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    • 5. 发明授权
    • Dispensible electrical gasket, electronic module having dispensible electrical gasket, and method of fabricating same
    • 可分配电气垫圈,具有可分离电气垫圈的电子模块及其制造方法
    • US09313934B2
    • 2016-04-12
    • US13834868
    • 2013-03-15
    • Autoliv ASP Inc.
    • Xueru DingRichard Leung
    • H05K9/00G01S7/02G01S7/03G01S13/93
    • H05K9/0015G01S7/023G01S7/032G01S13/931Y10T29/49155
    • An electronic module and method of making an electronic module include a printed circuit board (PCB) having a surface, at least one conductive trace being formed on the surface. A housing element for mechanically mating with the PCB includes at least one mating surface aligned with the conductive trace on the PCB when the PCB and the housing element are mechanically mated, the mating surface comprising a plurality of alternating protrusions and spaces between the protrusions. An electrical gasket is formed on the mating surface of the housing element such that the electrical gasket conforms with the protrusions and spaces on the mating surface of the housing element and is disposed between the mating surface of the housing element and the conductive trace on the surface of the PCB when the housing element and the PCB are mechanically mated, such that the electrical gasket provides an electromagnetic interference (EMI) seal between the mating surface of the housing element and the conductive trace on the first surface of the PCB.
    • 电子模块和制造电子模块的方法包括具有表面的印刷电路板(PCB),在表面上形成至少一个导电迹线。 用于与PCB机械地配合的壳体元件包括至少一个与PCB上的导电迹线对准的配合表面,当PCB和壳体元件机械配合时,配合表面包括突起之间的多个交替突起和间隔。 电气垫圈形成在壳体元件的配合表面上,使得电垫片与壳体元件的配合表面上的突起和空间一致,并且设置在壳体元件的配合表面和表面上的导电迹线之间 当外壳元件和PCB机械地配合时,电气垫圈在壳体元件的配合表面和PCB的第一表面上的导电迹线之间提供电磁干扰(EMI)密封。
    • 6. 发明申请
    • Dispensible Electrical Gasket, Electronic Module Having Dispensible Electrical Gasket, And Method Of Fabricating Same
    • 可分配电气垫片,具有可分配电气垫圈的电子模块及其制造方法
    • US20140266903A1
    • 2014-09-18
    • US13834868
    • 2013-03-15
    • Autoliv ASP Inc.
    • Xueru DingRichard Leung
    • H05K9/00H05K3/10G01S13/02
    • H05K9/0015G01S7/023G01S7/032G01S13/931Y10T29/49155
    • An electronic module and method of making an electronic module include a printed circuit board (PCB) having a surface, at least one conductive trace being formed on the surface. A housing element for mechanically mating with the PCB includes at least one mating surface aligned with the conductive trace on the PCB when the PCB and the housing element are mechanically mated, the mating surface comprising a plurality of alternating protrusions and spaces between the protrusions. An electrical gasket is formed on the mating surface of the housing element such that the electrical gasket conforms with the protrusions and spaces on the mating surface of the housing element and is disposed between the mating surface of the housing element and the conductive trace on the surface of the PCB when the housing element and the PCB are mechanically mated, such that the electrical gasket provides an electromagnetic interference (EMI) seal between the mating surface of the housing element and the conductive trace on the first surface of the PCB.
    • 电子模块和制造电子模块的方法包括具有表面的印刷电路板(PCB),在表面上形成至少一个导电迹线。 用于与PCB机械地配合的壳体元件包括至少一个与PCB上的导电迹线对准的配合表面,当PCB和壳体元件机械配合时,配合表面包括突起之间的多个交替突起和间隔。 电气垫圈形成在壳体元件的配合表面上,使得电垫片与壳体元件的配合表面上的突起和空间一致,并且设置在壳体元件的配合表面和表面上的导电迹线之间 当外壳元件和PCB机械地配合时,电气垫圈在壳体元件的配合表面和PCB的第一表面上的导电迹线之间提供电磁干扰(EMI)密封。