashjaee , Homayoun Talieh , Bulent M. Basol , Konstantin Volodarsky
发明人： Jalal Ashjaee , Homayoun Talieh , Bulent M. Basol , Konstantin Volodarsky
IPC分类号： B24B37/30 , C25D7/12 , C25D17/00 , C25D17/06 , H01L21/00 , H01L21/304 , H01L21/306 , H01L21/683 , B24B1/00
CPC分类号： H01L21/67126 , B24B37/30 , C25D7/123 , C25D17/001 , C25D17/004 , C25D17/06 , H01L21/6704 , H01L21/6715 , H01L21/6838
摘要： The present invention provides a wafer carrier that includes a plurality of concentric sealing members that provide a seal, with the outer seal independently movable to allow cleaning of a peripheral backside of the wafer to occur while the wafer is still attached to the wafer carrier, and a plurality of vacuum openings that a re disposed only adjacent to an inner side of the inner seal at a location corresponding to the backside periphery of the wafer.
摘要翻译：本发明提供了一种晶片载体，其包括提供密封的多个同心密封构件，其中外部密封独立地可移动以允许在晶片仍然附接到晶片载体的同时清洁晶片的外围背面，以及多个真空开口，其在与所述晶片的所述背面周边相对应的位置处重新设置成与所述内部密封件的内侧相邻。

9. 发明授权

US06612915B1 Work piece carrier head for plating and polishing 有权
标题翻译：工件载体头用于电镀和抛光
公开(公告)号：US06612915B1
公开(公告)日：2003-09-02
申请号：US09472523
申请日：1999-12-27
申请人： Cyprian Uzoh , Boguslaw Andrzej Nagorski , Konstantin Volodarsky , Douglas W. Young
发明人： Cyprian Uzoh , Boguslaw Andrzej Nagorski , Konstantin Volodarsky , Douglas W. Young
IPC分类号： B24B700
CPC分类号： B24B37/30 , C25D7/12
摘要： A work piece carrier head can carry a semiconductor wafer during both plating and polishing operations. The carrier head includes a first component secured to a shaft by which the carrier head can be rotated, translated, and moved up and down, a second component connected to the first component and movable by fluid pressure relative to the first component between retracted and extended positions, and a third component connected to the first and second components for up and down movement between wafer loading or unloading and wafer plating or polishing positions. The third carrier head component includes a contact element by which electrical contact with the wafer is provided to permit wafer plating.
摘要翻译：工件载体头可以在电镀和抛光操作期间承载半导体晶片。承载头包括固定到轴的第一部件，承载头可以通过该第一部件旋转，平移和上下移动;第二部件，连接到第一部件并且可相对于第一部件在流体压力下相对于第一部件在缩回和延伸之间移动位置，以及连接到第一和第二部件的第三部件，用于晶片装载或卸载以及晶片电镀或抛光位置之间的上下移动。第三载体头部件包括接触元件，通过该接触元件提供与晶片的电接触以允许晶片电镀。

10. 发明授权

US06533646B2 Polishing head with removable subcarrier 失效
标题翻译：抛光头与可移动子载波
公开(公告)号：US06533646B2
公开(公告)日：2003-03-18
申请号：US09745653
申请日：2000-12-21
申请人： Konstantin Volodarsky
发明人： Konstantin Volodarsky
IPC分类号： B24B722
CPC分类号： B24B37/30
摘要： A polishing head for performing chemical-mechanical polishing on a linear polisher has a dual stage wafer carrier assembly that incorporates a removable subcarrier. When in use, a main pressure chamber exerts a downforce on the subcarrier housing, while a separate secondary pressure chamber residing between the subcarrier housing and the subcarrier exerts a slightly different downforce on the subcarrier. Since the second pressure chamber exerts the downforce pressure directly on the subcarrier, the direct pressure application, as well as a more uniform distribution of pressure ensures for an improvement to the uniformity of pressure distribution. Additionally, the easily removal subcarrier allows for faster and easier removal of the subcarrier for cleaning and maintenance, as well as for changing inserts and improving process repeatability.
摘要翻译：用于在线性抛光机上进行化学机械抛光的抛光头具有结合可拆卸副载波的双级晶片载体组件。当使用时，主压力室在副载波壳体上施加下压力，而位于副载波壳体和副载波之间的单独的次级压力室在副载波上施加稍微不同的下压力。由于第二压力室直接在副载波上施加下压力，所以直接施加压力以及更均匀的压力分布确保了压力分布的均匀性的改善。此外，容易去除副载波允许更快更容易地去除用于清洁和维护的子载波，以及用于改变插入件并提高过程重复性。

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