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1. 发明授权

US07021956B2 Insulation displacement terminal 失效
标题翻译：绝缘位移端子
公开(公告)号：US07021956B2
公开(公告)日：2006-04-04
申请号：US10501396
申请日：2002-11-21
申请人： Akira Goto , Yoshikazu Takagi , Kazushi Miyahara , Megumi Chiyoda
发明人： Akira Goto , Yoshikazu Takagi , Kazushi Miyahara , Megumi Chiyoda
IPC分类号： H01R11/20
CPC分类号： H01R4/2433 , H01R4/2454 , H01R12/58 , H01R13/415
摘要： An insulation displacement terminal is formed entirely of an integral metal sheet. The terminal includes first and second plate-like insulation displacement groove-forming portions opposed to each other in a first direction along which an insulated wire extends. Each of the insulation displacement groove-forming portions has an insulation displacement blade of a U-shape defining an insulation displacement groove. Bottom portions of the insulation displacement groove-forming portions are interconnected by an interconnecting portion. A lead extends downwardly from one side edge of the interconnecting portion. A holding space for an insulation of the insulated wire is formed between a pair of plate portions which are formed respectively at opposite side edges of the first insulation displacement groove-forming portion by bending. Each of the plate portions has a retaining projection and a bendable piece portion.
摘要翻译：绝缘位移端子整体由整体金属板形成。端子包括在绝缘线延伸的第一方向上彼此相对的第一和第二板状绝缘位移槽形成部。每个绝缘位移槽形成部分具有限定绝缘位移槽的U形绝缘位移叶片。绝缘置换槽形成部分的底部通过互连部分相互连接。引线从互连部分的一个侧边缘向下延伸。用于绝缘线绝缘的保持空间形成在通过弯曲分别形成在第一绝缘置换槽形成部分的相对侧边缘处的一对板部分之间。每个板部分具有保持突起和可弯曲的片部分。

2. 发明授权

US06971903B2 Press-contact connector built in substrate 失效
标题翻译：压接触头内置衬底
公开(公告)号：US06971903B2
公开(公告)日：2005-12-06
申请号：US10502008
申请日：2003-11-21
申请人： Akira Goto , Yoshikazu Takagi , Kazushi Miyahara , Megumi Chiyoda
发明人： Akira Goto , Yoshikazu Takagi , Kazushi Miyahara , Megumi Chiyoda
IPC分类号： H01R4/24 , H01R13/66
CPC分类号： H01R4/2433 , H01R4/2454 , H01R12/515
摘要： The insulation displacement terminal 3 is retained on the terminal retainer portion 5 of the main housing 6. The lead 12 of the insulation displacement terminal 3 is soldered to the first surface 10a of the circuit board 10 through the bottom plate 13 of the main housing 6 and the circuit board 10, which is held in the second retaining space 11 between the main housing 6 and second cover housing 8. After the insulation displacement terminal 3 in such a subassembly state is connected by insulation displacement with a desired portion of the insulated wire 2, the first cover housing 7 is combined with the main housing 6. The receiving portion 44 of the second cover housing 8 receives the insulation displacement load via the bottom plate 13 of the main housing 6 and the circuit board 10. This enables the inadvertent bending of the bottom plate 13 and circuit board 10 to be prevented, the reliable insulation displacement connecting of the connector with the insulated wire to be attained, and the so-called in-housing insulation displacement connecting of the connector with the insulated wire to be substantially carried out.
摘要翻译：绝缘位移端子3保持在主壳体6的端子保持部5上。绝缘位移端子3的引线12通过主壳体6的底板13和电路板10焊接到电路板10的第一表面10a上，电路板10被保持在第二保持空间11之间，主体壳体6和第二盖壳体8。在这种组装状态下的绝缘位移端子3通过绝缘导线2的期望部分的绝缘位移连接之后，第一盖壳体7与主壳体6组合。第二盖壳体8的接收部分44经由主壳体6的底板13和电路板10接收绝缘位移负载。这样可以防止底板13和电路板10的无意弯曲，连接器与绝缘电线的可靠的绝缘位移连接将被实现，以及所谓的连接器与绝缘电线基本上进行。

