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1. 发明授权

US10655988B2 Watch with rotatable optical encoder having a spindle defining an array of alternating regions extending along an axial direction parallel to the axis of a shaft 有权
公开(公告)号：US10655988B2
公开(公告)日：2020-05-19
申请号：US16134888
申请日：2018-09-18
申请人： Apple Inc.
发明人： Paisith P. Boonsom , Serhan O. Isikman , Richard Ruh , Prashanth S. Holenarsipur , Colin M. Ely , William N. Pickeral , Jairam Manjunathaiah , David G. Havskjold , Anant Rai , Maegan K. Spencer , Milind S. Bhagavat
IPC分类号： G01D5/347 , G01D5/30
摘要： Embodiments of the present disclosure provide an optical encoder for an electronic device. The optical encoder includes a spindle and an encoded pattern disposed around a circumference of the spindle. The encoded pattern may include one or more surface features that create a direction-dependent reflective region.

2. 发明授权

US09883822B2 Biometric sensor chip having distributed sensor and control circuitry 有权
公开(公告)号：US09883822B2
公开(公告)日：2018-02-06
申请号：US15181229
申请日：2016-06-13
申请人： Apple Inc.
发明人： Milind S. Bhagavat , Jun Zhai
IPC分类号： G06K9/00 , A61B5/117 , A61B5/1172 , A61B5/053 , H01L27/146
CPC分类号： A61B5/1172 , A61B5/053 , A61B2562/0214 , A61B2562/182 , G06K9/0002 , H01L27/14634 , H01L27/14636
摘要： A sensor includes a sensor array formed on a first side of a substrate and at least one circuit operative to communicate with the sensor array formed on a second side of the substrate. At least one via extends through the substrate to electrically connect the sensor array to the at least one circuit. Placing the at least one circuit on the second side of the substrate allows the sensor array to occupy substantially all of the first side of the substrate.

3. 发明申请

US20160217311A1 Biometric Sensor Chip Having Distributed Sensor And Control Circuitry 审中-公开
标题翻译：具有分布式传感器和控制电路的生物传感器芯片
公开(公告)号：US20160217311A1
公开(公告)日：2016-07-28
申请号：US15090474
申请日：2016-04-04
申请人： Apple Inc.
发明人： Milind S. Bhagavat , Jun Zhai
IPC分类号： G06K9/00
CPC分类号： G06K9/0002 , H01L27/14634 , H01L27/14636
摘要： A sensor includes a sensor array formed on a first side of a substrate and at least one circuit operative to communicate with the sensor array formed on a second side of the substrate. At least one via extends through the substrate to electrically connect the sensor array to the at least one circuit. Placing the at least one circuit on the second side of the substrate allows the sensor array to occupy substantially all of the first side of the substrate.
摘要翻译：传感器包括形成在基板的第一侧上的传感器阵列和至少一个可操作地与形成在基板的第二侧上的传感器阵列通信的电路。至少一个通孔延伸穿过衬底以将传感器阵列电连接到至少一个电路。将至少一个电路放置在基板的第二侧上，使得传感器阵列基本上占据基板的所有第一侧。

