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    • 1. 发明授权
    • Flame-protected, partially aromatic polyamide molding compounds
    • 火焰保护的部分芳族聚酰胺模塑料
    • US09394424B2
    • 2016-07-19
    • US13376167
    • 2009-06-05
    • Andreas BayerNikolai Lamberts
    • Andreas BayerNikolai Lamberts
    • C08K5/098C08K5/3492C08K5/5313
    • C08K5/098C08K5/34928C08K5/5313C08L77/06
    • The invention relates to a flame-retardant polyamide molding composition based on semicrystalline polyamides. This polyamide molding composition is based on (A) from 30 to 92% by weight of at least one aliphatic or semiaromatic, semicrystalline polyamide with melting point (Tm) in the range from 240° C. to 340° C.; (B) from 0 to 50% by weight of at least one filler and reinforcing agent; (C) from 8 to 18% by weight of at least one halogen-free flame retardant; (D) from 0 to 2.0% by weight of at least one barium carboxylate; (E) from 0 to 5% by weight of at least one additive; wherein the percentages by weight of components (A) to (E) give a total of 100%, and with the proviso that if the proportion of component (D) is in the range from 0 to 0.1% by weight the halogen-free flame retardant of component (C) is based on a barium phosphinate. The invention further relates to the use of barium carboxylate in a polyamide molding composition using a halogen-free flame retardant for inhibiting corrosive action during processing. The molding compositions comply with fire-protection class UL 94 V-0, and have no, or only slight, corrosive action with respect to the machine components used in thermoplastic processing, and exhibit good mechanical properties. They are suitable for producing, in particular, thin-walled moldings for the electrical and electronics industry, examples being housings, housing components, and connectors.
    • 本发明涉及一种基于半结晶聚酰胺的阻燃聚酰胺模塑组合物。 该聚酰胺模塑组合物基于(A)30至92重量%的至少一种脂族或半芳族半结晶聚酰胺,熔点(Tm)在240℃至340℃的范围内。 (B)0至50重量%的至少一种填料和增强剂; (C)8至18重量%的至少一种无卤阻燃剂; (D)0至2.0重量%的至少一种羧酸钡; (E)0至5重量%的至少一种添加剂; 其中组分(A)至(E)的重量百分比总计为100%,条件是如果组分(D)的比例在0至0.1重量%的范围内,则不含卤素的火焰 组分(C)的阻燃剂基于次膦酸钡。 本发明还涉及在使用无卤阻燃剂在加工过程中抑制腐蚀作用的聚酰胺模塑组合物中使用羧酸钡。 模塑组合物符合防火等级UL 94 V-0,并且对于热塑性加工中使用的机器部件没有或只有轻微的腐蚀作用,并且具有良好的机械性能。 它们特别适用于制造电气和电子工业的薄壁模制件,例如壳体,外壳部件和连接器。
    • 4. 发明申请
    • FLAME-PROTECTED, PARTIALLY AROMATIC POLYAMIDE MOLDING COMPOUNDS
    • 防火保护,部分芳族聚酰胺模塑化合物
    • US20120083558A1
    • 2012-04-05
    • US13376167
    • 2009-06-05
    • Andreas BayerNikolai Lamberts
    • Andreas BayerNikolai Lamberts
    • C08L77/06C08K5/529C08K7/14C08K5/098C08K5/5313
    • C08K5/098C08K5/34928C08K5/5313C08L77/06
    • The invention relates to a flame-retardant polyamide molding composition based on semicrystalline polyamides. This polyamide molding composition is based on (A) from 30 to 92% by weight of at least one aliphatic or semiaromatic, semicrystalline polyamide with melting point (Tm) in the range from 240° C. to 340° C.; (B) from 0 to 50% by weight of at least one filler and reinforcing agent; (C) from 8 to 18% by weight of at least one halogen-free flame retardant; (D) from 0 to 2.0% by weight of at least one barium carboxylate; (E) from 0 to 5% by weight of at least one additive; wherein the percentages by weight of components (A) to (E) give a total of 100%, and with the proviso that if the proportion of component (D) is in the range from 0 to 0.1% by weight the halogen-free flame retardant of component (C) is based on a barium phosphinate. The invention further relates to the use of barium carboxylate in a polyamide molding composition using a halogen-free flame retardant for inhibiting corrosive action during processing. The molding compositions comply with fire-protection class UL 94 V-0, and have no, or only slight, corrosive action with respect to the machine components used in thermoplastic processing, and exhibit good mechanical properties. They are suitable for producing, in particular, thin-walled moldings for the electrical and electronics industry, examples being housings, housing components, and connectors.
