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1. 发明授权

US06921719B2 Method of preparing whole semiconductor wafer for analysis 有权
标题翻译：制备整个半导体晶圆进行分析的方法
公开(公告)号：US06921719B2
公开(公告)日：2005-07-26
申请号：US10065589
申请日：2002-10-31
申请人： Allan Paterson , David G. Halley
发明人： Allan Paterson , David G. Halley
IPC分类号： G01N1/32 , G01R31/28 , H01L21/68 , H01L21/302
CPC分类号： H01L21/6835 , G01N1/32 , G01R31/2886 , G01R31/2898 , H01L2221/6834
摘要： A method for preparing a semiconductor wafer for whole wafer backside inspection is disclosed. The frontside of the wafer is covered with a protective frontside substrate and the backside portion of the wafer is thinned using conventional techniques. The whole wafer backside is then polished and a backside substrate, preferably of transparent material is juxtaposed to the backside of the wafer, such as with an adhesive or with a frame. The frontside substrate is then removed, exposing electronic devices for device inspection. The backside of the wafer is maintained open or available to backside inspection such as emission microscopy techniques used to detect defects which emit light.
摘要翻译：公开了一种用于整体晶片背面检查的半导体晶片的制备方法。晶片的正面被保护性前沿衬底覆盖，并且使用常规技术使晶片的背面部分变薄。然后抛光整个晶片背面，并且优选透明材料的背面基底例如用粘合剂或框架并置到晶片的背面。然后去除前侧基板，暴露电子装置用于装置检查。晶片的背面保持开放或可用于背面检查，例如用于检测发光的缺陷的发射显微镜技术。

2. 发明授权

US06808443B2 Projected gimbal point drive 失效
标题翻译：投影万向节点驱动
公开(公告)号：US06808443B2
公开(公告)日：2004-10-26
申请号：US09877459
申请日：2001-06-07
申请人： David G. Halley
发明人： David G. Halley
IPC分类号： B24B100
CPC分类号： B24B37/30 , B24B41/047 , B24B47/10
摘要： A projected gimbal point drive system is disclosed. The projected gimbal point drive system includes a spindle capable of apply a torque, and having a concave spherical surface formed on its lower portion. Further included is a wafer carrier disposed partially within the lower portion of the spindle. The wafer carrier has a convex spherical surface formed on a surface opposite the concave spherical surface of the spindle. In addition, a drive cup is included that is disposed between the spindle and the wafer carrier. The drive cup has a concave inner surface and a convex outer surface, and allows the wafer carrier to be tilted about a predefined gimbal point. In this manner, torque can be applied without affecting the gimbal action.
摘要翻译：公开了一种投影云台点驱动系统。投影万向节驱动系统包括能够施加扭矩的主轴，并且在其下部形成有凹形的球形表面。还包括一部分位于主轴的下部内的晶片载体。晶片载体具有形成在与主轴的凹形球面相对的表面上的凸形球形表面。此外，包括设置在主轴和晶片载体之间的驱动杯。驱动杯具有凹的内表面和凸的外表面，并且允许晶片载体围绕预定义的万向节点倾斜。以这种方式，可以施加扭矩而不影响万向动作。

3. 发明授权

US06629874B1 Feature height measurement during CMP 失效
标题翻译： CMP期间的特征高度测量
公开(公告)号：US06629874B1
公开(公告)日：2003-10-07
申请号：US09699290
申请日：2000-10-26
申请人： David G. Halley
发明人： David G. Halley
IPC分类号： B24B4900
CPC分类号： B24B37/013 , B24B9/065 , B24B37/04 , B24B37/042 , B24B37/30 , B24B49/02 , B24B49/12 , B24B53/017 , B24B57/02
摘要： Embodiments of the present invention provide a chemical-mechanical planarization method for planarizing a wafer. The method comprises polishing a surface of the wafer to be planarized, and optically measuring feature heights of features on the surface of the wafer to obtain measurement data during said polishing of the surface. In some embodiments, the feature heights are measured by directing incident light at the surface of the wafer and observing a reflected light intensity of light reflected from the surface. In specific embodiments, the method includes adjusting, in real time, parameters controlling said polishing of the surface in response to the measurement data. The parameters may include a spinning speed of the polishing pad used to polish the surface, an orbiting speed of the polishing pad, a rotational speed of the wafer, a position of the polishing pad, a force between the polishing pad and the object, or the like.
摘要翻译：本发明的实施例提供了一种用于平坦化晶片的化学机械平面化方法。该方法包括抛光要平坦化的晶片的表面，以及光学测量晶片表面上的特征的特征高度，以在所述表面抛光期间获得测量数据。在一些实施例中，通过将晶片的表面处的入射光引导并观察从表面反射的光的反射光强度来测量特征高度。在具体实施例中，该方法包括实时调整响应于测量数据控制表面抛光的参数。这些参数可以包括用于抛光表面的抛光垫的旋转速度，抛光垫的旋转速度，晶片的旋转速度，抛光垫的位置，抛光垫和物体之间的力，或者类似。

