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1. 发明申请

US20130026592A1 FOCAL PLANE ARRAY AND METHOD FOR MANUFACTURING THE SAME 有权
公开(公告)号：US20130026592A1
公开(公告)日：2013-01-31
申请号：US13582120
申请日：2011-03-01
申请人： Adriana Lapadatu , Gjermund Kittilsland
发明人： Adriana Lapadatu , Gjermund Kittilsland
IPC分类号： H01L31/02
CPC分类号： H01L27/1467 , H01L27/14629 , H01L27/14634 , H01L27/1469
摘要： A method of forming a focal plane array by: forming a first wafer having sensing material provided on a surface, which is covered by a sacrificial layer, the sensing material being a thermistor material defining at least one pixel; providing supporting legs for the pixel within the sacrificial layer, covering them with a further sacrificial layer and forming first conductive portions in the surface of the sacrificial layer that are in contact with the supporting legs; forming a second wafer having read-out integrated circuit (ROIC), the second wafer being covered by another sacrificial layer, into which is formed second conductive portions in contact with the ROIC; bringing the sacrificial oxide layers of the first wafer and second wafer together such that the first and second conductive portions are aligned and bonding them together such that the sensing material is transferred from the first wafer to the second wafer when a sacrificial bulk layer of the first wafer is removed; and removing the sacrificial layers to release the pixel, with the supporting legs underneath it.
摘要翻译：一种通过以下方式形成焦平面阵列的方法：形成具有设置在由牺牲层覆盖的表面上的感测材料的第一晶片，所述感测材料是限定至少一个像素的热敏电阻材料; 为牺牲层中的像素提供支撑腿，用另外的牺牲层覆盖它们并在牺牲层的与支撑腿接触的表面中形成第一导电部分; 形成具有读出集成电路（ROIC）的第二晶片，所述第二晶片被另一牺牲层覆盖，所述第二晶片形成与所述ROIC接触的第二导电部分; 使第一晶片和第二晶片的牺牲氧化物层在一起，使得第一和第二导电部分对准并将它们结合在一起，使得当第一晶片和第二晶片的牺牲体积层第一晶片被去除; 并且移除牺牲层以释放像素，其中支撑腿在其下方。

2. 发明申请

US20150206908A1 FOCAL PLANE ARRAY AND METHOD FOR MANUFACTURING THE SAME 审中-公开
公开(公告)号：US20150206908A1
公开(公告)日：2015-07-23
申请号：US14595003
申请日：2015-01-12
申请人： Adriana Lapadatu , Gjermund Kittilsland
发明人： Adriana Lapadatu , Gjermund Kittilsland
IPC分类号： H01L27/146
CPC分类号： H01L27/1467 , H01L27/14625 , H01L27/14632 , H01L27/14636 , H01L27/14683 , H01L27/14685 , H01L27/14687
摘要： A method of forming a focal plane array by: preparing a first wafer having sensing material provided on a surface, which is covered by a sacrificial layer; preparing a second wafer including read-out integrated circuit and a contact pad, which is covered by another sacrificial layer into which are formed support legs in contact with the contact pad, the support legs being covered with a further sacrificial layer; bonding the sacrificial layers of the first and second wafers together such that the sensing material is transferred from the first wafer to the second wafer when a sacrificial bulk layer of the first wafer is removed; defining a pixel in the sensing material and forming a conductive via through the pixel for providing a connection between an uppermost surface of the pixel and the supporting legs; and removing the sacrificial layers to release the pixel, with the supporting legs underneath it.
摘要翻译：一种通过以下步骤形成焦平面阵列的方法：制备具有设置在由牺牲层覆盖的表面上的感测材料的第一晶片; 制备包括读出集成电路和接触焊盘的第二晶片，其被另一牺牲层覆盖，其中形成有与接触焊盘接触的支撑腿，所述支撑腿被另外的牺牲层覆盖; 将第一和第二晶片的牺牲层结合在一起，使得当去除第一晶片的牺牲体层时，感测材料从第一晶片转移到第二晶片; 在所述感测材料中限定像素并形成通过所述像素的导电通孔，以提供所述像素的最上表面与所述支撑腿之间的连接; 并且移除牺牲层以释放像素，其中支撑腿在其下方。