3. 发明申请

US20050106927A1 Press-contact connector built in substrate 失效
公开(公告)号：US20050106927A1
公开(公告)日：2005-05-19
申请号：US10502008
申请日：2003-11-21
申请人： Akira Goto , Yoshikazu Takagi , Kazushi Miyahara , Megumi Chiyoda
发明人： Akira Goto , Yoshikazu Takagi , Kazushi Miyahara , Megumi Chiyoda
IPC分类号： H01R4/24 , H01R13/66
CPC分类号： H01R4/2433 , H01R4/2454 , H01R12/515
摘要： The insulation displacement terminal 3 is retained on the terminal retainer portion 5 of the main housing 6. The lead 12 of the insulation displacement terminal 3 is soldered to the first surface 10a of the circuit board 10 through the bottom plate 13 of the main housing 6 and the circuit board 10, which is held in the second retaining space 11 between the main housing 6 and second cover housing 8. After the insulation displacement terminal 3 in such a subassembly state is connected by insulation displacement with a desired portion of the insulated wire 2, the first cover housing 7 is combined with the main housing 6. The receiving portion 44 of the second cover housing 8 receives the insulation displacement load via the bottom plate 13 of the main housing 6 and the circuit board 10. This enables the inadvertent bending of the bottom plate 13 and circuit board 10 to be prevented, the reliable insulation displacement connecting of the connector with the insulated wire to be attained, and the so-called in-housing insulation displacement connecting of the connector with the insulated wire to be substantially carried out.

4. 发明申请

US20050079754A1 Insulation displacement terminal 失效
标题翻译：绝缘位移端子
公开(公告)号：US20050079754A1
公开(公告)日：2005-04-14
申请号：US10501396
申请日：2002-11-21
申请人： Akira Goto , Yoshikazu Takagi , Kazushi Miyahara , Megumi Chiyoda
发明人： Akira Goto , Yoshikazu Takagi , Kazushi Miyahara , Megumi Chiyoda
IPC分类号： H01R4/24 , H01R13/415
CPC分类号： H01R4/2433 , H01R4/2454 , H01R12/58 , H01R13/415
摘要： An insulation displacement terminal 3 is formed entirely of an integral metal sheet. The terminal includes first and second plate-like insulation displacement groove-forming portions 71 and 72 opposed to each other in a first direction X along which an insulated wire extends. Each of the insulation displacement groove-forming portions 71 and 72 has an insulation displacement blade 74 of a U-shape defining an insulation displacement groove 73. Bottom portions of the insulation displacement groove-forming portions 71 and 72 are interconnected by an interconnecting portion 75. A lead 12 extends downwardly from one side edge of the interconnecting portion 75. A holding space R for an insulation of the insulated wire is formed between a pair of plate portions 78 and 79 which are formed respectively at opposite side edges of the first insulation displacement groove-forming portion 71 by bending. Each of the plate portions 78 and 79 has a retaining projection 80 and a bendable piece portion 81. Retaining projections 76, 77 extend respectively from the opposite side edges of each of the insulation displacement groove-forming portions 71 and 72.
摘要翻译：绝缘位移端子3整体由整体金属片形成。端子包括在绝缘线延伸的第一方向X上彼此相对的第一和第二板状绝缘位移槽形成部分71和72。每个绝缘位移槽形成部分71和72具有限定绝缘位移槽73的U形绝缘位移叶片74.绝缘位移槽形成部分71和72的底部通过互连部分75互连引线12从互连部分75的一个侧边缘向下延伸。用于绝缘线绝缘的保持空间R形成在分别形成在第一绝缘体的相对侧边缘处的一对板部分78和79之间位移槽形成部71。每个板部分78和79具有保持突起80和可弯曲片部分81.保持突起76,77分别从每个绝缘置换槽形成部分71和72的相对侧边缘延伸。

5. 发明授权

US08120891B2 Multilayer capacitor having low equivalent series inductance and controlled equivalent series resistance 有权
标题翻译：具有低等效串联电感和受控等效串联电阻的多层电容器
公开(公告)号：US08120891B2
公开(公告)日：2012-02-21
申请号：US12335554
申请日：2008-12-16
申请人： Hirokazu Takashima , Hiroshi Ueoka , Yoshikazu Takagi
发明人： Hirokazu Takashima , Hiroshi Ueoka , Yoshikazu Takagi
IPC分类号： H01G4/06 , H01G4/228 , H01G4/005
CPC分类号： H01G4/30 , H01G4/228
摘要： In a capacitor body of a multilayer capacitor, one second capacitor portion is sandwiched between two first capacitor portions. An ESR is controlled by setting a width of lead portions of third and fourth internal electrodes disposed in the second capacitor portion to be less than that of lead portions of first and second internal electrodes disposed in the first capacitor portions and by changing ratios between the first and second capacitor portions in the width of the lead portions and in the number of stacked internal electrodes. In the first capacitor portions, current paths from the internal electrodes to an external terminal electrode are widely distributed so that the first capacitor portions have a relatively low ESL, and accordingly, the ESL of the entire multilayer capacitor is reduced.
摘要翻译：在层叠电容器的电容器体中，一个第二电容器部分夹在两个第一电容器部分之间。通过将布置在第二电容器部分中的第三和第四内部电极的引线部分的宽度设置为小于设置在第一电容器部分中的第一和第二内部电极的引线部分的宽度，并且通过改变第一以及在引线部分的宽度和堆叠的内部电极的数量中的第二电容器部分。在第一电容器部分中，从内部电极到外部端子电极的电流路径广泛分布，使得第一电容器部分具有相对较低的ESL，因此整个层叠电容器的ESL减小。