4. 发明申请

US20150291413A1 METHOD AND SYSTEM FOR CMOS BASED MEMS BUMP STOP CONTACT DAMAGE PREVENTION 有权
标题翻译：基于CMOS的MEMS BUMP停止触点损伤预防方法与系统
公开(公告)号：US20150291413A1
公开(公告)日：2015-10-15
申请号：US14451092
申请日：2014-08-04
申请人： Apple Inc.
发明人： Milind S. Bhagavat , Richard Yeh , Henry H. Yang
IPC分类号： B81B3/00 , B81C1/00
CPC分类号： B81C1/00825 , B81B2203/0118 , B81B2207/115
摘要： In some embodiments, a microelectromechanical system may include a semiconductor substrate, a plurality of wiring layers, and a stop. The plurality of wiring layers may be coupled to a first surface of the semiconductor substrate. The stop may be coupled to the plurality of wiring layers. In some embodiments, at least a portion of the plurality of wiring layers between the stop and the first surface of the substrate comprises an insulating material. In some embodiments, at least the portion excludes wiring within. In some embodiments, a volume of the portion may be determined by a use of the microelectromechanical system. In some embodiments, the portion may inhibit, during use, electrical failures adjacent to the stop.
摘要翻译：在一些实施例中，微机电系统可以包括半导体衬底，多个布线层和停止件。多个布线层可以耦合到半导体基板的第一表面。止动件可以联接到多个布线层。在一些实施例中，多个布线层的至少部分在基片的止挡件和第一表面之间包括绝缘材料。在一些实施例中，至少该部分排除其内的布线。在一些实施例中，该部分的体积可以通过使用微机电系统来确定。在一些实施例中，该部分在使用期间可以阻止与停止相邻的电气故障。

5. 发明授权

US09751756B2 Method and system for CMOS based MEMS bump stop contact damage prevention 有权
公开(公告)号：US09751756B2
公开(公告)日：2017-09-05
申请号：US14451092
申请日：2014-08-04
申请人： Apple Inc.
发明人： Milind S. Bhagavat , Richard Yeh , Henry H. Yang
IPC分类号： H01L21/00 , B81C1/00
CPC分类号： B81C1/00825 , B81B2203/0118 , B81B2207/115
摘要： In some embodiments, a microelectromechanical system may include a semiconductor substrate, a plurality of wiring layers, and a stop. The plurality of wiring layers may be coupled to a first surface of the semiconductor substrate. The stop may be coupled to the plurality of wiring layers. In some embodiments, at least a portion of the plurality of wiring layers between the stop and the first surface of the substrate comprises an insulating material. In some embodiments, at least the portion excludes wiring within. In some embodiments, a volume of the portion may be determined by a use of the microelectromechanical system. In some embodiments, the portion may inhibit, during use, electrical failures adjacent to the stop.

6. 发明申请

US20160278671A1 Biometric Sensor Chip Having Distributed Sensor and Control Circuitry 有权
标题翻译：具有分布式传感器和控制电路的生物传感器芯片
公开(公告)号：US20160278671A1
公开(公告)日：2016-09-29
申请号：US15181229
申请日：2016-06-13
申请人： Apple Inc.
发明人： Milind S. Bhagavat , Jun Zhai
IPC分类号： A61B5/1172 , G06K9/00 , A61B5/053
CPC分类号： A61B5/1172 , A61B5/053 , A61B2562/0214 , A61B2562/182 , G06K9/0002 , H01L27/14634 , H01L27/14636
摘要： A sensor includes a sensor array formed on a first side of a substrate and at least one circuit operative to communicate with the sensor array formed on a second side of the substrate. At least one via extends through the substrate to electrically connect the sensor array to the at least one circuit. Placing the at least one circuit on the second side of the substrate allows the sensor array to occupy substantially all of the first side of the substrate.
摘要翻译：传感器包括形成在基板的第一侧上的传感器阵列和至少一个可操作地与形成在基板的第二侧上的传感器阵列通信的电路。至少一个通孔延伸穿过衬底以将传感器阵列电连接到至少一个电路。将至少一个电路放置在基板的第二侧上，使得传感器阵列基本上占据基板的所有第一侧。

