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1. 发明授权

US08183142B2 Semiconductor device and a method of manufacturing the same 有权
公开(公告)号：US08183142B2
公开(公告)日：2012-05-22
申请号：US12766567
申请日：2010-04-23
申请人： Akihiko Yoshioka , Shinya Suzuki
发明人： Akihiko Yoshioka , Shinya Suzuki
IPC分类号： H01L21/44
CPC分类号： H01L27/124 , G02F1/13452 , H01L21/50 , H01L23/3157 , H01L23/48 , H01L23/485 , H01L23/522 , H01L24/11 , H01L24/13 , H01L24/83 , H01L2021/60232 , H01L2021/60262 , H01L2224/0401 , H01L2224/0603 , H01L2224/1147 , H01L2224/13027 , H01L2224/13099 , H01L2224/1403 , H01L2224/14104 , H01L2224/16105 , H01L2224/29075 , H01L2224/2929 , H01L2224/293 , H01L2224/45124 , H01L2224/73203 , H01L2224/73204 , H01L2224/83851 , H01L2924/0001 , H01L2924/00011 , H01L2924/00012 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/1306 , H01L2924/14 , H01L2924/15788 , H01L2924/19043 , H01L2924/00 , H01L2224/48
摘要： A semiconductor device manufacturing technique which allows reduction of semiconductor chip size. First, a pad and other wires are formed over an insulating film. A surface protective film is formed over the insulating film including the pad and wires, and an opening is made in the surface protective film. The opening lies over the pad and exposes a surface of the pad. A bump electrode is formed over the surface protective film including the opening. Here, the pad is smaller than the bump electrode. Consequently, the wires are arranged just beneath the bump electrode in the same layer as the pad 10. In other words, the wires are arranged in space which becomes available because the pad is small enough.

2. 发明授权

US07728442B2 Semiconductor device and a method of manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07728442B2
公开(公告)日：2010-06-01
申请号：US11953068
申请日：2007-12-09
申请人： Akihiko Yoshioka , Shinya Suzuki
发明人： Akihiko Yoshioka , Shinya Suzuki
IPC分类号： H01L23/48 , H01L29/40
CPC分类号： H01L27/124 , G02F1/13452 , H01L21/50 , H01L23/3157 , H01L23/48 , H01L23/485 , H01L23/522 , H01L24/11 , H01L24/13 , H01L24/83 , H01L2021/60232 , H01L2021/60262 , H01L2224/0401 , H01L2224/0603 , H01L2224/1147 , H01L2224/13027 , H01L2224/13099 , H01L2224/1403 , H01L2224/14104 , H01L2224/16105 , H01L2224/29075 , H01L2224/2929 , H01L2224/293 , H01L2224/45124 , H01L2224/73203 , H01L2224/73204 , H01L2224/83851 , H01L2924/0001 , H01L2924/00011 , H01L2924/00012 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/1306 , H01L2924/14 , H01L2924/15788 , H01L2924/19043 , H01L2924/00 , H01L2224/48
摘要： A semiconductor device manufacturing technique which allows reduction of semiconductor chip size. First, a pad and other wires are formed over an insulating film. A surface protective film is formed over the insulating film including the pad and wires, and an opening is made in the surface protective film. The opening lies over the pad and exposes a surface of the pad. A bump electrode is formed over the surface protective film including the opening. Here, the pad is smaller than the bump electrode. Consequently, the wires are arranged just beneath the bump electrode in the same layer as the pad 10. In other words, the wires are arranged in space which becomes available because the pad is small enough.
摘要翻译：一种允许减小半导体芯片尺寸的半导体器件制造技术。首先，在绝缘膜上形成焊盘和其它电线。在包括焊盘和电线的绝缘膜上形成表面保护膜，并且在表面保护膜中形成开口。开口位于垫上并露出垫的表面。在包括开口的表面保护膜之上形成凸起电极。这里，焊盘小于凸块电极。因此，电线布置在与焊盘10相同的层中的突起电极正下方。换句话说，导线布置在可用的空间中，因为焊盘足够小。

