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1. 发明授权

US11986926B2 Slurry distribution device for chemical mechanical polishing 有权
公开(公告)号：US11986926B2
公开(公告)日：2024-05-21
申请号：US17897088
申请日：2022-08-26
申请人： Applied Materials, Inc.
发明人： Yen-Chu Yang , Stephen Jew , Jianshe Tang , Haosheng Wu , Shou-Sung Chang , Paul D. Butterfield , Alexander John Fisher , Bum Jick Kim
IPC分类号： B24B57/02 , B24B37/10 , H01L21/67
CPC分类号： B24B57/02 , B24B37/10 , H01L21/67075 , H01L21/6708
摘要： An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a curved barrier positioned after the dispenser to spread fresh polishing liquid from the dispenser.

2. 发明申请

US20210331288A1 SLURRY DISTRIBUTION DEVICE FOR CHEMICAL MECHANICAL POLISHING 有权
公开(公告)号：US20210331288A1
公开(公告)日：2021-10-28
申请号：US17371032
申请日：2021-07-08
申请人： Applied Materials, Inc.
发明人： Yen-Chu Yang , Stephen Jew , Jianshe Tang , Haosheng Wu , Shou-Sung Chang , Paul D. Butterfield , Alexander John Fisher , Bum Jick Kim
IPC分类号： B24B57/02 , B24B37/10 , H01L21/67
摘要： An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a first barrier positioned before the portion of the polishing surface and configured to block used polishing liquid from reaching the portion of the polishing surface. The first barrier includes a solid first body having a first flat bottom surface and having a first leading surface configured to contact the used polishing liquid.

3. 发明申请

US20220402096A1 SLURRY DISTRIBUTION DEVICE FOR CHEMICAL MECHANICAL POLISHING 有权
公开(公告)号：US20220402096A1
公开(公告)日：2022-12-22
申请号：US17897088
申请日：2022-08-26
申请人： Applied Materials, Inc.
发明人： Yen-Chu Yang , Stephen Jew , Jianshe Tang , Haosheng Wu , Shou-Sung Chang , Paul D. Butterfield , Alexander John Fisher , Bum Jick Kim
IPC分类号： B24B57/02 , B24B37/10
摘要： An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a curved barrier positioned after the dispenser to spread fresh polishing liquid from the dispenser.

4. 发明申请

US20220305613A1 CONTROLLED PROFILE POLISHING PLATEN 有权
公开(公告)号：US20220305613A1
公开(公告)日：2022-09-29
申请号：US17673511
申请日：2022-02-16
申请人： Applied Materials, Inc.
发明人： Steven M. Zuniga , Bum Jick Kim , Jay Gurusamy
IPC分类号： B24B37/26
摘要： Chemical-mechanical polishing assemblies may include an upper platen characterized by a first surface and a second surface opposite the first surface. The upper platen may define a recess in the second surface of the upper platen. The upper platen may define a flexure between the first surface and the second surface within the recess. The assemblies may include a polishing pad coupled with the first surface of the upper platen. The assemblies may include a plate coupled with the upper platen along the second surface of the upper platen. The plate may define a volume within the recess of the upper platen between the second surface of the upper platen and the plate.

5. 发明授权

US09687960B2 Polishing pad cleaning systems employing fluid outlets oriented to direct fluid under spray bodies and towards inlet ports, and related methods 有权
公开(公告)号：US09687960B2
公开(公告)日：2017-06-27
申请号：US14523482
申请日：2014-10-24
申请人： Applied Materials, Inc.
发明人： Paul D. Butterfield , Shou-Sung Chang , Bum Jick Kim
IPC分类号： C23F1/00 , B24B53/017 , B24B53/02 , B24B1/00
CPC分类号： B24B53/017 , B24B1/00 , B24B53/02
摘要： Polishing pad cleaning systems employing fluid outlets orientated to direct fluid under spray bodies and towards inlet ports, and related methods are disclosed. A polishing pad in combination with slurry contacts a substrate to planarize a surface of the substrate and remove substrate defects while creating debris. A spray system removes the debris from the polishing pad to prevent substrate damage and improve efficiency. By directing fluid under a spray body to the polishing pad and towards an inlet port, the debris may be entrained in the fluid and directed to an inner plenum of the spray body. The fluid-entrained debris is subsequently removed from the inner plenum through an outlet port. In this manner, the debris removal may reduce substrate defects, improve facility cleanliness, and improve pad efficiency.

