会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 3. 发明授权
    • Method of manufacturing multilayer ceramic wiring board and conductive paste for use
    • 制造多层陶瓷布线板和使用的导电浆料的方法
    • US06846375B2
    • 2005-01-25
    • US09979018
    • 2001-03-15
    • Masaaki HayamaKazuhiro MiuraAkira HashimotoTakeo Yasuho
    • Masaaki HayamaKazuhiro MiuraAkira HashimotoTakeo Yasuho
    • H01L21/48H05K3/46B32B31/26
    • H01L21/4857H01L21/4867H05K3/4664
    • The present invention provides a method of manufacturing a low-temperature sintering multilayer ceramic wiring board comprising the steps of: forming a wiring layer by printing conductive paste (4) on an unfired green sheet (1); forming a laminate by laminating, on at least one side of a ceramic substrate, the unfired green sheet having the wiring layer; and firing the laminate. The present invention also provides paste for use with this method. In the firing step, after an adhesive layer (8) or binder resin in said green sheet used for lamination burns, glass ceramic in the green sheet starts to sinter, and upon or after the start of sintering of the glass ceramic, conductive particles in the conductive paste starts to sinter. This manufacturing method can provide an precise wiring board without pattern deformation and also provide a low-temperature ceramic multilayer wiring board that has no cracks in the glass ceramic on the periphery of electrodes and has electrodes of a dense film structure.
    • 本发明提供一种制造低温烧结多层陶瓷布线板的方法,包括以下步骤:通过在未烧成的生片(1)上印刷导电浆料(4)形成布线层; 在陶瓷基板的至少一侧层叠具有布线层的未烧成的生片,形成层叠体; 并烧制层压板。 本发明还提供了用于该方法的糊剂。 在烧成工序中,在用于层压燃烧的所述生片中的粘合剂层(8)或粘合剂树脂后,生片中的玻璃陶瓷开始烧结,玻璃陶瓷的烧结开始或之后,导电粒子 导电膏开始烧结。 该制造方法可以提供没有图案变形的精确布线板,并且还提供在电极周边的玻璃陶瓷中没有裂纹并且具有致密膜结构的电极的低温陶瓷多层布线板。