3. 发明授权

US07538430B2 Semiconductor device and a method of manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07538430B2
公开(公告)日：2009-05-26
申请号：US11953055
申请日：2007-12-09
申请人： Akihiko Yoshioka , Shinya Suzuki
发明人： Akihiko Yoshioka , Shinya Suzuki
IPC分类号： H01L29/40
CPC分类号： H01L27/124 , G02F1/13452 , H01L21/50 , H01L23/3157 , H01L23/48 , H01L23/485 , H01L23/522 , H01L24/11 , H01L24/13 , H01L24/83 , H01L2021/60232 , H01L2021/60262 , H01L2224/0401 , H01L2224/0603 , H01L2224/1147 , H01L2224/13027 , H01L2224/13099 , H01L2224/1403 , H01L2224/14104 , H01L2224/16105 , H01L2224/29075 , H01L2224/2929 , H01L2224/293 , H01L2224/45124 , H01L2224/73203 , H01L2224/73204 , H01L2224/83851 , H01L2924/0001 , H01L2924/00011 , H01L2924/00012 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/1306 , H01L2924/14 , H01L2924/15788 , H01L2924/19043 , H01L2924/00 , H01L2224/48
摘要： A semiconductor device manufacturing technique which allows reduction of semiconductor chip size. First, a pad and other wires are formed over an insulating film. A surface protective film is formed over the insulating film including the pad and wires, and an opening is made in the surface protective film. The opening lies over the pad and exposes a surface of the pad. A bump electrode is formed over the surface protective film including the opening. Here, the pad is smaller than the bump electrode. Consequently, the wires are arranged just beneath the bump electrode in the same layer as the pad 10. In other words, the wires are arranged in space which becomes available because the pad is small enough.
摘要翻译：一种允许减小半导体芯片尺寸的半导体器件制造技术。首先，在绝缘膜上形成焊盘和其它电线。在包括焊盘和电线的绝缘膜上形成表面保护膜，并且在表面保护膜中形成开口。开口位于垫上并露出垫的表面。在包括开口的表面保护膜之上形成凸起电极。这里，焊盘小于凸块电极。因此，电线布置在与焊盘10相同的层中的突起电极正下方。换句话说，导线布置在可用的空间中，因为焊盘足够小。

4. 发明授权

US08338968B2 Semiconductor device and a method of manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08338968B2
公开(公告)日：2012-12-25
申请号：US13396456
申请日：2012-02-14
申请人： Akihiko Yoshioka , Shinya Suzuki
发明人： Akihiko Yoshioka , Shinya Suzuki
IPC分类号： H01L23/48 , H01L29/40
CPC分类号： H01L27/124 , G02F1/13452 , H01L21/50 , H01L23/3157 , H01L23/48 , H01L23/485 , H01L23/522 , H01L24/11 , H01L24/13 , H01L24/83 , H01L2021/60232 , H01L2021/60262 , H01L2224/0401 , H01L2224/0603 , H01L2224/1147 , H01L2224/13027 , H01L2224/13099 , H01L2224/1403 , H01L2224/14104 , H01L2224/16105 , H01L2224/29075 , H01L2224/2929 , H01L2224/293 , H01L2224/45124 , H01L2224/73203 , H01L2224/73204 , H01L2224/83851 , H01L2924/0001 , H01L2924/00011 , H01L2924/00012 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/1306 , H01L2924/14 , H01L2924/15788 , H01L2924/19043 , H01L2924/00 , H01L2224/48
摘要： A semiconductor device manufacturing technique which allows reduction of semiconductor chip size. First, a pad and other wires are formed over an insulating film. A surface protective film is formed over the insulating film including the pad and wires, and an opening is made in the surface protective film. The opening lies over the pad and exposes a surface of the pad. A bump electrode is formed over the surface protective film including the opening. Here, the pad is smaller than the bump electrode. Consequently, the wires are arranged just beneath the bump electrode in the same layer as the pad 10. In other words, the wires are arranged in space which becomes available because the pad is small enough.
摘要翻译：一种允许减小半导体芯片尺寸的半导体器件制造技术。首先，在绝缘膜上形成焊盘和其它电线。在包括焊盘和电线的绝缘膜上形成表面保护膜，并且在表面保护膜中形成开口。开口位于垫上并露出垫的表面。在包括开口的表面保护膜之上形成凸起电极。这里，焊盘小于凸块电极。因此，电线布置在与焊盘10相同的层中的突起电极正下方。换句话说，导线布置在可用的空间中，因为焊盘足够小。