7. 发明授权

US09305959B2 Biometric sensor chip having distributed sensor and control circuitry 有权
标题翻译：具有分布式传感器和控制电路的生物传感器芯片
公开(公告)号：US09305959B2
公开(公告)日：2016-04-05
申请号：US14294903
申请日：2014-06-03
申请人： Apple Inc.
发明人： Milind S. Bhagavat , Jun Zhai
IPC分类号： G06K9/00 , H01L27/146
CPC分类号： G06K9/0002 , H01L27/14634 , H01L27/14636
摘要： A sensor includes a sensor array formed on a first side of a substrate and at least one circuit operative to communicate with the sensor array formed on a second side of the substrate. At least one via extends through the substrate to electrically connect the sensor array to the at least one circuit. Placing the at least one circuit on the second side of the substrate allows the sensor array to occupy substantially all of the first side of the substrate.
摘要翻译：传感器包括形成在基板的第一侧上的传感器阵列和至少一个可操作地与形成在基板的第二侧上的传感器阵列通信的电路。至少一个通孔延伸穿过衬底以将传感器阵列电连接到至少一个电路。将至少一个电路放置在基板的第二侧上，使得传感器阵列基本上占据基板的所有第一侧。

8. 发明申请

US20200271483A1 OPTICAL ENCODER WITH DIRECTION-DEPENDENT OPTICAL PROPERTIES 审中-公开
公开(公告)号：US20200271483A1
公开(公告)日：2020-08-27
申请号：US16872600
申请日：2020-05-12
申请人： Apple Inc.
发明人： Paisith P. Boonsom , Serhan O. Isikman , Richard Ruh , Prashanth S. Holenarsipur , Colin M. Ely , William N. Pickeral , Jairam Manjunathaiah , David G. Havskjold , Anant Rai , Maegan K. Spencer , Milind S. Bhagavat
IPC分类号： G01D5/347 , G01D5/30
摘要： Embodiments of the present disclosure provide an optical encoder for an electronic device. The optical encoder includes a spindle and an encoded pattern disposed around a circumference of the spindle. The encoded pattern may include one or more surface features that create a direction-dependent reflective region.

9. 发明申请

US20160258784A1 OPTICAL ENCODER WITH DIRECTION-DEPENDENT OPTICAL PROPERTIES 审中-公开
标题翻译：具有方向依赖光学特性的光学编码器
公开(公告)号：US20160258784A1
公开(公告)日：2016-09-08
申请号：US15060069
申请日：2016-03-03
申请人： Apple Inc.
发明人： Paisith P. Boonsom , Serhan O. Isikman , Richard Ruh , Prashanth S. Holenarsipur , Colin M. Ely , William N. Pickeral , Jairam Manjunathaiah , David G. Havskjold , Anant Rai , Maegan K. Spencer , Milind S. Bhagavat
IPC分类号： G01D5/347
CPC分类号： G01D5/347 , G01D5/34715
摘要： Embodiments of the present disclosure provide an optical encoder for an electronic device. The optical encoder includes a spindle and an encoded pattern disposed around a circumference of the spindle. The encoded pattern may include one or more surface features that create a direction-dependent reflective region.
摘要翻译：本公开的实施例提供了一种用于电子设备的光学编码器。光学编码器包括主轴和设置在主轴的圆周周围的编码图案。编码图案可以包括产生方向依赖反射区域的一个或多个表面特征。

10. 发明申请

US20170355599A1 METHOD AND SYSTEM FOR CMOS BASED MEMS BUMP STOP CONTACT DAMAGE PREVENTION 审中-公开
公开(公告)号：US20170355599A1
公开(公告)日：2017-12-14
申请号：US15669231
申请日：2017-08-04
申请人： Apple Inc.
发明人： Milind S. Bhagavat , Richard Yeh , Henry H. Yang
IPC分类号： B81C1/00
CPC分类号： B81C1/00825 , B81B2203/0118 , B81B2207/115
摘要： In some embodiments, a microelectromechanical system may include a semiconductor substrate, a plurality of wiring layers, and a stop. The plurality of wiring layers may be coupled to a first surface of the semiconductor substrate. The stop may be coupled to the plurality of wiring layers. In some embodiments, at least a portion of the plurality of wiring layers between the stop and the first surface of the substrate comprises an insulating material. In some embodiments, at least the portion excludes wiring within. In some embodiments, a volume of the portion may be determined by a use of the microelectromechanical system. In some embodiments, the portion may inhibit, during use, electrical failures adjacent to the stop.

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