6. 发明授权

US11806835B2 Slurry distribution device for chemical mechanical polishing 有权
公开(公告)号：US11806835B2
公开(公告)日：2023-11-07
申请号：US17209034
申请日：2021-03-22
申请人： Applied Materials, Inc.
发明人： Yen-Chu Yang , Stephen Jew , Jianshe Tang , Haosheng Wu , Shou-Sung Chang , Paul D. Butterfield , Alexander John Fisher , Bum Jick Kim
IPC分类号： B24B57/02 , B24B37/10 , H01L21/67
CPC分类号： B24B57/02 , B24B37/10 , H01L21/6708 , H01L21/67075
摘要： An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a first barrier positioned before the portion of the polishing surface and configured to block used polishing liquid from reaching the portion of the polishing surface.

7. 发明授权

US10967483B2 Slurry distribution device for chemical mechanical polishing 有权
公开(公告)号：US10967483B2
公开(公告)日：2021-04-06
申请号：US15626857
申请日：2017-06-19
申请人： Applied Materials, Inc.
发明人： Yen-Chu Yang , Stephen Jew , Jianshe Tang , Haosheng Wu , Shou-Sung Chang , Paul D. Butterfield , Alexander John Fisher , Bum Jick Kim
IPC分类号： B24B57/02 , B24B37/10 , H01L21/67
摘要： An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a first barrier positioned before the portion of the polishing surface and configured to block used polishing liquid from reaching the portion of the polishing surface.

8. 发明授权

US09452506B2 Vacuum cleaning systems for polishing pads, and related methods 有权
标题翻译：抛光垫用真空清洗系统及相关方法
公开(公告)号：US09452506B2
公开(公告)日：2016-09-27
申请号：US14530163
申请日：2014-10-31
申请人： Applied Materials, Inc.
发明人： Paul D. Butterfield , Shou-Sung Chang , Bum Jick Kim
IPC分类号： B24B53/00 , B24B53/017
CPC分类号： B24B53/017
摘要： Vacuum cleaning systems and related methods are disclosed. A polishing pad in combination with a fluid, such as a slurry, contacts a substrate to planarize material at the surface thereof and resultantly creates debris. A cleaning system includes an enclosure body having an inlet opening which may be placed proximate to the polishing pad and an exit opening in communication with a vacuum source to remove the debris and the fluid from the polishing pad through a passageway connecting the inlet and exit openings. By including contact members secured to the enclosure body and configured to form an abutment against a working surface of the polishing pad, a Venturi effect zone between the enclosure body and the working surface of the polishing pad may be created to dislodge fluid and debris from the working surface. In this manner, scratches and contamination are avoided for later-polished substrates.
摘要翻译：公开了真空清洁系统及相关方法。与诸如浆料的流体结合的抛光垫与衬底接触以在其表面平坦化材料并且导致碎屑。清洁系统包括具有可以靠近抛光垫设置的入口开口的外壳主体和与真空源连通的出口，以通过连接入口和出口的通道从抛光垫移除碎屑和流体。通过包括固定到外壳主体并被配置为形成与抛光垫的工作表面的抵接件的接触构件，可以产生外壳主体和抛光垫的工作表面之间的文丘里效应区，以将流体和碎屑从工作面以这种方式，可以避免稍后抛光的基材产生划伤和污染。

9. 发明授权

US11077536B2 Slurry distribution device for chemical mechanical polishing 有权
公开(公告)号：US11077536B2
公开(公告)日：2021-08-03
申请号：US15626936
申请日：2017-06-19
申请人： Applied Materials, Inc.
发明人： Yen-Chu Yang , Stephen Jew , Jianshe Tang , Haosheng Wu , Shou-Sung Chang , Paul D. Butterfield , Alexander John Fisher , Bum Jick Kim
IPC分类号： B24B57/02 , B24B37/10 , H01L21/67
摘要： An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a first barrier positioned before the portion of the polishing surface and configured to block used polishing liquid from reaching the portion of the polishing surface. The first barrier includes a solid first body having a first flat bottom surface and having a first leading surface configured to contact the used polishing liquid.

10. 发明申请

US20210205953A1 SLURRY DISTRIBUTION DEVICE FOR CHEMICAL MECHANICAL POLISHING 有权
公开(公告)号：US20210205953A1
公开(公告)日：2021-07-08
申请号：US17209034
申请日：2021-03-22
申请人： Applied Materials, Inc.
发明人： Yen-Chu Yang , Stephen Jew , Jianshe Tang , Haosheng Wu , Shou-Sung Chang , Paul D. Butterfield , Alexander John Fisher , Bum Jick Kim
IPC分类号： B24B57/02 , B24B37/10
摘要： An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a first barrier positioned before the portion of the polishing surface and configured to block used polishing liquid from reaching the portion of the polishing surface.

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