5. 发明申请

US20070080416A1 Semiconductor device and a method of manufacturing the same 审中-公开
标题翻译：半导体装置及其制造方法
公开(公告)号：US20070080416A1
公开(公告)日：2007-04-12
申请号：US11543859
申请日：2006-10-06
申请人： Akihiko Yoshioka , Shinya Suzuki
发明人： Akihiko Yoshioka , Shinya Suzuki
IPC分类号： H01L31/0203 , H01L21/44
CPC分类号： H01L27/124 , G02F1/13452 , H01L21/50 , H01L23/3157 , H01L23/48 , H01L23/485 , H01L23/522 , H01L24/11 , H01L24/13 , H01L24/83 , H01L2021/60232 , H01L2021/60262 , H01L2224/0401 , H01L2224/0603 , H01L2224/1147 , H01L2224/13027 , H01L2224/13099 , H01L2224/1403 , H01L2224/14104 , H01L2224/16105 , H01L2224/29075 , H01L2224/2929 , H01L2224/293 , H01L2224/45124 , H01L2224/73203 , H01L2224/73204 , H01L2224/83851 , H01L2924/0001 , H01L2924/00011 , H01L2924/00012 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/1306 , H01L2924/14 , H01L2924/15788 , H01L2924/19043 , H01L2924/00 , H01L2224/48
摘要： A semiconductor device manufacturing technique which allows reduction of semiconductor chip size. First, a pad and other wires are formed over an insulating film. A surface protective film is formed over the insulating film including the pad and wires, and an opening is made in the surface protective film. The opening lies over the pad and exposes a surface of the pad. A bump electrode is formed over the surface protective film including the opening. Here, the pad is smaller than the bump electrode. Consequently, the wires are arranged just beneath the bump electrode in the same layer as the pad 10. In other words, the wires are arranged in space which becomes available because the pad is small enough.
摘要翻译：一种允许减小半导体芯片尺寸的半导体器件制造技术。首先，在绝缘膜上形成焊盘和其它电线。在包括焊盘和电线的绝缘膜上形成表面保护膜，并且在表面保护膜中形成开口。开口位于垫上并露出垫的表面。在包括开口的表面保护膜之上形成凸起电极。这里，焊盘小于凸块电极。因此，电线布置在与焊盘10相同的层中的凸起电极正下方。换句话说，导线布置在可用的空间中，因为垫足够小。

6. 发明授权

US08525824B2 Liquid crystal display driver device and liquid crystal display system 有权
标题翻译：液晶显示驱动器和液晶显示系统
公开(公告)号：US08525824B2
公开(公告)日：2013-09-03
申请号：US12707710
申请日：2010-02-18
申请人： Kazuhiro Okamura , Akihiko Yoshioka
发明人： Kazuhiro Okamura , Akihiko Yoshioka
IPC分类号： G06F3/038 , G09G5/00
CPC分类号： G09G3/3688 , G09G3/2011 , G09G3/3614 , G09G2310/027 , G09G2310/0283 , G09G2310/0297 , G09G2310/08 , G09G2330/025 , G09G2330/06
摘要： There is provided a display driver device (liquid crystal driver) causing no degradation in display image quality even when a plurality of signal lines (source lines) of a display panel are divided into a plurality of groups as a countermeasure against EMI. With a liquid crystal display driver device (the liquid crystal driver) for generating image signals to be impressed to respective signal lines of a display panel upon receiving display image data, and outputting the image signals in a lump, corresponding to every one line, according to an output timing signal inputted from outside, output amplifiers, in the last stage of the liquid crystal driver, for outputting the image signals, respectively, are divided into a plurality of groups, and the output amplifiers of respective groups are caused to undergo a periodical change in output sequence while the respective image signals are slightly staggered in output timing by the group.
摘要翻译：即使当将显示面板的多条信号线（源极线）分成多组作为EMI的对策时，也提供了不会使显示图像质量下降的显示驱动器件（液晶驱动器）。利用液晶显示驱动器（液晶驱动器），用于在接收到显示图像数据时产生要向显示面板的各个信号线施加的图像信号，并根据每一行输出图像信号对于从外部输入的输出定时信号，分别将用于输出图像信号的液晶驱动器的最后级的输出放大器分成多组，并且使各组的输出放大器经历输出顺序的周期性变化，而各组图像信号在输出定时略微交错。

