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1. 发明申请

US20020024348A1 Packaging and interconnection of contact structure 失效
公开(公告)号：US20020024348A1
公开(公告)日：2002-02-28
申请号：US09929532
申请日：2001-08-13
申请人： Advantest Corp.
发明人： Mark R. Jones , Theodore A. Khoury
IPC分类号： G01R031/02
CPC分类号： G01R1/06744 , G01R3/00 , H01R4/04 , H01R13/2414
摘要： A packaging and interconnection of a contact structure formed of a contact structure made of conductive material and formed on a contact substrate through a micro-fabrication process, a contact pad connected to contact substrate and provided at the bottom surface of the contact substrate, a printed circuit board (PCB) pad provided on a printed circuit board (PCB) substrate to be electrically connected with the contact pad, a conductive member for connecting the contact pad the PCB pad, an elastomer provided under the contact substrate for allowing flexibility in the interconnection and packaging of the contact structure, and a support structure provided between the elastomer and the PCB substrate for supporting the contact structure, contact substrate and elastomer.

2. 发明申请

US20010023770A1 Packaging and interconnection of contact structure 失效
标题翻译：接触结构的包装和互连
公开(公告)号：US20010023770A1
公开(公告)日：2001-09-27
申请号：US09765113
申请日：2001-01-18
申请人： Advantest Corp.
发明人： Mark R. Jones , Theodore A. Khoury
IPC分类号： H02G003/08
CPC分类号： G01R31/2808 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2924/07811 , H01L2924/30107 , H01L2924/3011 , H01L2924/00014 , H01L2924/00
摘要： A packaging and interconnection of a contact structure formed of a contact structure made of conductive material and formed on a contact substrate through a photolithography process, a contact trace formed on the contact substrate and electrically connected to the contact structure at one end, and the other end of the contact trace is provided with a contact pad for establishing packaging and interconnection from an upper surface thereof, a printed circuit board (PCB) pad provided on a printed circuit board (PCB) substrate to be electrically connected with the contact pad, an elastomer provided under the contact substrate for allowing flexibility in the interconnection and packaging of the contact structure, and a support structure provided between the elastomer and the PCB substrate for supporting the contact structure, contact substrate and elastomer.
摘要翻译：由导电材料制成的接触结构形成并通过光刻工艺在接触基板上形成的接触结构的封装和互连，形成在接触基板上并且在一端电连接到接触结构的接触迹线接触迹线的端部设置有用于从其上表面建立封装和互连的接触焊盘，设置在印刷电路板（PCB）基板上以与接触焊盘电连接的印刷电路板（PCB）焊盘，设置在接触基板下方的弹性体，用于允许接触结构的互连和封装的灵活性，以及设置在弹性体和PCB基板之间的用于支撑接触结构，接触基板和弹性体的支撑结构。

3. 发明申请

US20020089343A1 Contact structure for electrical communication with contact targets 失效
标题翻译：与接触目标电气通信的接触结构
公开(公告)号：US20020089343A1
公开(公告)日：2002-07-11
申请号：US10058951
申请日：2002-01-28
申请人： Advantest Corp.
发明人： Theodore A. Khoury , Mark R. Jones , James W. Frame
IPC分类号： G01R031/02
CPC分类号： G01R3/00 , G01R1/06711 , G01R1/07342
摘要： A contact structure for testing a semiconductor wafer, a packaged LSI or a printed circuit board is formed on a planar surface of a substrate by a photolithography technology. The contact structure is formed of a silicon base having an inclined support portion created through an anisotropic etching process, an insulation layer formed on the silicon base and abutted from the inclined support, and a conductive layer made of conductive material formed on the insulation layer so that a beam portion is created by the insulation layer and the conductive layer, where wherein the beam portion exhibits a spring force in a transversal direction of the beam portion to establish a contact force when the tip of the beam portion pressed against a contact target.
摘要翻译：通过光刻技术在基板的平面上形成用于测试半导体晶片，封装LSI或印刷电路板的接触结构。接触结构由具有通过各向异性蚀刻工艺形成的倾斜支撑部分的硅基底，形成在硅基底上并与倾斜支撑件抵接的绝缘层和由形成在绝缘层上的导电材料制成的导电层形成梁部分由绝缘层和导电层产生，其中梁部分在梁部分的横向方向上呈现弹簧力，以在梁部分的尖端压靠接触目标时建立接触力。

4. 发明申请

US20020027444A1 Packaging and interconnection of contact structure 失效
标题翻译：接触结构的包装和互连
公开(公告)号：US20020027444A1
公开(公告)日：2002-03-07
申请号：US09929533
申请日：2001-08-13
申请人： Advantest Corp.
发明人： Mark R. Jones , Theodore A. Khoury
IPC分类号： G01R031/02
CPC分类号： G01R1/06744 , G01R3/00 , H01R4/04 , H01R13/2414
摘要： A packaging and interconnection of a contact structure formed of a contact structure made of conductive material and formed on a contact substrate through a micro-fabrication process, a contact pad connected to contact substrate and provided at the bottom surface of the contact substrate, a printed circuit board (PCB) pad provided on a printed circuit board (PCB) substrate to be electrically connected with the contact pad, a conductive member for connecting the contact pad the PCB pad, an elastomer provided under the contact substrate for allowing flexibility in the interconnection and packaging of the contact structure, and a support structure provided between the elastomer and the PCB substrate for supporting the contact structure, contact substrate and elastomer.
摘要翻译：由由导电材料制成的接触结构形成的接触结构和通过微加工工艺在接触基板上形成的接触结构的封装和互连，连接到接触基板并设置在接触基板的底表面处的接触焊盘，印刷设置在与接触焊盘电连接的印刷电路板（PCB）基板上的电路板（PCB）焊盘，用于将接触焊盘连接到PCB焊盘的导电部件，设置在接触基板下方的弹性体，用于允许互连中的灵活性和接触结构的包装，以及设置在弹性体和PCB基板之间的支撑结构，用于支撑接触结构，接触基底和弹性体。

5. 发明申请

US20020089342A1 Method for producing a contact structure 失效
标题翻译：接触结构的制造方法
公开(公告)号：US20020089342A1
公开(公告)日：2002-07-11
申请号：US10058483
申请日：2002-01-28
申请人： Advantest Corp.
发明人： Theodore A. Khoury , Mark R. Jones , James W. Frame
IPC分类号： G01R031/02
CPC分类号： G01R3/00 , G01R1/06711 , G01R1/07342
摘要： A contact structure for testing a semiconductor wafer, a packaged LSI or a printed circuit board is formed on a planar surface of a substrate by a photolithography technology. The contact structure is formed of a silicon base having an inclined support portion created through an anisotropic etching process, an insulation layer formed on the silicon base and abutted from the inclined support, and a conductive layer made of conductive material formed on the insulation layer so that a beam portion is created by the insulation layer and the conductive layer, where wherein the beam portion exhibits a spring force in a transversal direction of the beam portion to establish a contact force when the tip of the beam portion pressed against a contact target.
摘要翻译：通过光刻技术在基板的平面上形成用于测试半导体晶片，封装LSI或印刷电路板的接触结构。接触结构由具有通过各向异性蚀刻工艺形成的倾斜支撑部分的硅基底，形成在硅基底上并与倾斜支撑件抵接的绝缘层和由形成在绝缘层上的导电材料制成的导电层形成梁部分由绝缘层和导电层产生，其中梁部分在梁部分的横向方向上呈现弹簧力，以在梁部分的尖端压靠接触目标时建立接触力。

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