4. 发明授权

US4900377A Method of making a limited life pad 失效
标题翻译：制作有限寿命垫的方法
公开(公告)号：US4900377A
公开(公告)日：1990-02-13
申请号：US187813
申请日：1988-04-29
申请人： Douglas E. Redford , Lee E. Perdelwitz, Jr. , Ron H. Iff , Paul G. Gaddis , David G. Halley , Michael E. Cotie , David E. Hanke , Amar N. Neogi
发明人： Douglas E. Redford , Lee E. Perdelwitz, Jr. , Ron H. Iff , Paul G. Gaddis , David G. Halley , Michael E. Cotie , David E. Hanke , Amar N. Neogi
IPC分类号： A61F13/472 , A61F13/15 , B32B27/12 , D04H1/54 , D04H13/00
CPC分类号： B32B27/12 , A61F13/8405 , A61F2013/15341 , A61F2013/15829 , A61F2013/15878 , A61F2013/51002 , A61F2013/51078 , A61F2013/51435 , A61F2013/51468 , A61F2013/53035 , A61F2013/53043 , A61F2013/530481 , A61F2013/53908 , A61F2013/8408 , Y10T156/1023 , Y10T156/1054 , Y10T156/108 , Y10T156/1084
摘要： Articles are formed of materials which have at least one layer comprising a mixture of thermoplastic and other fibers. This latter layer may be thermobonded together and then densified along at least a section of the eventual peripheral edge margin of an article to be formed from the material. Thermoplastic material containing cover sheets may also be secured to the core and densified in this manner. The entire eventual peripheral edge margin of the article is typically densified. The material is cut within the densified region or slightly outside the densified region to provide a soft peripheral edge. Absorbent materials may be thermobonded within the layer and surrounded by a densified edge to fix them within the article. The composite materials are used in manufacturing infant car seat liners and other articles. In addition, sections of the material may be densified and provided with weakened areas, such as perforations, to enable users to selectively separate the articles along the perforations.
摘要翻译：制品由具有至少一层包含热塑性纤维和其它纤维的混合物的材料形成。后一层可以热粘合在一起，然后沿着要由材料形成的制品的最终周缘边缘的至少一部分致密化。含有盖片的热塑性材料也可以固定在芯上并以这种方式致密化。物品的整个最终周边边缘通常被致密化。该材料在致密化区域内切割或稍微在致密化区域外切割以提供软的周边边缘。吸收材料可以在层内热粘合并被致密边缘包围以将它们固定在制品内。复合材料用于制造婴儿车座椅衬里和其他物品。此外，材料的部分可以被致密化并且具有削弱的区域，例如穿孔，以使得使用者能够沿着穿孔选择性地分离物品。