7. 发明授权

US07683873B2 Liquid crystal display driver device and liquid crystal display system 有权
标题翻译：液晶显示驱动器和液晶显示系统
公开(公告)号：US07683873B2
公开(公告)日：2010-03-23
申请号：US11123153
申请日：2005-05-06
申请人： Kazuhiro Okamura , Akihiko Yoshioka
发明人： Kazuhiro Okamura , Akihiko Yoshioka
IPC分类号： G09G3/36
CPC分类号： G09G3/3688 , G09G3/2011 , G09G3/3614 , G09G2310/027 , G09G2310/0283 , G09G2310/0297 , G09G2310/08 , G09G2330/025 , G09G2330/06
摘要： There is provided a display driver device (liquid crystal driver) causing no degradation in display image quality even when a plurality of signal lines (source lines) of a display panel are divided into a plurality of groups as a countermeasure against EMI. With a liquid crystal display driver device (the liquid crystal driver) for generating image signals to be impressed to respective signal lines of a display panel upon receiving display image data, and outputting the image signals in a lump, corresponding to every one line, according to an output timing signal inputted from outside, output amplifiers, in the last stage of the liquid crystal driver, for outputting the image signals, respectively, are divided into a plurality of groups, and the output amplifiers of respective groups are caused to undergo a periodical change in output sequence while the respective image signals are slightly staggered in output timing by the group.
摘要翻译：即使当将显示面板的多条信号线（源极线）分成多组作为EMI的对策时，也提供了不会使显示图像质量下降的显示驱动器件（液晶驱动器）。利用液晶显示驱动器（液晶驱动器），用于在接收到显示图像数据时产生要向显示面板的各个信号线施加的图像信号，并根据每一行输出图像信号对于从外部输入的输出定时信号，分别将用于输出图像信号的液晶驱动器的最后级的输出放大器分成多组，并且使各组的输出放大器经历输出顺序的周期性变化，而各组图像信号在输出定时略微交错。

8. 发明申请

US20050264548A1 Liquid crystal display driver device and liquid crystal display system 有权
标题翻译：液晶显示驱动器和液晶显示系统
公开(公告)号：US20050264548A1
公开(公告)日：2005-12-01
申请号：US11123153
申请日：2005-05-06
申请人： Kazuhiro Okamura , Akihiko Yoshioka
发明人： Kazuhiro Okamura , Akihiko Yoshioka
IPC分类号： G02F1/133 , G09G3/20 , G09G3/36
CPC分类号： G09G3/3688 , G09G3/2011 , G09G3/3614 , G09G2310/027 , G09G2310/0283 , G09G2310/0297 , G09G2310/08 , G09G2330/025 , G09G2330/06
摘要： There is provided a display driver device (liquid crystal driver) causing no degradation in display image quality even when a plurality of signal lines (source lines) of a display panel are divided into a plurality of groups as a countermeasure against EMI. With a liquid crystal display driver device (the liquid crystal driver) for generating image signals to be impressed to respective signal lines of a display panel upon receiving display image data, and outputting the image signals in a lump, corresponding to every one line, according to an output timing signal inputted from outside, output amplifiers, in the last stage of the liquid crystal driver, for outputting the image signals, respectively, are divided into a plurality of groups, and the output amplifiers of respective groups are caused to undergo a periodical change in output sequence while the respective image signals are slightly staggered in output timing by the group.
摘要翻译：即使当将显示面板的多条信号线（源极线）分成多组作为EMI的对策时，也提供了不会使显示图像质量下降的显示驱动器件（液晶驱动器）。利用液晶显示驱动器（液晶驱动器），用于在接收到显示图像数据时产生要向显示面板的各个信号线施加的图像信号，并根据每一行输出图像信号对于从外部输入的输出定时信号，分别将用于输出图像信号的液晶驱动器的最后级的输出放大器分成多组，并且使各组的输出放大器经历输出顺序的周期性变化，而各组图像信号在输出定时略微交错。