6. 发明申请

US20090154055A1 MULTILAYER CAPACITOR 有权
标题翻译：多层电容器
公开(公告)号：US20090154055A1
公开(公告)日：2009-06-18
申请号：US12335554
申请日：2008-12-16
申请人： Hirokazu Takashima , Hiroshi Ueoka , Yoshikazu Takagi
发明人： Hirokazu Takashima , Hiroshi Ueoka , Yoshikazu Takagi
IPC分类号： H01G4/30
CPC分类号： H01G4/30 , H01G4/228
摘要： In a capacitor body of a multilayer capacitor, one second capacitor portion is sandwiched between two first capacitor portions. An ESR is controlled by setting a width of lead portions of third and fourth internal electrodes disposed in the second capacitor portion to be less than that of lead portions of first and second internal electrodes disposed in the first capacitor portions and by changing ratios between the first and second capacitor portions in the width of the lead portions and in the number of stacked internal electrodes. In the first capacitor portions, current paths from the internal electrodes to an external terminal electrode are widely distributed so that the first capacitor portions have a relatively low ESL, and accordingly, the ESL of the entire multilayer capacitor is reduced.
摘要翻译：在层叠电容器的电容器体中，一个第二电容器部分夹在两个第一电容器部分之间。通过将布置在第二电容器部分中的第三和第四内部电极的引线部分的宽度设置为小于设置在第一电容器部分中的第一和第二内部电极的引线部分的宽度，并且通过改变第一以及在引线部分的宽度和堆叠的内部电极的数量中的第二电容器部分。在第一电容器部分中，从内部电极到外部端子电极的电流路径广泛分布，使得第一电容器部分具有相对较低的ESL，因此整个层叠电容器的ESL减小。

7. 发明申请

US20080225463A1 LAYERED CAPACITOR AND MOUNTING STRUCTURE 审中-公开
标题翻译：层状电容器和安装结构
公开(公告)号：US20080225463A1
公开(公告)日：2008-09-18
申请号：US12124325
申请日：2008-05-21
申请人： Hirokazu Takashima , Hiroshi Ueoka , Yoshikazu Takagi
发明人： Hirokazu Takashima , Hiroshi Ueoka , Yoshikazu Takagi
IPC分类号： H01G4/232
CPC分类号： H01G4/38 , H01G4/232 , H01G4/30
摘要： A layered capacitor includes a capacitor body that is divided into two first capacitor sections and a second capacitor section. The first capacitor sections are disposed at ends in a layer-stacking direction such that the second capacitor section is interposed between the first capacitor sections in the layer-stacking direction. The resonant frequency of the first capacitor sections is greater than that of the second capacitor section. The total number of third internal electrodes and fourth internal electrodes provided per dielectric layer included in the second capacitor section is less than the total number of first via conductors and second via conductors per dielectric layer included in the first capacitor sections. The ESR per dielectric layer included in the second capacitor section is greater than that per dielectric layer included in the first capacitor sections.
摘要翻译：分层电容器包括被分为两个第一电容器部分和第二电容器部分的电容器体。第一电容器部分在层堆叠方向的端部设置，使得第二电容器部分在层堆叠方向上介于第一电容器部分之间。第一电容器部分的谐振频率大于第二电容器部分的谐振频率。包括在第二电容器部分中的每个电介质层提供的第三内部电极和第四内部电极的总数小于第一电容器部分中包括的每个电介质层的第一通路导体和第二通孔导体的总数。包括在第二电容器部分中的每个介电层的ESR大于包括在第一电容器部分中的每个介电层的ESR。