5. 发明授权

US06976901B1 In situ feature height measurement 有权
标题翻译：原位特征高度测量
公开(公告)号：US06976901B1
公开(公告)日：2005-12-20
申请号：US10681047
申请日：2003-10-07
申请人： David G. Halley , Greg Barbour
发明人： David G. Halley , Greg Barbour
IPC分类号： B24B37/04 , B24B49/00
CPC分类号： B24B37/04
摘要： Embodiments of the invention provide methods and apparatus for in situ feature height measurement of an object being planarized. In one embodiment, a method of planarizing an object comprises polishing a surface of the object to be planarized using a polishing pad having a cavity; and directing an incident light from the cavity of the polishing pad to optically measure feature heights of surface features on the surface of the object to obtain measurement data during the polishing of the surface using the polishing pad. The feature heights are relative height differences of the features measured by directing the incident light at the surface of the object from the cavity and observing a reflected light intensity of a reflected light from the features on the surface to the cavity.
摘要翻译：本发明的实施例提供了用于正被平坦化的物体的原位特征高度测量的方法和装置。在一个实施例中，平面化物体的方法包括使用具有空腔的抛光垫来抛光要平坦化的物体的表面; 并且引导来自抛光垫的空腔的入射光以光学地测量物体表面上的表面特征的特征高度，以在使用抛光垫抛光表面期间获得测量数据。特征高度是通过将来自空腔的物体表面处的入射光引导而测量的特征的相对高度差，并且观察从表面上的特征到空腔的反射光的反射光强度。

6. 发明授权

US06885206B2 Device for supporting thin semiconductor wafers 失效
标题翻译：用于支撑薄半导体晶片的装置
公开(公告)号：US06885206B2
公开(公告)日：2005-04-26
申请号：US10365081
申请日：2003-02-11
申请人： David G. Halley
发明人： David G. Halley
IPC分类号： G01R1/04
CPC分类号： G01R1/0416
摘要： A device for supporting and securing thin wafers comprising a housing having an upper shelf extending radially inwardly from the housing and a lower shelf extending radially inwardly from the upper shelf. An upper seal is disposed within the upper shelf and an inspection windowpane is disposed within the lower shelf. A vacuum is provided between the inspection windowpane and the upper seal to secure the wafer to the inspection windowpane and to secure the inspection windowpane to the housing. A ring-shaped frame assembly may further support and secure the wafer.
摘要翻译：一种用于支撑和固定薄晶片的装置，包括具有从外壳径向向内延伸的上搁板的外壳和从上搁板径向向内延伸的下搁板。上部密封件设置在上部搁板内，检查窗玻璃设置在下部搁板内。在检查窗玻璃和上密封件之间提供真空以将晶片固定到检查窗玻璃上并将检查窗玻璃固定到壳体。环形框架组件可以进一步支撑并固定晶片。

7. 发明授权

US06855030B2 Modular method for chemical mechanical planarization 有权
标题翻译：化学机械平面化的模块化方法
公开(公告)号：US06855030B2
公开(公告)日：2005-02-15
申请号：US10327712
申请日：2002-12-19
申请人： David G. Halley
发明人： David G. Halley
IPC分类号： B24B9/06 , B24B37/013 , B24B37/04 , B24B37/30 , B24B37/34 , B24B49/02 , B24B49/12 , B24B53/007 , B24B53/017 , B24B57/02 , H01L21/00 , B24B1/00
CPC分类号： H01L21/67167 , B24B9/065 , B24B37/013 , B24B37/04 , B24B37/042 , B24B37/30 , B24B37/345 , B24B49/02 , B24B49/12 , B24B53/017 , B24B57/02 , H01L21/67173 , H01L21/67219
摘要： Specific embodiments of the present invention are directed to a method of operating a modular chemical mechanical planarization process. The method comprises operating CMP apparatus comprising a docking station having at least one CMP module and at least one cleaning module to process one or more substrates therein. The plurality of modules are controllable separately by individual controllers associated separately with the modules. One of the modules is disengaged from the docking station, and is mechanically removed to free the module from the docking station, while the other modules are still operable to process the one or more substrates therein.
摘要翻译：本发明的具体实施方案涉及操作模块化化学机械平面化方法的方法。该方法包括操作CMP装置，其包括具有至少一个CMP模块的对接站和至少一个清洁模块，以在其中处理一个或多个基板。多个模块可以由与模块分开关联的各个控制器分别控制。其中一个模块从对接站脱离，并被机械地移除以将模块从对接站中释放出来，而其它模块仍可操作以处理其中的一个或多个基板。