9. 发明授权

US09941358B2 Semiconductor integrated circuit with guard ring 有权
公开(公告)号：US09941358B2
公开(公告)日：2018-04-10
申请号：US13557923
申请日：2012-07-25
申请人： Akihiko Yoshioka
发明人： Akihiko Yoshioka
IPC分类号： H01L29/66 , H01L29/10 , H01L29/06 , H01L27/02 , H01L29/861
CPC分类号： H01L29/1087 , H01L27/0251 , H01L29/0615 , H01L29/0619 , H01L29/0692 , H01L29/861
摘要： A semiconductor integrated circuit includes a first conduction-type semiconductor region, a second conduction-type first impurity region, and a guard ring formed using a first conduction-type second impurity region so as to form a protection device of an electrostatic protection circuit. The first impurity region is formed inside the semiconductor region to have a rectangular planar structure with long and short sides. The guard ring is formed inside the semiconductor region to surround the periphery of the first impurity region. A weak spot is formed on the short side of the rectangular planar structure of the first impurity region. A plurality of electrical contacts are formed in a first portion of the guard ring which faces the long side of the rectangle. A plurality of electrical contracts are not formed in a second portion of the guard ring which faces the weak spot formed on the short side of the rectangle.

10. 发明授权

US5745878A Business requirement handling apparatus 失效
标题翻译：业务需求处理设备
公开(公告)号：US5745878A
公开(公告)日：1998-04-28
申请号：US419768
申请日：1995-04-10
申请人： Keiji Hashimoto , Yasuyuki Fujikawa , Akihiko Yoshioka , Jun Ginbayashi , Kazuo Yabuta , Yukio Imazu
发明人： Keiji Hashimoto , Yasuyuki Fujikawa , Akihiko Yoshioka , Jun Ginbayashi , Kazuo Yabuta , Yukio Imazu
IPC分类号： G06F9/06 , G06F17/00 , G06Q10/06 , G06Q30/02 , G06F17/60 , G06F17/30
CPC分类号： G06Q30/0201 , G06Q10/06 , Y10S707/99943 , Y10S707/99945
摘要： A business requirement handling apparatus is adapted to a data processing system which includes a central processing unit, a display unit and an input unit. The business requirement handling apparatus is provided with a business requirement database accumulating and managing business requirements of businesses to be programmed depending on a substrate indicating predetermined data types and relations thereof, business requirement editing process device displaying business requirements on display unit to perform editing process and storing edited business requirements in business requirement database in units of individual data types, where each of business requirements are described in the form of a restricting expression which restricts input data if a processing content is formed of input items, described in the form of a calculation expression for obtaining output data if the processing content is formed of output items, and added with a conditional expression if a necessary condition exists, a contradiction detecting process device detecting existence of contradictions among the business requirements stored in business requirement database based on attributes including restricting expression, calculation expression or conditional expression annexed to items of business requirements, and notifying a user of content of contradiction when contradiction is detected, and a program synthesizing process device generating program parts from requirements of each item based on business requirements stored in business requirement database, and generating business program which is executable in a user environment by synthesizing the program parts with a given control logic.
摘要翻译：业务需求处理装置适用于包括中央处理单元，显示单元和输入单元的数据处理系统。所述业务需求处理装置具有业务需求数据库，根据表示规定的数据类型及其关系的基板来积存和管理要编程的业务的业务需求，业务需求编辑处理装置显示对显示单元的业务需求以进行编辑处理，将业务需求数据库中编辑的业务需求存储在单独的数据类型中，其中每个业务需求以限制表达式的形式描述，其限制输入数据，如果处理内容是由计算形式描述的输入项形成的如果处理内容由输出项形成，则获得输出数据的表达式，并且如果存在必要条件则添加条件表达式;矛盾检测处理装置，检测存储在业务需求数据中的业务需求之间存在矛盾基于属性的基础，包括限制表达式，计算表达式或附加于业务需求的条件表达式，以及当检测到矛盾时向用户通知矛盾内容;以及程序合成处理设备，根据基于业务的每个项目的要求生成程序部分存储在业务需求数据库中的要求，以及通过使用给定的控制逻辑合成程序部分来生成可在用户环境中执行的业务程序。

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