3. 发明授权

US08999813B2 Focal plane array and method for manufacturing the same 有权
标题翻译：焦平面阵列及其制造方法
公开(公告)号：US08999813B2
公开(公告)日：2015-04-07
申请号：US13582120
申请日：2011-03-01
申请人： Adriana Lapadatu , Gjermund Kittilsland
发明人： Adriana Lapadatu , Gjermund Kittilsland
IPC分类号： H01L21/30 , H01L27/146
CPC分类号： H01L27/1467 , H01L27/14629 , H01L27/14634 , H01L27/1469
摘要： A method of forming a focal plane array by: forming a first wafer having sensing material provided on a surface, which is covered by a sacrificial layer, the sensing material being a thermistor material defining at least one pixel; providing supporting legs for the pixel within the sacrificial layer, covering them with a further sacrificial layer and forming first conductive portions in the surface of the sacrificial layer that are in contact with the supporting legs; forming a second wafer having read-out integrated circuit (ROIC), the second wafer being covered by another sacrificial layer, into which is formed second conductive portions in contact with the ROIC; bringing the sacrificial oxide layers of the first wafer and second wafer together such that the first and second conductive portions are aligned and bonding them together such that the sensing material is transferred from the first wafer to the second wafer when a sacrificial bulk layer of the first wafer is removed; and removing the sacrificial layers to release the pixel, with the supporting legs underneath it.
摘要翻译：一种通过以下方式形成焦平面阵列的方法：形成具有设置在由牺牲层覆盖的表面上的感测材料的第一晶片，所述感测材料是限定至少一个像素的热敏电阻材料; 为牺牲层中的像素提供支撑腿，用另外的牺牲层覆盖它们并在牺牲层的与支撑腿接触的表面中形成第一导电部分; 形成具有读出集成电路（ROIC）的第二晶片，所述第二晶片被另一牺牲层覆盖，所述第二晶片形成与所述ROIC接触的第二导电部分; 使第一晶片和第二晶片的牺牲氧化物层在一起，使得第一和第二导电部分对准并将它们结合在一起，使得当第一晶片和第二晶片的牺牲体积层第一晶片被去除; 并且移除牺牲层以释放像素，其中支撑腿在其下方。

4. 发明授权

US08952479B2 Focal plane array and method for manufacturing the same 有权
标题翻译：焦平面阵列及其制造方法
公开(公告)号：US08952479B2
公开(公告)日：2015-02-10
申请号：US13582103
申请日：2011-03-01
申请人： Adriana Lapadatu , Gjermund Kittilsland
发明人： Adriana Lapadatu , Gjermund Kittilsland
IPC分类号： H01L31/058 , H01L27/146
CPC分类号： H01L27/1467 , H01L27/14625 , H01L27/14632 , H01L27/14636 , H01L27/14683 , H01L27/14685 , H01L27/14687
摘要： A method of forming a focal plane array by: preparing a first wafer having sensing material provided on a surface, which is covered by a sacrificial layer; preparing a second wafer including read-out integrated circuit and a contact pad, which is covered by another sacrificial layer into which are formed support legs in contact with the contact pad, the support legs being covered with a further sacrificial layer; bonding the sacrificial layers of the first and second wafers together such that the sensing material is transferred from the first wafer to the second wafer when a sacrificial bulk layer of the first wafer is removed; defining a pixel in the sensing material and forming a conductive via through the pixel for providing a connection between an uppermost surface of the pixel and the supporting legs; and removing the sacrificial layers to release the pixel, with the supporting legs underneath it.
摘要翻译：一种通过以下步骤形成焦平面阵列的方法：制备具有设置在由牺牲层覆盖的表面上的感测材料的第一晶片; 制备包括读出集成电路和接触焊盘的第二晶片，其被另一牺牲层覆盖，其中形成有与接触焊盘接触的支撑腿，所述支撑腿被另外的牺牲层覆盖; 将第一和第二晶片的牺牲层结合在一起，使得当去除第一晶片的牺牲体层时，感测材料从第一晶片转移到第二晶片; 在所述感测材料中限定像素并形成通过所述像素的导电通孔，以提供所述像素的最上表面与所述支撑腿之间的连接; 并且移除牺牲层以释放像素，其中支撑腿在其下方。

5. 发明申请

US20130026596A1 FOCAL PLANE ARRAY AND METHOD FOR MANUFACTURING THE SAME 有权
公开(公告)号：US20130026596A1
公开(公告)日：2013-01-31
申请号：US13582103
申请日：2011-03-01
申请人： Adriana Lapadatu , Gjermund Kittilsland
发明人： Adriana Lapadatu , Gjermund Kittilsland
IPC分类号： H01L31/18 , H01L27/146 , H01L31/09
CPC分类号： H01L27/1467 , H01L27/14625 , H01L27/14632 , H01L27/14636 , H01L27/14683 , H01L27/14685 , H01L27/14687
摘要： A method of forming a focal plane array by: preparing a first wafer having sensing material provided on a surface, which is covered by a sacrificial layer; preparing a second wafer including read-out integrated circuit and a contact pad, which is covered by another sacrificial layer into which are formed support legs in contact with the contact pad, the support legs being covered with a further sacrificial layer; bonding the sacrificial layers of the first and second wafers together such that the sensing material is transferred from the first wafer to the second wafer when a sacrificial bulk layer of the first wafer is removed; defining a pixel in the sensing material and forming a conductive via through the pixel for providing a connection between an uppermost surface of the pixel and the supporting legs; and removing the sacrificial layers to release the pixel, with the supporting legs underneath it.

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