8. 发明授权

US06379235B1 Wafer support for chemical mechanical planarization 有权
标题翻译：晶片支持化学机械平面化
公开(公告)号：US06379235B1
公开(公告)日：2002-04-30
申请号：US09699289
申请日：2000-10-26
申请人： David G. Halley
发明人： David G. Halley
IPC分类号： B24B500
CPC分类号： B24B37/30 , B24B9/065 , B24B37/013 , B24B37/04 , B24B37/042 , B24B49/02 , B24B49/12 , B24B53/017 , B24B57/02 , H01L21/68728
摘要： The present invention provides an improved planarization apparatus for chemical mechanical planarization. In an exemplary embodiment, the invention provides an apparatus having a back support operatively coupled to the edge support, the back support having at least one surface for supporting a back side of the object during planarization. The surface for supporting the back side provides a substantially friction free interface between the surface and the back side of the object to allow the object to move across the surface of the back support. In some embodiments, an edge support is movably coupled to an edge of an object for supporting and positioning the object during planarization.
摘要翻译：本发明提供一种用于化学机械平面化的改进的平面化装置。在一个示例性实施例中，本发明提供一种具有可操作地耦合到边缘支撑件的后支撑件的装置，所述后支撑件具有用于在平坦化期间支撑物体的后侧的至少一个表面。用于支撑背面的表面在物体的表面和背面之间提供基本上无摩擦的界面，以允许物体移动穿过背部支撑件的表面。在一些实施例中，边缘支撑件可移动地联接到物体的边缘，用于在平坦化期间支撑和定位物体。

9. 发明授权

US06945856B2 Subaperture chemical mechanical planarization with polishing pad conditioning 有权
标题翻译：亚光化学机械平面化与抛光垫调理
公开(公告)号：US06945856B2
公开(公告)日：2005-09-20
申请号：US10374494
申请日：2003-02-25
申请人： John M. Boyd , Michael S. Lacy , David G. Halley
发明人： John M. Boyd , Michael S. Lacy , David G. Halley
IPC分类号： B24B37/20 , B24B37/24 , B24B37/26 , B24B7/22 , B24B53/00
CPC分类号： B24B37/245 , B24B37/20 , B24B37/26 , B24D9/085
摘要： Embodiments of the present invention are directed to polishing an object with polishing pad conditioning. In one embodiment, a method for polishing an object comprises placing a contact portion of a polishing pad in contact with a target surface of the object to be planarized over a contact area which is smaller in area than the target surface; conditioning a noncontact portion of the polishing pad which is not in contact with the target surface of the object; and moving the polishing pad relative to the target surface of the object to move the noncontact portion in contact with the target surface of the object and move the contact portion out of contact with the target surface of the object.
摘要翻译：本发明的实施例涉及用抛光垫调理来抛光物体。在一个实施例中，用于抛光物体的方法包括将抛光垫的接触部分与待平坦化的物体的目标表面接触在比目标表面小的面积的接触区域上; 调节抛光垫的不与物体的目标表面接触的非接触部分; 并且相对于物体的目标表面移动抛光垫，以移动与物体的目标表面接触的非接触部分，并使接触部分脱离与物体的目标表面接触。

10. 发明授权

US06887133B1 Pad support method for chemical mechanical planarization 有权
标题翻译：用于化学机械平面化的垫支撑方法
公开(公告)号：US06887133B1
公开(公告)日：2005-05-03
申请号：US10379962
申请日：2003-03-04
申请人： David G. Halley
发明人： David G. Halley
IPC分类号： B24B37/20 , B24B37/30 , B24B37/34 , B24B41/00 , B24D9/08 , B24B1/00
CPC分类号： B24B37/345 , B24B37/20 , B24B37/30 , B24B41/005 , B24D9/08 , Y10T483/174
摘要： Embodiments of the invention as directed to supporting a polishing pad that can be easily replaced. In one embodiment, a method for polishing an object comprises coupling a polishing head to a substrate for holding a polishing pad which is smaller in area than the object; applying a resilient mechanical force to the perimeter of the substrate with the polishing head to hold the substrate in place during a polishing operation; placing the polishing pad in contact with the object; and rotating the polishing pad with the polishing head.
摘要翻译：本发明的实施例旨在支持可以容易地更换的抛光垫。在一个实施例中，用于抛光物体的方法包括将抛光头连接到用于保持面积小于物体的抛光垫的基板; 用抛光头将弹性机械力施加到衬底的周边，以在抛光操作期间将衬底保持在适当的位置; 将抛光垫放置成与物体接触; 并用研磨头旋转抛光垫。

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