8. 发明申请

US20060250747A1 Layer-built capacitor, and its manufacturing method 有权
标题翻译：层压电容器及其制造方法
公开(公告)号：US20060250747A1
公开(公告)日：2006-11-09
申请号：US10567011
申请日：2005-04-08
申请人： Hirokazu Takashima , Yoshikazu Takagi , Hiroshi Ueoka , Teruo Yoshida
发明人： Hirokazu Takashima , Yoshikazu Takagi , Hiroshi Ueoka , Teruo Yoshida
IPC分类号： H01G4/255
CPC分类号： H01G4/30 , H01G4/12 , H01G4/232 , Y10T29/435
摘要： A multilayer capacitor includes first and second internal electrodes that are opposed to each other so as to generate an electrostatic capacitance and have a capacitance generating portion functioning to generate the electrostatic capacitance, terminal connecting portions connected to corresponding external terminal electrodes, and extended portions connecting the capacitance generating portion to the terminal connecting portions. The extended portions are narrower than the capacitance generating portion and the terminal connecting portion and are curved in the direction of their thickness so as to provide a longer effective length. The multi-terminal capacitor is capable of increasing an ESR without adding a separate additional element.
摘要翻译：多层电容器包括彼此相对的第一和第二内部电极，以便产生静电电容，并且具有用于产生静电电容的电容产生部分，连接到对应的外部端子电极的端子连接部分和连接到电容产生部分连接到端子连接部分。延伸部分比电容产生部分和端子连接部分窄，并且在其厚度方向上弯曲，从而提供更长的有效长度。多端子电容器能够增加ESR而不增加单独的附加元件。

9. 发明授权

US07616427B2 Monolithic ceramic capacitor 有权
标题翻译：单片陶瓷电容器
公开(公告)号：US07616427B2
公开(公告)日：2009-11-10
申请号：US11751218
申请日：2007-05-21
申请人： Hirokazu Takashima , Hiroshi Ueoka , Yoshikazu Takagi
发明人： Hirokazu Takashima , Hiroshi Ueoka , Yoshikazu Takagi
IPC分类号： H01G4/06
CPC分类号： H01G4/012 , H01G4/232 , H01G4/30
摘要： A monolithic ceramic capacitor includes a first same-polarity-electrode-connecting conductor and a second same-polarity-electrode-connecting conductor that are provided inside a ceramic laminate. The first same-polarity-electrode-connecting conductor is electrically connected to all of the first outer electrodes, and the second same-polarity-electrode-connecting conductor is electrically connected to all of the second outer electrodes. Preferably, a plurality of first same-polarity-electrode-connecting conductors and a plurality of second same-polarity-electrode-connecting conductors are successively disposed in the laminating direction inside the ceramic laminate.
摘要翻译：一种叠层陶瓷电容器包括设置在陶瓷层压板内部的第一相同极性 - 电极连接导体和第二相同极性 - 电极连接导体。第一相同极性 - 电极连接导体与所有第一外部电极电连接，并且第二相同极性 - 电极连接导体电连接到所有第二外部电极。优选地，多个第一同极性电极连接导体和多个第二相同极性电极连接导体在层叠方向内依次设置在陶瓷层叠体内。

10. 发明授权

US07508647B2 Multilayer capacitor 有权
标题翻译：多层电容器
公开(公告)号：US07508647B2
公开(公告)日：2009-03-24
申请号：US12120870
申请日：2008-05-15
申请人： Hirokazu Takashima , Hiroshi Ueoka , Yoshikazu Takagi
发明人： Hirokazu Takashima , Hiroshi Ueoka , Yoshikazu Takagi
IPC分类号： H01G4/228
CPC分类号： H01G4/40 , H01G4/232 , H01G4/30
摘要： In a multilayer capacitor including a capacitor body, first capacitor portions and a second capacitor portion are arranged in the direction of lamination. While a resonant frequency of the first capacitor portions is set to be greater than a resonant frequency of the second capacitor portion so that the first capacitor portions contribute to low ESL, an ESR per layer of the second capacitor portion is set to be greater than an ESR per layer of the first capacitor portions so that the second capacitor portion contributes to high ESR. Furthermore, a combined ESR of the first capacitor portions is set to be less than or greater than a combined ESR of the second capacitor portion.
摘要翻译：在包括电容器本体的层叠电容器中，沿层叠方向布置第一电容器部分和第二电容器部分。当第一电容器部分的谐振频率被设定为大于第二电容器部分的谐振频率，使得第一电容器部分有助于低ESL时，每层第二电容器部分的ESR被设置为大于 ESR，使得第二电容器部分有助于高ESR。此外，第一电容器部分的组合ESR被设置为小于或大于第二电容器部分的组合ESR。

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