    • 本发明涉及一种基于半结晶聚酰胺的阻燃聚酰胺模塑组合物。 该聚酰胺模塑组合物基于(A)30至92重量%的至少一种脂族或半芳族半结晶聚酰胺,熔点(Tm)在240℃至340℃的范围内。 (B)0至50重量%的至少一种填料和增强剂; (C)8至18重量%的至少一种无卤阻燃剂; (D)0至2.0重量%的至少一种羧酸钡; (E)0至5重量%的至少一种添加剂; 其中组分(A)至(E)的重量百分比总计为100%,条件是如果组分(D)的比例在0至0.1重量%的范围内,则不含卤素的火焰 组分(C)的阻燃剂基于次膦酸钡。 本发明还涉及在使用无卤阻燃剂在加工过程中抑制腐蚀作用的聚酰胺模塑组合物中使用羧酸钡。 模塑组合物符合防火等级UL 94 V-0,并且对于热塑性加工中使用的机器部件没有或只有轻微的腐蚀作用,并且具有良好的机械性能。 它们特别适用于制造电气和电子工业的薄壁模制件,例如壳体,外壳部件和连接器。
    • 5. 发明授权
    • Polyamide moulding material and use thereof for production of LED housing components
    • 聚酰胺成型材料及其用于生产LED外壳部件的用途
    • US08859662B2
    • 2014-10-14
    • US13096374
    • 2011-04-28
    • Nikolai LambertsAndreas BayerManfred HewelHeinz Hoff
    • Nikolai LambertsAndreas BayerManfred HewelHeinz Hoff
    • C08K3/26C08K3/22C08K7/14
    • C08K3/26C08K3/22C08K7/14C08L77/06
    • What is described is a polyamide molding material based on semicrystalline polyamides for production of LED housings or housing components with high strength, high long-term reflectivity and low blistering tendency. The polyamide moulding material proposed consists of the following components (A) 40 to 80% by weight of at least one semiaromatic polyamide based on at least 70 mol % of aromatic dicarboxylic acids and at least 70 mol % of aliphatic diamines having 4 to 18 carbon atoms and having a melting temperature in the range from 270° C. to 340° C. (B) 10 to 30% by weight of titanium dioxide particles (C) 5 to 20% by weight of glass fibres (D) 5-30% by weight of calcium carbonate. The percentages by weight of components (A) to (D) together add up to 100%, with the proviso that components (B), (C) and (D) meet the following conditions: (B)+(C)+(D)=20 to 60% by weight; weight ratio of (C)/(D) in the range from 0.25 to 1.5, where the polyamide molding material may optionally comprise customary additives (E) in addition to components (A) to (D), and where the amount thereof is in addition to the sum of components (A) to (D).
    • 描述的是用于生产具有高强度,高长期反射率和低起泡倾向的LED壳体或壳体部件的半结晶聚酰胺的聚酰胺模塑材料。 提出的聚酰胺成型材料由以下组分(A)40至80重量%的至少一种基于至少70摩尔%的芳族二羧酸和至少70摩尔%的具有4至18个碳原子的脂族二胺的半芳族聚酰胺 原子并且具有在270℃至340℃范围内的熔融温度。(B)10至30重量%的二氧化钛颗粒(C)5至20重量%的玻璃纤维(D)5-30 重量%的碳酸钙。 组分(A)至(D)的重量百分比一起加起来为100%,条件是组分(B),(C)和(D)满足以下条件:(B)+(C)+( D)= 20〜60重量% (C)/(D)的重量比在0.25至1.5的范围内,其中除了组分(A)至(D)之外,聚酰胺模塑材料可任选地包含常规添加剂(E),并且其量在 (A)至(D)的总和除外。